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MMBF170
MOSFET晶体管. 目录. 参数. 数据表 (PDF) 制造商零件编号: MMBF170
种类: MOSFET
沟道类型: N
最大耗散功率 (Pd): 0.3
漏源电压 (Uds): 60V
栅源电压 (Ugs):
最大漏极电流 (Id): 0.5
最大工作温度 (Tj), °C: 150
导通上升时间 (tr):
输出电容 (Cd), pF:
静态的漏源极导通电阻 (Rds), Ohm: 5
封装形式: SOT23
MMBF170
: 代换, 替换 MMBF170
数据表 (PDF)
1.1. mmbf170lt1rev2d.pdf Size:98K _motorola |
| to insure proper solder connection subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.079
2.0
0.035
0.9
0.031
inches
0.8
mm
SOT23
SOT23 POWER DISSIPATION
The power dissipation of the SOT23 is a function of the
SOLDERING PRECAUTIONS
pad size. This can vary from the minimum pad size for
The melting temperature of solder is higher than the rated
soldering to a pad size given for maximum power dissipation.
temperature of the device. When the entire device is heated |
1.2. mmbf170lt1.pdf Size:102K _motorola |
| to insure proper solder connection subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.079
2.0
0.035
0.9
0.031
inches
0.8
mm
SOT23
SOT23 POWER DISSIPATION
The power dissipation of the SOT23 is a function of the
SOLDERING PRECAUTIONS
pad size. This can vary from the minimum pad size for
The melting temperature of solder is higher than the rated
soldering to a pad size given for maximum power dissipation.
temperature of the device. When the entire device is heated |
1.3. bs170_mmbf170.pdf Size:1298K _fairchild_semi |
| Electrical Characteristics (continued)
2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
BS170 / MMBF170 Rev. E2 4
BS170 / MMBF170 N-Channel Enhancement Mode Field Effect Transistor
Typical Electrical Characteristics (continued)
2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
BS170 / MMBF170 Rev. E2 5
BS170 / MMBF170 N-Channel Enhancement Mode Field Effect Transistor
2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
BS170 / MMBF170 |
1.4. mmbf170.pdf Size:126K _diodes |
| . Junction Temperature Fig. 4 On-Resistance vs. Gate-Source Voltage
400
350
300
250
200
150
100
50
0
0 25 50 100 125 150 175 200
75
TA, AMBIENT TEMPERATURE (C)
Fig. 5 Max Power Dissipation vs. Ambient Temperature
2 of 3
June 2008
MMBF170
Diodes Incorporated
www.diodes.com
Document number: DS30104 Rev. 10 - 2
DS(ON)
R
, NORMALIZED
D
I , DRAIN-SOURCE CURRENT (A)
DRAIN-SOURCE ON-RESISTANCE
DS(ON)
DS(ON)
R
, NORMALIZED
R
, NORMALIZED
DRAIN-SOURCE ON-RESISTAN |
1.5. mmbf170lt1-d.pdf Size:77K _onsemi |
| tics
8 30
15
QT
TJ = 25C
7
25
12.5
6
20
10
5
VGS
VDS
4 15
7.5
3
Qgs
Qgd
10
5
VGS = 4.5 V
2
ID = 0.5 A
5
2.5
1 TJ = 25C
VGS = 10 V
0 0
0
0.15 0.25 0.35 0.45 0.55 0.65 0.75 0.85 0 0.5 1 1.5 2
ID, DRAIN CURRENT (A) Qg, TOTAL GATE CHARGE (nC)
Figure 5. On-Resistance vs. Drain Current and Figure 6. Gate-to-Source and
Gate Voltage Drain-to-Source Voltage vs. Total Charge
0.24
VGS = 0 V
0.22
TJ = 25C
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
|
其他MOSET晶体管: LS3955
, LS3956
, LS3958
, MEM554
, MEM554C
, MEM564C
, MEM610
, MEM614
, IRFP240
, MNT-LB32N16
, MNT-LB32N16-C4
, MNT-LB32N20
, MNT-LB32N20-C4
, MTB30N06VL
, MTB30P06V
, MTB35N06ZL
, MTP10N10M
.
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