MMPQ3762
- Les principales caractéristique des transistors bipolaires. Caractéristiques techniques. Répertoire mondial des transistors. Marquage composant: MMPQ3762
Matériau utilisé: Si
Polarité du transistor: PNP
Puissance dissipable maximale pour une température du boitier de 25°C (Pc): 1.4
Tension collecteur–base (maximale) Ucb: 40
Tension maximale de VCE au delà de laquelle le transistor risque d'être détruit (Uce): 40
Tension émetteur–base (maximale) Ueb: 5
Courant collecteur maximal (Ic): 1.5
Température maximale de jonction (Tj), °C: 150
Fréquence maximale de fonctionnement fT: 275
Capacite collecteur (Cc), pF: 9
Gain en courant DC hFE (hfe): 30
Boitier: SOP16
Recherche équivalences (un remplaçant pour le transistor MMPQ3762
) MMPQ3762
- Fiche technique PDF, Datasheet
4.1. mmpq3725.pdf  Size:111K _motorola  |
 | 0.275
0.155
7.0
4.0
0.024 0.050
0.6 1.270
inches
mm
SO–16
SO–16 POWER DISSIPATION
The power dissipation of the SO–16 is a function of the
SOLDERING PRECAUTIONS
pad size. This can vary from the minimum pad size for
The melting temperature of solder is higher than the rated
soldering to a pad size given for maximum power dissipation.
temperature of the device. When the entire device is heated
Power dissipation for a surface mount device is determined
to a high temperature, failure |
5.1. mmpq3467.pdf Size:111K _motorola  |
 |
inches
mm
SO–16
SO–16 POWER DISSIPATION
The power dissipation of the SO–16 is a function of the
SOLDERING PRECAUTIONS
pad size. This can vary from the minimum pad size for
The melting temperature of solder is higher than the rated
soldering to a pad size given for maximum power dissipation.
temperature of the device. When the entire device is heated
Power dissipation for a surface mount device is determined
to a high temperature, failure to complete soldering within a
by TJ(max), th |
5.2. ffb3906_fmb3906_mmpq3906.pdf Size:84K _fairchild_semi  |
 | 2.0%
NOTE: All voltages (V) and currents (A) are negative polarity for PNP transistors.
Spice Model
PNP (Is=1.41f Xti=3 Eg=1.11 Vaf=18.7 Bf=180.7 Ne=1.5 Ise=0 Ikf=80m Xtb=1.5 Br=4.977 Nc=2 Isc=0 Ikr=0
Rc=2.5 Cjc=9.728p Mjc=.5776 Vjc=.75 Fc=.5 Cje=8.063p Mje=.3677 Vje=.75 Tr=33.42n Tf=179.3p Itf=.4 Vtf=4
Xtf=6 Rb=10)
FFB3906 / FMB3906 / MMPQ3906
PNP Multi-Chip General Purpose Amplifier
(continued)
Typical Characteristics
Collector-Emitter Saturation
Typical Pulsed Current Gain
Volta |
5.3. ffb3904_fmb3904_mmpq3904.pdf Size:98K _fairchild_semi  |
 | lse Width ? 300 µs, Duty Cycle ? 2.0%
NOTE: All voltages (V) and currents (A) are negative polarity for PNP transistors.
FFB3904 / FMB3904 / MMPQ3904
NPN Multi-Chip General Purpose Amplifier
(continued)
Typical Characteristics
Typical Pulsed Current Gain
Collector-Emitter Saturation
vs Collector Current
Voltage vs Collector Current
500
V CE = 5V
0.15
? = 10
400
125 °C
125 °C
300
0.1
25 °C
200
25 °C
0.05
- 40 °C
100
- 40 °C
0
0.1 1 10 100
0.1 1 10 100
I C - COLLECT |
5.4. mmpq3904-d.pdf Size:41K _diodes  |
 | ISSIPATION
SOLDERING PRECAUTIONS
The power dissipation of the SO–16 is a function of the
pad size. This can vary from the minimum pad size for The melting temperature of solder is higher than the
soldering to a pad size given for maximum power dissipa- rated temperature of the device. When the entire device is
tion. Power dissipation for a surface mount device is deter- heated to a high temperature, failure to complete soldering
mined by TJ(max), the maximum rated junction temperature with |
5.5. mmpq3467.pdf Size:143K _onsemi  |
 | e minimum pad size for sol- The melting temperature of solder is higher than the
rated temperature of the device. When the entire device is
dering to a pad size given for maximum power dissipation.
heated to a high temperature, failure to complete soldering
Power dissipation for a surface mount device is determined
within a short time could result in device failure. There-
by TJ(max), the maximum rated junction temperature of the
fore, the following items should always be observed in or-
|
5.6. mmpq3906.pdf Size:145K _onsemi  |
 | ct size to insure proper solder connection jected to a solder reflow process.
0.060
1.52
0.275
0.155 inches
7.0
4.0
mm
0.024 0.050
0.6 1.270
SO-16
SO-16 POWER DISSIPATION
SOLDERING PRECAUTIONS
The power dissipation of the SO-16 is a function of the
pad size. This can vary from the minimum pad size for sol- The melting temperature of solder is higher than the
rated temperature of the device. When the entire device is
dering to a pad size given for maximum power dissipation.
heate |
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, MMPQ2222A
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.
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