ZXTP2014Z . Höchstzulässige Werte. Charakteristische Werte. Datenblatt.

Typenbezeichnung: ZXTP2014Z

Werkstoff: Si

Polarity: PNP

Gesamt-Verlustleistung (Pc): 2.1

Kollektor-Basis-Sperrspannung (Ucb): 0

Kollektor-Emitter-Sperrspannung (Uce): 140

Emitter-Basis-Sperrspannung (Ueb): 0

Kollektorstrom (Ic): 3

Höchste Sperrschichttemperatur (Tj), °C:

Transitfrequenz (ft): 120

Kollektor-Kapazität (Cc), pF:

Kurzschluss-Stromverstärkung (hfe): 100

Transistorgehäuse: SOT89

Ersatz (vergleichstyp) für ZXTP2014Z

ZXTP2014Z - PDF-Dokument zum Download bereitstellen...

1.1. zxtp2014z.pdf Size:111K _diodes

-10 A (a) Power dissipation at TA=25°C PD 1.5 W Linear derating factor 12 mW/°C (b) Power dissipation at TA=25°C PD 2.1 W Linear derating factor 16.8 mW/°C Operating and storage temperature range Tj, Tstg -55 to 150 °C THERMAL RESISTANCE PARAMETER SYMBOL LIMIT UNIT Junction to ambient(a) R JA 83 °C/W Junction to ambient(b) R JA 60 °C/W NOTES: (a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) F

2.1. zxtp2014g.pdf Size:114K _diodes

pulse current ICM -10 A (a) Power dissipation at TA =25°C PD 3.0 W Linear derating factor 24 mW/°C (b) Power dissipation at TA =25°C PD 1.6 W Linear derating factor 12.8 mW/°C Operating and storage temperature range Tj, Tstg -55 to 150 °C THERMAL RESISTANCE PARAMETER SYMBOL VALUE UNIT (a) Junction to ambient R JA 42 °C/W (b) Junction to ambient R JA 78 °C/W NOTES (a) For a device surface mounted on 52mm x 52mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still

3.1. zxtp2013z.pdf Size:95K _diodes

r dissipation at TA=25°C PD 1.5 W Linear derating factor 12 mW/°C (b) Power dissipation at TA=25°C PD 2.1 W Linear derating factor 16.8 mW/°C Operating and storage temperature range Tj, Tstg -55 to 150 °C THERMAL RESISTANCE PARAMETER SYMBOL LIMIT UNIT Junction to ambient(a) R JA 83 °C/W Junction to ambient(b) R JA 60 °C/W NOTES: (a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) For a device surf

3.2. zxtp2012a.pdf Size:124K _diodes

.5 A Peak pulse current ICM -15 A (a) Practical power dissipation at TA =25°C PD 1.0 W Linear derating factor 8 mW/°C (b) Power dissipation at TA =25°C PD 0.71 W Linear derating factor 5.7 mW/°C Operating and storage temperature range Tj, Tstg -55 to 150 °C THERMAL RESISTANCE PARAMETER SYMBOL VALUE UNIT (a) Junction to ambient R JA 125 °C/W (b) Junction to ambient R JA 175 °C/W NOTES (a) For a device through hole mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single

3.3. zxtp2012z.pdf Size:125K _diodes

NGS PARAMETER SYMBOL LIMIT UNIT Collector-base voltage BVCBO -100 V Collector-emitter voltage BVCEO -60 V Emitter-base voltage BVEBO -7 V (a) Continuous collector current IC -4.3 A Peak pulse current ICM -15 A (a) Power dissipation at TA =25°C PD 1.5 W Linear derating factor 12 mW/°C (b) Power dissipation at TA =25°C PD 2.1 W Linear derating factor 16.8 mW/°C Operating and storage temperature range Tj, Tstg -55 to +150 °C THERMAL RESISTANCE PARAMETER SYMBOL VALUE UNIT (a) Junct

3.4. zxtp2012g.pdf Size:127K _diodes

e BVCBO -100 V Collector-emitter voltage BVCEO -60 V Emitter-base voltage BVEBO -7 V Continuous collector current IC -5.5 A Peak pulse current ICM -15 A (a) Power dissipation at TA =25°C PD 3.0 W Linear derating factor 24 mW/°C (b) Power dissipation at TA =25°C PD 1.6 W Linear derating factor 12.8 mW/°C Operating and storage temperature range Tj, Tstg -55 to +150 °C THERMAL RESISTANCE PARAMETER SYMBOL VALUE UNIT (a) Junction to ambient R JA 42 °C/W NOTES (a) For a device surface

3.5. zxtp2013g.pdf Size:125K _diodes

t IC -5 A Peak pulse current ICM -10 A (a) Power dissipation at TA =25°C PD 3.0 W Linear derating factor 24 mW/°C (b) Power dissipation at TA =25°C PD 1.6 W Linear derating factor 12.8 mW/°C Operating and storage temperature range Tj, Tstg -55 to +150 °C THERMAL RESISTANCE PARAMETER SYMBOL VALUE UNIT (a) Junction to ambient R JA 42 °C/W NOTES (a) For a device surface mounted on 52mm x 52mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions. (b)

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