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2SK1930
MOSFET. Höchstzulässige Werte. Charakteristische Werte. Datenblatt. Typenbezeichnung: 2SK1930
Typ von Feldeffekttransistors: MOSFET
Kanaltyp: N
Gesamt-Verlustleistung (Pd): 80
Maximale Drain-Source-Spannung (Uds): 1000V
Maximale Gate-Source-Spannung (Ugs):
Maximaler Drainstrom (Id): 4
Höchste Sperrschichttemperatur (Tj), °C:
Anstiegszeit (tr):
Drain-Kapazität (Cd), pF:
Ausgangswiderstand (Rds), Ohm:
Transistorgehäuse: TO220FL/SM
Ersatz (vergleichstyp) für 2SK1930
Transistor 2SK1930
- PDF-Dokument zum Download bereitstellen...
1.1. 2sk1930.pdf Size:381K _toshiba |
| (ch–a) 83.3 °C / W
ambient
Note 1: Please use devices on condition that the channel temperature is
below 150°C.
This transistor is an electrostatic sensitive device.
Please handle with caution.
JEDEC ?
JEITA ?
TOSHIBA 2-10S2B
Weight: 1.5 g (typ.)
1 2002-09-02
2SK1930
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Gate leakage current IGSS VGS = ±20 V, VDS = 0 V — — ±100 nA
Drain cut-off current IDSS VDS = 800 V, VGS = 0 |
4.1. 2sk1934.pdf Size:82K _renesas |
| (BR)DSS 1000 — — V ID = 10 mA, VGS = 0
Gate to source breakdown voltage V ±30 — — V I = ±100 µA, V = 0
(BR)GSS G DS
Gate to source leak current IGSS — — ±10 µA VGS = ±25 V, VDS = 0
Zero gate voltage drain current I — — 250 µA V = 800 V, V = 0
DSS DS GS
Gate to source cutoff voltage VGS(off) 2.0 — 3.0 V ID = 1 mA, VDS = 10 V
Static drain to source on state R — 1.2 1.6 ? I = 4 A, V = 10 V*3
DS(on) D GS
resistance
Forward transfer admittance |yfs| 4 6 — S ID = 4 A, VDS = 20 V*3
I |
4.2. rej03g0984_2sk1933ds.pdf Size:96K _renesas |
| and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyr |
4.3. 2sk1933.pdf Size:82K _renesas |
| DSS 900 — — V ID = 10 mA, VGS = 0
Gate to source breakdown voltage V(BR)GSS ±30 — — V IG = ±100 µA, VDS = 0
Gate to source leak current IGSS — — ±10 µA VGS = ±25 V, VDS = 0
Zero gate voltage drain current IDSS — — 250 µA VDS = 720 V, VGS = 0
Gate to source cutoff voltage VGS(off) 2.0 — 3.0 V ID = 1 mA, VDS = 10 V
Static drain to source on state RDS(on) — 0.9 1.2 ? ID = 5 A, VGS = 10 V*1
resistance
Forward transfer admittance |yfs| 4.5 7 — S ID = 5 A, VDS = 20 V*1
Input capacitanc |
4.4. 2sk1938.pdf Size:244K _fuji |
| c =25°C unless otherwise specified)
Min. Typ. Max. Units
Item Symbol
Test Conditions
Drain-source breakdown voltage V(BR)DSS ID=1mA VGS=0V
500 V
Gate threshold voltage VGS(th) ID=1mA VDS=VGS 2.5 3.0 3.5 V
Zero gate voltage drain current IDSS VDS=500V VGS=0V Tch=25°C 10 500
µA
Tch=125°C 0.2 1.0
mA
Gate-source leakage current IGSS 10 100
VGS=±30V VDS=0V nA
Drain-source on-state resistance RDS(on) 0.25 0.35
ID=9A VGS=10V
?
Forward transconductance gfs 9.0 18.0
ID=9A VDS=25V S
Inpu |
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