| |
IRFP4321
MOSFET transistor datasheet. Parameters and characteristics. Type Designator: IRFP4321
Type of IRFP4321
transistor: MOSFET
Type of control channel: N
-Channel Maximum power dissipation (Pd), W: 310
Maximum drain-source voltage |Uds|, V: 150V
Maximum gate-source voltage |Ugs|, V: 30
Maximum drain current |Id|, A: 78
Maximum junction temperature (Tj), °C:
Rise Time of IRFP4321
transistor (tr), nS:
Drain-source Capacitance (Cd), pF:
Maximum drain-source on-state resistance (Rds), Ohm: 0.0155
Package: TO247AC
Equivalent transistors for IRFP4321
IRFP4321
PDF documents for downloads:
5.1. irfp460.pdf Size:91K _st |
| IRFP460
?
N - CHANNEL 500V - 0.22 ? - 20 A - TO-247
PowerMESH? MOSFET
TYPE VDSS RDS(on) ID
IRFP460 500 V < 0.27 ? 20 A
TYPICAL R = 0.22 ?
DS(on)
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
DESCRIPTION 3
2
This power MOSFET is designed using the 1
company’s consolidated strip layout-based MESH
TO-247
OVERLAY process. This technology matches
?
and improves the performances compared with
standard parts from various sources.
APPLICATIONS
HIGH CURRENT SWITCHING
UNINTERRUPTIBLE POWER SUPPLY (UPS) INTERNAL SCHEMATIC DIAGRAM
DC/DC COVERTERS FOR TELECOM,
INDUSTRIAL, AND LIGHTING EQUIPMENT.
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VDS Drain-source Voltage (VGS = 0) 500 V
VDGR 500 V
Drain- gate Voltage (RGS = 20 k )
?
VGS Gate-source Voltage ± 20 V
o
ID Drain Current (continuous) at Tc = 25 C20 A
o
ID Drain Current (continuous) at Tc = 100 C13 A
IDM(•) Drain Current (pulsed) 8 |
5.2. irfp450.pdf Size:276K _st |
| IRFP450
N-CHANNEL 500V - 0.31? - 14A TO-247
PowerMesh™II MOSFET
TYPE VDSS RDS(on) ID
IRFP450 500V < 0.38? 14 A
TYPICAL RDS(on) = 0.31?
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
3
GATE CHARGE MINIMIZED 2
1
TO-247
DESCRIPTION
The PowerMESH™II is the evolution of the first
generation of MESH OVERLAY™. The layout re-
finements introduced greatly improve the Ron*area
figure of merit while keeping the device at the lead-
INTERNAL SCHEMATIC DIAGRAM
ing edge for what concerns switching speed, gate
charge and ruggedness.
APPLICATIONS
SWITCH MODE POWER SUPPLIES (SMPS)
HIGH CURRENT, HIGH SPEED SWITCHING
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VDS Drain-source Voltage (VGS = 0) 500 V
VDGR Drain-gate Voltage (RGS = 20 k?) 500 V
VGS Gate- source Voltage ±30 V
ID Drain Current (continuos) at TC = 25°C 14 A
ID Drain Cur |
5.3. irfp460c.pdf Size:770K _fairchild_semi |
| February 2002
IRFP460C
500V N-Channel MOSFET
General Description Features
These N-Channel enhancement mode power field effect • 20A, 500V, RDS(on) = 0.24? @VGS = 10 V
transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 130nC)
planar stripe, DMOS technology.
• Low Crss ( typical 60 pF)
This advanced technology has been especially tailored to
• Fast switching
minimize on-state resistance, provide superior switching
• 100% avalanche tested
performance, and withstand high energy pulse in the
• Improved dv/dt capability
avalanche and commutation mode. These devices are well
suited for high efficiency switch mode power supplies and
power factor corrections.
D
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?
?
^
^
^
^
^
^
^
^
?
?
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?
G
?
?
?
?
?
?
?
?
TO-3PN
IRFP Series
G D S
S
Absolute Maximum Ratings TC = 25°C unless otherwise noted
Symbol Parameter IRFP460C Units
VDSS
Drain-Source Voltage 500 V
ID
Dr |
5.4. irfp460npbf.pdf Size:161K _international_rectifier |
| PD-94809
SMPS MOSFET
IRFP460NPbF
HEXFET® Power MOSFET
Applications
Switch Mode Power Supply ( SMPS )
VDSS Rds(on) max ID
Uninterruptable Power Supply
500V 0.24? 20A
High speed power switching
Switch Mode Power Supply ( SMPS )
Lead-Free
Benefits
Low Gate Charge Qg results in Simple
Drive Requirement
Improved Gate, Avalanche and dynamic
dv/dt Ruggedness
Fully Characterized Capacitance and
Avalanche Voltage and Current
TO-247AC
Effective Coss specified ( See AN1001)
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 20
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 13 A
IDM Pulsed Drain Current 80
PD @TC = 25°C Power Dissipation 280 W
Linear Derating Factor 2.2 W/°C
VGS Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJ Operating Junction and -55 to + 150
TSTG Storage Temperature Range
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torqe, 6-32 or |
5.5. irfp460as.pdf Size:115K _international_rectifier |
| PD-94011A
SMPS MOSFET
IRFP460AS
HEXFET® Power MOSFET
Applications
SMPS, UPS, Welding and High Speed
VDSS Rds(on) max ID
Power Switching
500V 0.27? 20A
Benefits
Dynamic dv/dt Rating
Repetitive Avalanche Rated
Isolated Central Mounting Hole
Fast Switching
Ease of Paralleling
Simple Drive Requirements
Solder plated and leadformed for surface mounting
Description
Third Generation HEXFET®s from International Rectifier provide the
designer with the best combination of fast switching, ruggedized
SMD-247
device design, low on-resistance and cost-effectiveness.
The TO-247 package is preferred for commercial-industrial
applications where higher power levels preclude the use of TO-220
devices. The TO-247 is similar but superior to the earlier TO-218
package because of its isolated mounting hole. It also provides
greater creepage distance between pins to meet the requirements of
most safety specifications.
This plated and leadformed version of the TO-247 package |
5.6. irfp450a.pdf Size:101K _international_rectifier |
| PD -91884
SMPS MOSFET
IRFP450A
HEXFET® Power MOSFET
Applications
VDSS Rds(on) max ID
Switch Mode Power Supply ( SMPS )
Uninterruptable Power Supply 500V 0.40? 14A
High speed power switching
Benefits
Low Gate Charge Qg results in Simple
Drive Requirement
Improved Gate, Avalanche and Dynamic
dv/dt Ruggedness
Fully Characterized Capacitance and
Avalanche Voltage and Current
G D S
TO-247AC
Effective Coss Specified ( See AN 1001)
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 14
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 8.7 A
IDM Pulsed Drain Current 56
PD @TC = 25°C Power Dissipation 190 W
Linear Derating Factor 1.5 W/°C
VGS Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt 4.1 V/ns
TJ Operating Junction and -55 to + 150
TSTG Storage Temperature Range
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torqe, 6-32 or M3 screw 10 lbf•in (1.1N•m)
Typical SMPS T |
5.7. irfp4710.pdf Size:103K _international_rectifier |
| PD - 94361
IRFP4710
HEXFET® Power MOSFET
Applications
VDSS RDS(on) max ID
High frequency DC-DC converters
100V 0.014? 72A
Motor Control
Uninterruptible Power Supplies
Benefits
Low Gate-to-Drain Charge to Reduce
Switching Losses
Fully Characterized Capacitance Including
Effective COSS to Simplify Design, (See
App. Note AN1001)
TO-247AC
Fully Characterized Avalanche Voltage
and Current
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 72
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 51 A
IDM Pulsed Drain Current 300
PD @TC = 25°C Power Dissipation 190 W
Linear Derating Factor 1.2 W/°C
VGS Gate-to-Source Voltage ± 20 V
dv/dt Peak Diode Recovery dv/dt 8.2 V/ns
TJ Operating Junction and -55 to + 175
TSTG Storage Temperature Range
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torqe, 6-32 or M3 screw 10 lbf•in (1.1N•m)
Thermal Resistance
Parameter Typ. Max. Units
R?JC Junc |
5.8. irfp450lc.pdf Size:159K _international_rectifier |
| PD - 9.1231
IRFP450LC
HEXFET® Power MOSFET
Ultra Low Gate Charge
Reduced Gate Drive Requirement
VDSS = 500V
Enhanced 30V Vgs Rating
Reduced Ciss, Coss, Crss
RDS(on) = 0.40?
Isolated Central Mounting Hole
Dynamic dv/dt Rated
Repetitive Avalanche Rated ID = 14A
Description
This new series of Low Charge HEXFET Power MOSFETs achieve significantly
lower gate charge over conventional MOSFETs. Utilizing advanced Hexfet
technology the device improvements allow for reduced gate drive requirements,
faster switching speeds and increased total system savings. These device
improvements combined with the proven ruggedness and reliability of HEXFETs
offer the designer a new standard in power transistors for switching applications.
The TO-247 package is preferred for commercial-industrial applications where
higher power levels preclude the use of TO-220 devices. The TO-247 is similar
but superior to the earlier TO-218 package because of its isolated mounting hole.
Absolute Maximu |
5.9. irfp450npbf.pdf Size:199K _international_rectifier |
| PD- 95663
SMPS MOSFET
IRFP450NPbF
HEXFET® Power MOSFET
Applications
VDSS Rds(on) max ID
l Switch Mode Power Supply (SMPS)
l Uninterruptible Power Supply 500V 0.37? 14A
l High Speed Power Switching
l Lead-Free
Benefits
l Low Gate Charge Qg results in Simple
Drive Requirement
l Improved Gate, Avalanche and Dynamic
dv/dt Ruggedness
l Fully Characterized Capacitance and
Avalanche Voltage and Current
TO-247AC
l Effective Coss Specified (See AN 1001)
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 14
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 8.8 A
IDM Pulsed Drain Current 56
PD @TC = 25°C Power Dissipation 200 W
Linear Derating Factor 1.6 W/°C
VGS Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt ? 5.0 V/ns
TJ Operating Junction and -55 to + 150
TSTG Storage Temperature Range
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torqe, 6-32 or M3 screw 10 lbf•in (1.1N•m) |
5.10. irfp448.pdf Size:864K _international_rectifier |
| PD - 94899
IRFP448PbF
• Lead-Free
12/18/03
Document Number: 91229 www.vishay.com
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IRFP448PbF
Document Number: 91229 www.vishay.com
2
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IRFP448PbF
Document Number: 91229 www.vishay.com
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Document Number: 91229 www.vishay.com
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IRFP448PbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
- D -
3.65 (.143)
5.30 (.209)
15.90 (.626) 3.55 (.140)
4.70 (.185)
15.30 (.602)
0.25 (.010) M D B M
2.50 (.089)
- B -
- A -
1.50 (.059)
5.50 (.217)
4
20.30 (.800)
NOTES:
5.50 (.217)
19.70 (.775)
2X
4.50 (.177)
1 DIMENSIONING & TOLERANCING
PER ANSI Y14.5M, 1982.
1 2 3
2 CONTROLLING DIMENSION : INCH.
3 CONFORMS TO JEDEC OUTLINE
- C -
TO-247-AC.
14.80 (.583)
4.30 (.170)
14.20 (.559)
3.70 (.145)
LEAD ASSIGNMENTS
Hexfet IGBT
LEAD ASSIGNMENTS
2.40 (.094)
0.80 (.031)
1.40 (.056) 1 - Gate 1 - Gate
3X
2.00 (.079) 3X |
5.11. irfp460p.pdf Size:174K _international_rectifier |
| PD-93946A
IRFP460P
Dynamic dv/dt Rating
HEXFET® Power MOSFET
Repetitive Avalanche Rated
D
Isolated Central Mounting Hole
VDSS = 500V
Fast Switching
Ease of Paralleling
Simple Drive Requirements RDS(on) = 0.27?
G
Solder Plated for Reflowing
ID = 20A
Description
S
Third Generation HEXFET®s from International Rectifier
provide the designer with the best combination of fast
switching, ruggedized device design, low on-resistance
and cost-effectiveness.
The TO-247 package is preferred for commercial-industrial
applications where higher power levels preclude the use
of TO-220 devices. The TO-247 is similar but superior to
the earlier TO-218 package because of its isolated
mounting hole. It also provides greater creepage distance
between pins to meet the requirements of most safety
specifications.
TO-247AC
The solder plated version of the TO-247 allows the reflow
soldering of the package heatsink to a substrate material.
Absolute Maximum Ratings
Parameter |
5.12. irfp440.pdf Size:925K _international_rectifier |
| PD - 95198
IRFP440PbF
• Lead-Free
4/27/04
Document Number: 91228 www.vishay.com
1
IRFP440PbF
Document Number: 91228 www.vishay.com
2
IRFP440PbF
Document Number: 91228 www.vishay.com
3
IRFP440PbF
Document Number: 91228 www.vishay.com
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IRFP440PbF
Document Number: 91228 www.vishay.com
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TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
I I I
I
I I
I
I I
I I
N?te: "P" in assembly line
position indicates "Lead-Free"
=
I
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
04/04
Document Number: 91228 www.vishay.com
7
Legal Disclaimer Notice
Vishay
Notice
The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of
International Rectifier’s Power Co |
5.13. irfp460apbf.pdf Size:206K _international_rectifier |
| PD- 94853
SMPS MOSFET
IRFP460APbF
HEXFET® Power MOSFET
Applications
VDSS Rds(on) max ID
l Switch Mode Power Supply ( SMPS )
l Uninterruptable Power Supply 500V 0.27? 20A
l High speed power switching
l Lead-Free
Benefits
l Low Gate Charge Qg results in Simple
Drive Requirement
l Improved Gate, Avalanche and dynamic
dv/dt Ruggedness
l Fully Characterized Capacitance and
Avalanche Voltage and Current
G D S
TO-247AC
l Effective Coss specified ( See AN1001)
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 20
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 13 A
IDM Pulsed Drain Current 80
PD @TC = 25°C Power Dissipation 280 W
Linear Derating Factor 2.2 W/°C
VGS Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt ? 3.8 V/ns
TJ Operating Junction and -55 to + 150
TSTG Storage Temperature Range
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torqe, 6-32 or M3 screw 10 lbf•in |
5.14. irfp460.pdf Size:873K _international_rectifier |
| PD - 94901
IRFP460PbF
• Lead-Free
12/19/03
Document Number: 91237 www.vishay.com
1
IRFP460PbF
Document Number: 91237 www.vishay.com
2
IRFP460PbF
Document Number: 91237 www.vishay.com
3
IRFP460PbF
Document Number: 91237 www.vishay.com
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Document Number: 91237 www.vishay.com
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IRFP460PbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
- D -
3.65 (.143)
5.30 (.209)
15.90 (.626) 3.55 (.140)
4.70 (.185)
15.30 (.602)
0.25 (.010) M D B M
2.50 (.089)
- B -
- A -
1.50 (.059)
5.50 (.217)
4
20.30 (.800)
NOTES:
5.50 (.217)
19.70 (.775)
2X
4.50 (.177)
1 DIMENSIONING & TOLERANCING
PER ANSI Y14.5M, 1982.
1 2 3
2 CONTROLLING DIMENSION : INCH.
3 CONFORMS TO JEDEC OUTLINE
- C -
TO-247-AC.
14.80 (.583)
4.30 (.170)
14.20 (.559)
3.70 (.145)
LEAD ASSIGNMENTS
Hexfet IGBT
LEAD ASSIGNMENTS
2.40 (.094)
0.80 (.031)
1.40 (.056) 1 - Gate 1 - Gate
3X
2.00 (.079) 3X |
5.15. irfp460n.pdf Size:94K _international_rectifier |
| PD-94098
SMPS MOSFET
IRFP460N
HEXFET® Power MOSFET
Applications
VDSS Rds(on) max ID
Switch Mode Power Supply ( SMPS )
Uninterruptable Power Supply 500V 0.24? 20A
High speed power switching
Benefits
Low Gate Charge Qg results in Simple
Drive Requirement
Improved Gate, Avalanche and dynamic
dv/dt Ruggedness
Fully Characterized Capacitance and
Avalanche Voltage and Current
TO-247AC
Effective Coss specified ( See AN1001)
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 20
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 13 A
IDM Pulsed Drain Current 80
PD @TC = 25°C Power Dissipation 280 W
Linear Derating Factor 2.2 W/°C
VGS Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJ Operating Junction and -55 to + 150
TSTG Storage Temperature Range
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torqe, 6-32 or M3 screw 10 lbf•in (1.1N•m)
Typical SMPS Topologie |
5.16. irfp450apbf.pdf Size:224K _international_rectifier |
| PD -95054
SMPS MOSFET
IRFP450APbF
HEXFET® Power MOSFET
Applications
VDSS Rds(on) max ID
l Switch Mode Power Supply ( SMPS )
l Uninterruptable Power Supply 500V 0.40? 14A
l High speed power switching
l Lead-Free
Benefits
l Low Gate Charge Qg results in Simple
Drive Requirement
l Improved Gate, Avalanche and Dynamic
dv/dt Ruggedness
l Fully Characterized Capacitance and
Avalanche Voltage and Current
G D S
TO-247AC
l Effective Coss Specified ( See AN 1001)
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 14
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 8.7 A
IDM Pulsed Drain Current 56
PD @TC = 25°C Power Dissipation 190 W
Linear Derating Factor 1.5 W/°C
VGS Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt ? 4.1 V/ns
TJ Operating Junction and -55 to + 150
TSTG Storage Temperature Range
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torqe, 6-32 or M3 screw 10 lbf |
5.17. irfp450n.pdf Size:121K _international_rectifier |
| PD- 94216
SMPS MOSFET
IRFP450N
HEXFET® Power MOSFET
Applications
VDSS Rds(on) max ID
l Switch Mode Power Supply (SMPS)
l Uninterruptible Power Supply 500V 0.37? 14A
l High Speed Power Switching
Benefits
l Low Gate Charge Qg results in Simple
Drive Requirement
l Improved Gate, Avalanche and Dynamic
dv/dt Ruggedness
l Fully Characterized Capacitance and
Avalanche Voltage and Current
TO-247AC
l Effective Coss Specified (See AN 1001)
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 14
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 8.8 A
IDM Pulsed Drain Current 56
PD @TC = 25°C Power Dissipation 200 W
Linear Derating Factor 1.6 W/°C
VGS Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt ? 5.0 V/ns
TJ Operating Junction and -55 to + 150
TSTG Storage Temperature Range
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torqe, 6-32 or M3 screw 10 lbf•in (1.1N•m)
Typical SMPS T |
5.18. irfp460a.pdf Size:95K _international_rectifier |
| PD- 91880
SMPS MOSFET
IRFP460A
HEXFET® Power MOSFET
Applications
VDSS Rds(on) max ID
Switch Mode Power Supply ( SMPS )
Uninterruptable Power Supply 500V 0.27? 20A
High speed power switching
Benefits
Low Gate Charge Qg results in Simple
Drive Requirement
Improved Gate, Avalanche and dynamic
dv/dt Ruggedness
Fully Characterized Capacitance and
Avalanche Voltage and Current
G D S
TO-247AC
Effective Coss specified ( See AN1001)
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 20
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 13 A
IDM Pulsed Drain Current 80
PD @TC = 25°C Power Dissipation 280 W
Linear Derating Factor 2.2 W/°C
VGS Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt 3.8 V/ns
TJ Operating Junction and -55 to + 150
TSTG Storage Temperature Range
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torqe, 6-32 or M3 screw 10 lbf•in (1.1N•m)
Typical SMPS Top |
5.19. irfp460lc.pdf Size:154K _international_rectifier |
| PD - 9.1232
IRFP460LC
HEXFET® Power MOSFET
Ultra Low Gate Charge
Reduced Gate Drive Requirement
Enhanced 30V Vgs Rating VDSS = 500V
Reduced Ciss, Coss, Crss
Isolated Central Mounting Hole
RDS(on) = 0.27?
Dynamic dv/dt Rated
Repetitive Avalanche Rated
ID = 20A
Description
This new series of Low Charge HEXFET Power MOSFETs achieve significantly
lower gate charge over conventional MOSFETs. Utilizing advanced Hexfet
technology the device improvements allow for reduced gate drive requirements,
faster switching speeds and increased total system savings. These device
improvements combined with the proven ruggedness and reliability of HEXFETs
offer the designer a new standard in power transistors for switching applications.
The TO-247 package is preferred for commercial-industrial applications where
higher power levels preclude the use of TO-220 devices. The TO-247 is similar
but superior to the earlier TO-218 package because of its isolated mounting hole.
Absolute Maximu |
5.20. irfp450.pdf Size:876K _international_rectifier |
| PD - 94852
IRFP450PbF
• Lead-Free
11/17/03
Document Number: 91233 www.vishay.com
1
IRFP450PbF
Document Number: 91233 www.vishay.com
2
IRFP450PbF
Document Number: 91233 www.vishay.com
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IRFP450PbF
Document Number: 91233 www.vishay.com
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IRFP450PbF
Document Number: 91233 www.vishay.com
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Document Number: 91233 www.vishay.com
6
IRFP450PbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
- D -
3.65 (.143)
5.30 (.209)
15.90 (.626) 3.55 (.140)
4.70 (.185)
15.30 (.602)
0.25 (.010) M D B M
2.50 (.089)
- B -
- A -
1.50 (.059)
5.50 (.217)
4
20.30 (.800)
NOTES:
5.50 (.217)
19.70 (.775)
2X
4.50 (.177)
1 DIMENSIONING & TOLERANCING
PER ANSI Y14.5M, 1982.
1 2 3
2 CONTROLLING DIMENSION : INCH.
3 CONFORMS TO JEDEC OUTLINE
- C -
TO-247-AC.
14.80 (.583)
4.30 (.170)
14.20 (.559)
3.70 (.145)
LEAD ASSIGNMENTS
Hexfet IGBT
LEAD ASSIGNMENTS
2.40 (.094)
0.80 (.031)
1.40 (.056) 1 - Gate 1 - Gate
2.00 (.079) 3X 3X
|
5.21. irfp460lcpbf.pdf Size:205K _international_rectifier |
| PD - 94902
IRFP460LCPbF
• Lead-Free
12/19/03
Document Number: 91235 www.vishay.com
1
IRFP460LCPbF
Document Number: 91235 www.vishay.com
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Document Number: 91235 www.vishay.com
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Document Number: 91235 www.vishay.com
5
IRFP460LCPbF
Document Number: 91235 www.vishay.com
6
IRFP460LCPbF
Document Number: 91235 www.vishay.com
7
IRFP460LCPbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
- D -
3.65 (.143)
5.30 (.209)
15.90 (.626) 3.55 (.140)
4.70 (.185)
15.30 (.602)
0.25 (.010) M D B M
2.50 (.089)
- B -
- A -
1.50 (.059)
5.50 (.217)
4
20.30 (.800)
NOTES:
5.50 (.217)
19.70 (.775)
2X
4.50 (.177)
1 DIMENSIONING & TOLERANCING
PER ANSI Y14.5M, 1982.
1 2 3
2 CONTROLLING DIMENSION : INCH.
3 CONFORMS TO JEDEC OUTLINE
- C -
TO-247-AC.
14.80 (.583)
4.30 (.170)
14.20 (.559)
3.70 (.145)
LEAD ASSIGNMENTS
Hexfet IGBT
LEAD ASSIGNMENTS
2.40 |
5.22. irfp450a.pdf Size:942K _samsung |
| Advanced Power MOSFET
FEATURES
BVDSS = 500 V
Avalanche Rugged Technology
RDS(on) = 0.4
?
Rugged Gate Oxide Technology
Lower Input Capacitance
ID = 14 A
Improved Gate Charge
Extended Safe Operating Area
Lower Leakage Current : 10 µA (Max.) @ VDS = 500V
Lower RDS(ON) : 0.308 ? (Typ.)
1
2
3
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings
Symbol Characteristic Value Units
VDSS Drain-to-Source Voltage V
500
Continuous Drain Current (TC=25 o )
C 14
ID
A
o
C
Continuous Drain Current (TC=100 )
8.8
IDM Drain Current-Pulsed A
1 56
O
VGS Gate-to-Source Voltage _ V
EAS Single Pulsed Avalanche Energy 2 mJ
1089
O
IAR Avalanche Current
14 A
1
O
EAR Repetitive Avalanche Energy 1
20.5 mJ
O
dv/dt Peak Diode Recovery dv/dt 3
3.5 V/ns
O
Total Power Dissipation (TC=25 o )
C 205 W
PD
Linear Derating Factor W/ oC
1.64
Operating Junction and
TJ , TSTG - 55 to +150
Storage Temperature Range
o
C
Maximum Lead Temp. for Soldering
TL 300
Purpo |
5.23. irfp440a.pdf Size:932K _samsung |
| Advanced Power MOSFET
FEATURES
BVDSS = 500 V
Avalanche Rugged Technology
RDS(on) = 0.85
?
Rugged Gate Oxide Technology
Lower Input Capacitance
ID = 8.5 A
Improved Gate Charge
Extended Safe Operating Area
Lower Leakage Current : 10 µA (Max.) @ VDS = 500V
Lower RDS(ON) : 0.638 ? (Typ.)
1
2
3
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings
Symbol Characteristic Value Units
VDSS Drain-to-Source Voltage V
500
o
Continuous Drain Current (TC=25 C)
8.5
ID
A
o
C
Continuous Drain Current (TC=100 )
5.4
IDM Drain Current-Pulsed 1 34 A
O
VGS Gate-to-Source Voltage _ V
EAS Single Pulsed Avalanche Energy 2 mJ
602
O
IAR Avalanche Current
1 8.5 A
O
EAR Repetitive Avalanche Energy 1 mJ
16.2
O
3
dv/dt Peak Diode Recovery dv/dt V/ns
3.5
O
Total Power Dissipation (TC=25 oC )
162 W
PD
Linear Derating Factor W/ oC
1.3
Operating Junction and
TJ , TSTG - 55 to +150
Storage Temperature Range
o
C
Maximum Lead Temp. for Soldering
TL 300
Purp |
5.24. irfp450a_sihfp450a.pdf Size:302K _vishay |
| IRFP450A, SiHFP450A
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Low Gate Charge Qg Results in Simple Drive
VDS (V) 500
Requirement
Available
RDS(on) (?)VGS = 10 V 0.40
• Improved Gate, Avalanche and Dynamic dV/dt
RoHS*
Qg (Max.) (nC) 64
Ruggedness
COMPLIANT
Qgs (nC) 16
• Fully Characterized Capacitance and
Qgd (nC) 26
Avalanche Voltage and Current
Configuration Single
• Effective Coss Specified
D • Lead (Pb)-free Available
TO-247
APPLICATIONS
• Switch Mode Power Supply (SMPS)
• Uninterruptable Power Supply
G
• High Speed Power Switching
S
TYPICAL SMPS TOPOLOGIES
D
S
G • Two Transistor Forward
N-Channel MOSFET
• Half Bridge, Full Bridge
• PFC Boost
ORDERING INFORMATION
Package TO-247
IRFP450APbF
Lead (Pb)-free
SiHFP450A-E3
IRFP450A
SnPb
SiHFP450A
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDS 500
V
Gate-Source Voltage VGS ± 30
TC = 25 °C 14
Continuous Drai |
5.25. irfp460lc_sihfp460lc.pdf Size:1124K _vishay |
| IRFP460LC, SiHFP460LC
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Ultra Low Gate Charge
VDS (V) 500
• Reduced Gate Drive Requirement
Available
RDS(on) (?)VGS = 10 V 0.27
• Enhanced 30 V VGS Rating
RoHS*
Qg (Max.) (nC) 120
COMPLIANT
• Reduced Ciss, Coss, Crss
Qgs (nC) 32
• Isolated Central Mounting Hole
Qgd (nC) 49
• Dynamic dV/dt Rating
Configuration Single
• Repetitive Avalanche Rated
• Lead (Pb)-free Available
D
DESCRIPTION
TO-247
This new series of low charge Power MOSFETs achieve
significantly lower gate charge over conventional MOSFETs.
Utilizing advanced Power MOSFETs technology the device
G
improvements allow for reduced gate drive requirements,
faster switching speeds and increased total system savings.
These device improvements combined with the proven
S
D
ruggedness and reliabiltity of Power MOSFETs offer the
S
G
designer a new standard in power transistors for switching
N-Channel MOSFET
applications.
The TO-247 package i |
5.26. irfp460_sihfp460.pdf Size:156K _vishay |
| IRFP460, SiHFP460
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Dynamic dV/dt Rating
VDS (V) 500
Available
• Repetitive Avalanche Rated
RDS(on) (?)VGS = 10 V 0.27
RoHS*
• Isolated Central Mounting Hole
Qg (Max.) (nC) 210
COMPLIANT
• Fast Switching
Qgs (nC) 29
Qgd (nC) 110
• Ease of Paralleling
Configuration Single
• Simple Drive Requirements
D • Lead (Pb)-free Available
TO-247
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
G
ruggedized device design, low on-resistance and
cost-effectiveness.
S
The TO-247 package is preferred for commercial-industrial
D
S
G applications where higher power levels preclude the use of
TO-220 devices. The TO-247 is similar but superior to the
N-Channel MOSFET
earlier TO-218 package because its isolated mounting hole.
It also provides greater creepage distances between pins to
meet the requirements of most safety specifications.
ORDER |
5.27. irfp448_sihfp448.pdf Size:1629K _vishay |
| IRFP448, SiHFP448
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Dynamic dV/dt Rating
VDS (V) 500
Available
• Repetitive Avalanche Rated
RDS(on) (?)VGS = 10 V 0.60
RoHS*
• Isolated Central Mounting Hole
COMPLIANT
Qg (Max.) (nC) 84
• Fast Switching
Qgs (nC) 8.4
• Ease of Paralleling
Qgd (nC) 50
• Simple Drive Requirements
Configuration Single
• Compliant to RoHS Directive 2002/95/EC
D
DESCRIPTION
TO-247AC
Third Generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
G
cost-effectiveness.
The TO-247AC package is preferred for
S
commercial-industrial applications where higher power
D
S levels preclude the use of TO-220AB devices. The
G
TO-247AC is similar but superior to the earlier TO-218
N-Channel MOSFET
package because of its isolated mounting hole. It also
provides greater creepage distance between pins to meet
the requirements of most safety |
5.28. irfp460a_sihfp460a.pdf Size:180K _vishay |
| IRFP460A, SiHFP460A
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Low Gate Charge Qg Results in Simple Drive
VDS (V) 500
Available
Requirement
RDS(on) (?)VGS = 10 V 0.27
• Improved Gate, Avalanche and Dynamic dV/dt RoHS*
Qg (Max.) (nC) 105 COMPLIANT
Ruggedness
Qgs (nC) 26
• Fully Characterized Capacitance and Avalanche Voltage
Qgd (nC) 42 and Current
Configuration Single • Effective Coss Specified
• Compliant to RoHS Directive 2002/95/EC
D
APPLICATIONS
TO-247
• Switch Mode Power Supply (SMPS)
• Uninterruptable Power Supply
G
• High Speed Power Switching
TYPICAL SMPS TOPOLOGIES
S
• Full Bridge
D
S
G
• PFC Boost
N-Channel MOSFET
ORDERING INFORMATION
Package TO-247
IRFP460APbF
Lead (Pb)-free
SiHFP460A-E3
IRFP460A
SnPb
SiHFP460A
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDS 500
V
Gate-Source Voltage VGS ± 30
TC = 25 °C 20
Continuous Drain Current VGS at 10 V ID
T |
5.29. irfp440_sihfp440.pdf Size:1460K _vishay |
| IRFP440, SiHFP440
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Dynamic dV/dt Rating
VDS (V) 500
Available
• Repetitive Avalanche Rated
RDS(on) (?)VGS = 10 V 0.85
RoHS*
• Isolated Central Mounting Hole
COMPLIANT
Qg (Max.) (nC) 63
• Fast Switching
Qgs (nC) 11
• Ease of Paralleling
Qgd (nC) 30
• Simple Drive Requirements
Configuration Single • Compliant to RoHS Directive 2002/95/EC
D
DESCRIPTION
TO-247AC
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The TO-247AC package is preferred for
commercial-industrial applications where higher power levels
S
preclude the use of TO-220AB devices. The TO-247AC is
D
S
G
similar but superior to the earlier TO-218 package because of
N-Channel MOSFET its isolated mounting hole. It also provides greater creepage
distances between pins to meet the requirements of most
safety |
5.30. irfp450lc_sihfp450lc.pdf Size:1566K _vishay |
| IRFP450LC, SiHFP450LC
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Ultra Low Gate Charge
VDS (V) 500
• Reduced Gate Drive Requirement
Available
RDS(on) (?)VGS = 10 V 0.40
• Enhanced 30 V VGS Rating
RoHS*
Qg (Max.) (nC) 74
• Reduced Ciss, Coss, Crss
COMPLIANT
Qgs (nC) 19
• Isolated Central Mounting Hole
Qgd (nC) 35
• Dynamic dV/dt Rated
Configuration Single
• Repetitive Avalanche Rated
• Lead (Pb)-free Available
D
DESCRIPTION
TO-247
This new series of low charge Power MOSFETs achieve
significantly lower gate charge over conventional MOSFETs.
Utilizing advanced Power MOSFET technology the device
G
improvements allow for reduced gate drive requirements,
faster switching speeds and increased total system savings.
These device improvements combined with the proven
S
D
ruggedness and reliability of Power MOSFETs offer the
G S
designer a new standard in power transistors for switching
applications.
N-Channel MOSFET
The TO-247 package is pre |
5.31. irfp450_sihfp450.pdf Size:1560K _vishay |
| IRFP450, SiHFP450
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Dynamic dV/dt Rating
VDS (V) 500
• Repetitive Avalanche Rated Available
RDS(on) (?)VGS = 10 V 0.40
• Isolated Central Mounting Hole RoHS*
Qg (Max.) (nC) 150
COMPLIANT
• Fast Switching
Qgs (nC) 20
• Ease of Paralleling
Qgd (nC) 80
• Simple Drive Requirements
Configuration Single
• Lead (Pb)-free Available
D
TO-247
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
G
cost-effectiveness.
The TO-247 package is preferred for commercial-industrial
S
applications where higher power levels preclude the use of
D
S
G TO-220 devices. The TO-247 is similar but superior to the
earlier TO-218 package because its isolated mounting hole.
N-Channel MOSFET
It also provides greater creepage distances between pins to
meet the requirements of most safety specifications.
ORDERIN |
5.32. irfp460n_sihfp460n.pdf Size:158K _vishay |
| IRFP460N, SiHFP460N
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Low Gate Charge Qg Results in Simple Drive
VDS (V) 500
Available
Requirement
RDS(on) (?)VGS = 10 V 0.24
• Improved Gate, Avalanche and Dynamic dV/dt RoHS*
Qg (Max.) (nC) 124 COMPLIANT
Ruggedness
Qgs (nC) 40
• Fully Characterized Capacitance and Avalanche Voltage
and Current
Qgd (nC) 57
Configuration Single • Effective Coss Specified
• Lead (Pb)-free Available
D
TO-247
APPLICATIONS
• Switch Mode Power Supply (SMPS)
• Uninterruptible Power Supply
G
• High Speed Power Switching
TYPICAL SMPS TOPOLOGIES
S
D
• Full Bridge
G
S
• Power Factor Correction Boost
N-Channel MOSFET
ORDERING INFORMATION
Package TO-247
IRFP460NPbF
Lead (Pb)-free
SiHFP460N-E3
IRFP460N
SnPb
SiHFP460N
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDS 500
V
Gate-Source Voltage VGS ± 30
TC = 25 °C 20
Continuous Drain Current VGS at 10 |
5.33. irfp460.pdf Size:77K _ixys |
| MegaMOSTM IRFP 460 VDSS = 500 V
Power MOSFET ID(cont) = 20 A
?
RDS(on) = 0.27?
?
?
?
N-Channel Enhancement Mode, HDMOSTM Family
Symbol Test Conditions Maximum Ratings TO-247 AD
VDSS TJ = 25°C to 150°C 500 V
VDGR TJ = 25°C to 150°C; RGS = 1 M? 500 V
VGS Continuous ±20 V D (TAB)
VGSM Transient ±30 V
ID25 TC = 25°C20 A
G = Gate, D = Drain,
IDM TC = 25°C, pulse width limited by TJM 80 A
S = Source, TAB = Drain
IAR 20 A
EAR TC = 25°C28 mJ
dv/dt IS ? IDM, di/dt ? 100 A/µs, VDD ? VDSS, 3.5 V/ns
TJ ? 150°C, RG = 2 ?
Features
PD TC = 25°C 260 W
Repetitive avalanche energy rated
TJ -55 ... +150 °C Fast switching times
Low RDS (on) HDMOSTM process
TJM 150 °C
Rugged polysilicon gate cell structure
Tstg -55 ... +150 °C
High Commutating dv/dt Rating
Md Mounting torque 1.15/10 Nm/lb.in.
Weight 6 g
Applications
Maximum lead temperature for soldering 300 °C
Switching Power Supplies
1.6 mm (0.062 in.) from case for 10 s
Motor controls
Symbol Test Conditions Charac |
5.34. irfp450.pdf Size:46K _ixys |
| IRFP 450 VDSS = 500 V
Standard Power MOSFET
ID(cont) = 14 A
?
RDS(on) = 0.40 ?
?
?
?
N-Channel Enhancement Mode
Symbol Test Conditions Maximum Ratings TO-247 AD
VDSS TJ = 25°C to 150°C 500 V
VDGR TJ = 25°C to 150°C; RGS = 1 M? 500 V
VGS Continuous ±20 V D (TAB)
VGSM Transient ±30 V
ID25 TC = 25°C14 A
G = Gate, D = Drain,
IDM TC = 25°C, pulse width limited by TJM 56 A
S = Source, TAB = Drain
IAR 14 A
EAR TC = 25°C19 mJ
dv/dt IS ? IDM, di/dt ? 100 A/µs, VDD ? VDSS, 3.5 V/ns
TJ ? 150°C, RG = 2 ?
PD TC = 25°C 190 W
TJ -55 ... +150 °C
TJM 150 °C
Tstg -55 ... +150 °C
Features
Md Mounting torque 1.13/10 Nm/lb.in.
International standard packages
Weight 6 gLow RDS (on) HDMOSTM process
Rugged polysilicon gate cell structure
Maximum lead temperature for soldering 300 °C
Low package inductance (< 5 nH)
1.6 mm (0.062 in.) from case for 10 s
- easy to drive and to protect
Fast switching times
Symbol Test Conditions Characteristic Values Applications
(TJ = 25°C, u |
See also transistors datasheet: IRFP3703
, IRFP4004
, IRFP4110
, IRFP4227
, IRFP4229
, IRFP4232
, IRFP4242
, IRFP4310Z
, IRF640
, IRFP4332
, IRFP4368
, IRFP4410Z
, IRFP4468
, IRFP4568
, IRFP4668
, IRFP4710
, IRFP4768
. Keywords| IRFP4321
Datasheet | IRFP4321
Datenblatt | IRFP4321
RoHS | IRFP4321
Distributor | | IRFP4321
Application Notes | IRFP4321
Component | IRFP4321
Circuit | IRFP4321
Schematic | | IRFP4321
Equivalent | IRFP4321
Cross Reference | IRFP4321
Data Sheet | IRFP4321
Fiche Technique |
|