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SSM6K22FE
MOSFET. Höchstzulässige Werte. Charakteristische Werte. Datenblatt. Typenbezeichnung: SSM6K22FE
Typ von Feldeffekttransistors: MOSFET
Kanaltyp: N
Gesamt-Verlustleistung (Pd):
Maximale Drain-Source-Spannung (Uds): 20V
Maximale Gate-Source-Spannung (Ugs): 12
Maximaler Drainstrom (Id): 1.4
Höchste Sperrschichttemperatur (Tj), °C:
Anstiegszeit (tr):
Drain-Kapazität (Cd), pF:
Ausgangswiderstand (Rds), Ohm: 0.17
Transistorgehäuse: SOT563/ES6
Ersatz (vergleichstyp) für SSM6K22FE
Transistor SSM6K22FE
- PDF-Dokument zum Download bereitstellen...
1.1. ssm6k22fe.pdf Size:278K _toshiba |
| otected against static electricity. Operators should wear anti-static clothing, and containers and other objects
that come into direct contact with devices should be made of anti-static materials.
1 2004-01-16
SSM6K22FE
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
- -
Gate leakage current IGSS VGS = ±?12 V, VDS = 0 ±1 µA
V (BR) DSS ID = 1 mA, VGS = 0 20 - -
Drain-Source breakdown voltage V
V (BR) DSX ID = 1 mA, VGS = -12 V 12 |
4.1. ssm6k204fe_071101.pdf Size:197K _toshiba |
| t/voltage, etc.) are within the
JEDEC ?
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the
JEITA ?
Toshiba Semiconductor Reliability Handbook (“Handling
TOSHIBA 2-2N1A
Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure
Weight: 3 mg (typ.)
rate, etc).
Note 1: Mounted on an FR4 board
(25.4 mm ? 25.4 mm ? 1.6 t, Cu Pad: 645 mm2)
Electrical Characteristics (Ta |
4.2. ssm6k203fe_071101.pdf Size:198K _toshiba |
| re/current/voltage, etc.) are within the
absolute maximum ratings.
JEITA ?
Please design the appropriate reliability upon reviewing the
TOSHIBA 2-2N1A
Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual
Weight: 3 mg (typ.)
reliability data (i.e. reliability test report and estimated failure
rate, etc).
Note 1: Mounted on an FR4 board
(25.4 mm ? 25.4 mm ? 1.6 t, Cu Pad: 645 mm2)
Electrical Characteristics (Ta = |
4.3. ssm6k24fe.pdf Size:153K _toshiba |
| he environment is
protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other objects
that come into direct contact with devices should be made of anti-static materials.
1 2004-06-02
0.2±0.05
0.5
0.5
1.6±0.05
1.0±0.05
0.12±0.05
0.55±0.05
SSM6K24FE
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Gate leakage current IGSS VGS = ±?12 V, VDS = 0 ? ? ±1 µA
V (BR) DSS ID = 1 mA, |
4.4. ssm6k202fe.pdf Size:244K _toshiba |
| mA, VGS = –12 V 18 ? ? V
Drain cutoff current IDSS VDS = 30 V, VGS = 0 ? ? 1 µA
Gate leakage current IGSS VGS = ± 12 V, VDS = 0 ? ? ±1 µA
Gate threshold voltage Vth VDS = 3 V, ID = 1 mA 0.4 ? 1.0 V
Forward transfer admittance ?Yfs? VDS = 3 V, ID = 1.5 A (Note2) 3.9 7.8 ? S
ID = 1.5 A, VGS = 4.0 V (Note2) ? 66 85
Drain–source ON-resistance RDS (ON) m?
ID = 1.0 A, VGS = 2.5 V (Note2) ? 78 101
ID = 0.5 A, VGS = 1.8 V (Note2) ? 95 145
Input capacitance Ciss VDS = 10 V, VGS = 0, f = 1 MHz |
4.5. ssm6k210fe_080204.pdf Size:202K _toshiba |
| etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on an FR4 board
(25.4 mm ? 25.4 mm ? 1.6 mm, Cu Pad: 645 mm2)
Marking Equivalent Circuit (top view)
6 5 4
6 5 4
NP
1 2 3
1 2 3
1 2008-02-04
SSM6K210FE
E |
4.6. ssm6k211fe_081121.pdf Size:197K _toshiba |
| nditions (i.e.
Weight: 3 mg (typ.)
operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Note 1: Mounted on an FR4 board
(25.4 mm ? 25.4 mm ? 1.6 mm, Cu Pad: 645 mm2)
Marking Equivalent Circuit |
4.7. ssm6k25fe.pdf Size:154K _toshiba |
| a circuit board), be sure that the environment is
protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other objects
that come into direct contact with devices should be made of anti-static materials.
1 2004-06-02
0.2±0.05
0.5
0.5
1.6±0.05
1.0±0.05
0.12±0.05
0.55±0.05
SSM6K25FE
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Gate leakage current IGSS VGS = ±12V, VDS = 0 ? |
4.8. ssm6k208fe_071113.pdf Size:189K _toshiba |
| g temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on FR4 board.
(25.4 mm ? 25.4 mm ? 1.6mm, Cu Pad: 645 mm2 )
1 2007-11-13
SSM6K208FE
Electrical Characteristics (Ta = 25°C)
Charac |
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