IRF840
MOSFET. Höchstzulässige Werte. Charakteristische Werte. Datenblatt. Typenbezeichnung: IRF840
Typ von Feldeffekttransistors: MOSFET
Kanaltyp: N
Gesamt-Verlustleistung (Pd): 125
Maximale Drain-Source-Spannung (Uds): 500V
Maximale Gate-Source-Spannung (Ugs): 20
Maximaler Drainstrom (Id): 8
Höchste Sperrschichttemperatur (Tj), °C: 150
Anstiegszeit (tr):
Drain-Kapazität (Cd), pF: 1500
Ausgangswiderstand (Rds), Ohm: 0.85
Transistorgehäuse: TO220
Ersatz (vergleichstyp) für IRF840
Transistor IRF840
- PDF-Dokument zum Download bereitstellen...
1.1. irf840_1.pdf Size:60K _philips |
|
VGS Gate-source voltage - ± 30 V
ID Continuous drain current Tmb = 25 ?C; VGS = 10 V - 8.5 A
Tmb = 100 ?C; VGS = 10 V - 5.4 A
IDM Pulsed drain current Tmb = 25 ?C - 34 A
PD Total dissipation Tmb = 25 ?C - 147 W
Tj, Tstg Operating junction and - 55 150 ?C
storage temperature range
AVALANCHE ENERGY LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
EAS Non-repetitive avalanche Unclamped inductive load, IAS |
1.2. irf840.pdf Size:360K _st |
| (continuous) at TC = 100°C 5.1 A
IDM ( ) Drain Current (pulsed) 32 A
PTOT Total Dissipation at TC = 25°C 125 W
Derating Factor 1.0 W/°C
dv/dt (1) Peak Diode Recovery voltage slope 3.5 V/ns
Tstg Storage Temperature –65 to 150 °C
Tj Max. Operating Junction Temperature 150 °C
(1)ISD ?8A, di/dt ?50A/µs, VDD ? V(BR)DSS, Tj ? TJMAX.
(•)Pulse width limited by safe operating area
June 2003 1/8
NEW DATASHEET ACCORDING TO PCN_DSG_2C14 - MARKING: IRF840@
Obsolete Product(s) - Obsolete Product(s) |
1.3. irf840f.pdf Size:188K _st |
| tion at Tc = 25 C 125 40 W
Derating Factor 1 0.32 W/oC
VISO Insulation Withstand Voltage (DC) ? 2000
o
T Storage Temperature -65 to 150 C
st g
o
Tj Max. Operating Junction Temperature 150 C
(•) Pulse width limited by safe operating area
May 1993 1/10
IRF840/FI - IRF841/FI
THERMAL DATA
TO-220 ISOWATT220
o
R Thermal Resistance Junction-case Max 1 3.12 C/W
thj-case
o
R Thermal Resistance Junction-ambient Max 62.5 C/W
thj-amb
o
R Thermal Resistance Case-sink Typ 0.5 C/W
th c-s
|
1.4. irf840a.pdf Size:99K _st |
| ion at Tc = 25 C 125 40 W
Derating Factor 1 0.32 W/oC
VISO Insulation Withstand Voltage (DC) ? 2000
o
T Storage Temperature -65 to 150 C
st g
o
Tj Max. Operating Junction Temperature 150 C
(•) Pulse width limited by safe operating area
May 1993 1/10
IRF840/FI - IRF841/FI
THERMAL DATA
TO-220 ISOWATT220
o
R Thermal Resistance Junction-case Max 1 3.12 C/W
thj-case
o
R Thermal Resistance Junction-ambient Max 62.5 C/W
thj-amb
o
R Thermal Resistance Case-sink Typ 0.5 C/W
th c-s
|
1.5. irf840,841(th).pdf Size:188K _st |
| tion at Tc = 25 C 125 40 W
Derating Factor 1 0.32 W/oC
VISO Insulation Withstand Voltage (DC) ? 2000
o
T Storage Temperature -65 to 150 C
st g
o
Tj Max. Operating Junction Temperature 150 C
(•) Pulse width limited by safe operating area
May 1993 1/10
IRF840/FI - IRF841/FI
THERMAL DATA
TO-220 ISOWATT220
o
R Thermal Resistance Junction-case Max 1 3.12 C/W
thj-case
o
R Thermal Resistance Junction-ambient Max 62.5 C/W
thj-amb
o
R Thermal Resistance Case-sink Typ 0.5 C/W
th c-s
|
1.6. irf840b.pdf Size:911K _fairchild_semi |
|
8.0 8.0 A
- Continuous (TC = 100°C)
5.1 5.1 A
IDM (Note 1) 32 32 A
Drain Current - Pulsed
VGSS
Gate-Source Voltage ± 30 V
EAS (Note 2) 320 mJ
Single Pulsed Avalanche Energy
IAR (Note 1) 8.0 A
Avalanche Current
EAR (Note 1) 13.4 mJ
Repetitive Avalanche Energy
dv/dt Peak Diode Recovery dv/dt (Note 3) 3.5 V/ns
PD Power Dissipation (TC = 25°C)
134 44 W
- Derate above 25°C 1.08 0.35 W/°C
TJ, TSTG
Operating and Storage Temperature Range -55 to +150 °C
Maximum lead temperature for s |
1.7. irf840lc.pdf Size:194K _international_rectifier 1.8. irf840spbf.pdf Size:666K _international_rectifier |
| NAL)
LOT CODE
YE AR 0 = 2000
WE E K 02
A = AS S E MB L Y S IT E COD E
Document Number: 91071 www.vishay.com
8
IRF840SPbF
D2Pak Tape & Reel Information
Dimensions are shown in millimeters (inches)
TRR
1.60 (.063)
1.50 (.059)
1.60 (.063)
4.10 (.161)
1.50 (.059)
0.368 (.0145)
3.90 (.153)
0.342 (.0135)
FEED DIRECTION 11.60 (.457)
1.85 (.073)
11.40 (.449)
1.65 (.065)
24.30 (.957)
15.42 (.609)
23.90 (.941)
15.22 (.601)
TRL
1.75 (.069)
10.90 (.429) 1.25 (.049)
4.72 (.136) |
1.9. irf840lcspbf_irf840lclpbf.pdf Size:458K _international_rectifier |
| CODE
YE AR 0 = 2000
WE EK 02
A = ASSEMBLY SITE CODE
Document Number: 91068 www.vishay.com
8
IRF840LCS/LPbF
TO-262 Package Outline
Dimensions are shown in millimeters (inches)
TO-262 Part Marking Information
EXAMPLE: THIS IS AN IRL3103L
LOT CODE 1789 PART NUMBER
INT ERNATIONAL
AS S EMBL ED ON WW 19, 1997
RECT IFIER
IN THE AS S EMBLY LINE "C"
LOGO
DAT E CODE
Note: "P" in as sembly line
YEAR 7 = 1997
pos ition indicates "Lead-Free"
ASSEMBLY
WEEK 19
LOT CODE
LINE C
OR
PAR |
1.10. irf840s.pdf Size:172K _international_rectifier 1.11. irf840lcpbf.pdf Size:986K _international_rectifier |
| .022)
3X
3X
0.69 (.027)
0.46 (.018)
1.40 (.055)
3X
1.15 (.045) 0.36 (.014) M B A M
2.92 (.115)
2.64 (.104)
2.54 (.100)
2X
NOTES:
1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 3 OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB.
2 CONTROLLING DIMENSION : INCH 4 HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS.
TO-220AB Part Marking Information
EXAMPLE: T HIS IS AN IRF 1010
LOT CODE 1789
PART NU MB E R
AS S E MB L E D ON WW 19, 1997 INT E RNAT IONAL
IN THE ASSEMBLY LINE "C" |
1.12. irf840.pdf Size:170K _international_rectifier 1.13. irf840as.pdf Size:129K _international_rectifier |
| ical SMPS Topologies
Two Transistor Forward
Haft Bridge
Full Bridge
Notes through are on page 10
www.irf.com 1
12/16/99
IRF840AS/L
Static @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 500 ––– ––– V VGS = 0V, ID = 250µA
?V(BR)DSS/?TJ Breakdown Voltage Temp. Coefficient ––– 0.58 ––– V/°C Reference to 25°C, ID = 1mA
RDS(on) Static Drain-to-Source On-Resistance ––– ––– 0.85 ? VGS = 10V, ID = 4.8A
VGS(t |
1.14. irf840aspbf_irf840alpbf.pdf Size:673K _international_rectifier |
| .6mm from case )
Typical SMPS Topologies
Two Transistor Forward
Haft Bridge
Full Bridge
Notes through are on page 10 04/21/04
Document Number: 91066 www.vishay.com
1
IRF840AS/LPbF
Static @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 500 ––– ––– V VGS = 0V, ID = 250µA
?V(BR)DSS/?TJ Breakdown Voltage Temp. Coefficient ––– 0.58 ––– V/°C Reference to 25°C, ID = 1mA
RDS(on) Static Drain-to-Source |
1.15. irf840a.pdf Size:199K _international_rectifier |
| n (1.1N•m)
Typical SMPS Topologies:
l Two Transistor Forward
l Haft Bridge
l Full Bridge
11/11/03
Document Number: 91065 www.vishay.com
1
IRF840APbF
Static @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 500 ––– ––– V VGS = 0V, ID = 250µA
?V(BR)DSS/?TJ Breakdown Voltage Temp. Coefficient ––– 0.58 ––– V/°C Reference to 25°C, ID = 1mA
RDS(on) Static Drain-to-Source On-Resistance ––– ––– 0.85 ? VGS = 10V, I |
1.16. irf840pbf.pdf Size:1086K _international_rectifier |
|
1.15 (.045) 0.36 (.014) M B A M
2.92 (.115)
2.64 (.104)
2.54 (.100)
2X
NOTES:
1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 3 OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB.
2 CONTROLLING DIMENSION : INCH 4 HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS.
TO-220AB Part Marking Information
EXAMPLE: T HIS IS AN IRF 1010
LOT CODE 1789
PART NUMB E R
AS S E MB L E D ON WW 19, 1997 INT E RNAT IONAL
IN THE ASSEMBLY LINE "C" RE CT IF IE R
LOGO
Note: "P" in assembly line
DAT E CO |
1.17. irf840lcs.pdf Size:173K _international_rectifier |
| signer a new power
transistor standard for switching applications.
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 8.0
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 5.1 A
IDM Pulsed Drain Current 28
PD @TA = 25°C Power Dissipation 3.1 W
PD @TC = 25°C Power Dissipation 125 W
Linear Derating Factor 1.0 W/°C
VGS Gate-to-Source Voltage ± 30 V
EAS Single Pulse Avalanche Energy‚ 510 mJ
IAR Avalanche Current 8.0 A
EAR Repetitive Avalan |
1.18. irf840a.pdf Size:941K _samsung |
| s, 1/8 ” from case for 5-seconds
Thermal Resistance
Symbol Characteristic Typ. Max. Units
R ?
Junction-to-Case -- 0.93
JC
o
R ?
Case-to-Sink 0.5 -- /W
CS C
R ?
Junction-to-Ambient -- 62.5
JA
N-CHANNEL
POWER MOSFET
Electrical Characteristics (TA=25 oC unless otherwise specified)
Symbol Characteristic Min. Typ. Max. Units Test Condition
BVDSS µ
VGS=0V,ID=250 A
Drain-Source Breakdown Voltage 60 -- -- V
o
?BV/ ?TJ µA
C ID=250 See Fig 7
Breakdown Voltage Temp. Coeff. |
1.19. irf840l_sihf840l.pdf Size:161K _vishay |
| TO-262)
Lead (Pb)-free and Halogen-free SiHF840L-GE3
IRF840LPbF
Lead (Pb)-free
SiHF840L-E3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDS 500 V
Gate-Source Voltage VGS ± 20 V
TC = 25 °C 8.0
Continuous Drain Current VGS at 10 V ID
TC = 100 °C 5.1 A
Pulsed Drain Currenta IDM 32
Linear Derating Factor 1.0 W/°C
Single Pulse Avalanche Energyb EAS 510 mJ
Repetitive Avalanche Currenta IAR 8.0 A
Repetitive Avalanche E |
1.20. irf840lc_sihf840lc.pdf Size:197K _vishay |
| ovements combined with the proven
N-Channel MOSFET
ruggedness and reliability that are characteristic of Power
MOSFETs offer the designer a new standard in power
transistors for switching applications.
ORDERING INFORMATION
Package TO-220AB
IRF840LCPbF
Lead (Pb)-free
SiHF840LC-E3
IRF840LC
SnPb
SiHF840LC
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDS 500
V
Gate-Source Voltage VGS ± 30
TC = 25 °C 8.0
Continuous |
1.21. irf840a_sihf840a.pdf Size:206K _vishay |
| Drain Current VGS at 10 V ID
TC = 100 °C 5.1 A
Pulsed Drain Currenta IDM 32
Linear Derating Factor 1.0 W/°C
Single Pulse Avalanche Energyb EAS 510 mJ
Repetitive Avalanche Currenta IAR 8.0 A
Repetitive Avalanche Energya EAR 13 mJ
Maximum Power Dissipation TC = 25 °C PD 125 W
Peak Diode Recovery dV/dtc dV/dt 5.0 V/ns
Operating Junction and Storage Temperature Range TJ, Tstg - 55 to + 150
°C
Soldering Recommendations (Peak Temperature) for 10 s 300d
10 lbf · in
Mounting Torque |
1.22. irf840_sihf840.pdf Size:195K _vishay |
| MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDS 500 V
Gate-Source Voltage VGS ± 20 V
TC = 25 °C 8.0
Continuous Drain Current VGS at 10 V ID
TC = 100 °C 5.1 A
Pulsed Drain Currenta IDM 32
Linear Derating Factor 1.0 W/°C
Single Pulse Avalanche Energyb EAS 510 mJ
Repetitive Avalanche Currenta IAR 8.0 A
Repetitive Avalanche Energya EAR 13 mJ
Maximum Power Dissipation TC = 25 °C PD 125 W
Peak Diode Recovery dV/dtc dV/dt 3.5 V |
1.23. irf840.pdf Size:141K _inchange_semiconductor |
|
isc N-Channel Mosfet Transistor IRF840
ELECTRICAL CHARACTERISTICS
TC=25? unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN MAX UNIT
V(BR)DSS Drain-Source Breakdown Voltage VGS= 0; ID= 0.25mA 500 V
Gate Threshold Voltage VDS= VGS; ID= 0.25mA 2 4 V
VGS(th)
Drain-Source On-Resistance VGS= 10V; ID= 4A 0.85 ?
RDS(on)
IGSS Gate-Body Leakage Current VGS= ±20V;VDS= 0 ±500 nA
IDSS Zero Gate Voltage Drain Current VDS= 500V; VGS=0 250 nA
VSD Forward On-Voltage IS= 8A; VGS=0 2. |
Anderen MOSET... IRF830AL
, IRF830AS
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, IRF830S
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, IRF831FI
, IRF832
, IRF833
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, IRF840A
, IRF840A
, IRF840AS
, IRF840FI
, IRF840S
, IRF841
, IRF841FI
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.
|