MOSFET Datasheet



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2SK3911
  2SK3911
  2SK3911
  2SK3911
 
2SK3911
  2SK3911
  2SK3911
  2SK3911
 
 
List
10N30 ..2N5911
2N5912 ..2N6963
2N6964 ..2SJ136
2SJ137 ..2SJ553L
2SJ553S ..2SK1516
2SK1517 ..2SK2136
2SK2137 ..2SK2735
2SK2735L ..2SK3125
2SK3126 ..2SK357
2SK3582CT ..2SK4195LS
2SK4196LS ..3N159
3N161 ..40821
40822 ..AO4496
AO4498 ..AOC2423
AOC2800 ..AON2701
AON2705 ..AON7752
AON7754 ..AOU4N60
AOU4S60 ..AP13P15GP-HF
AP13P15GS-HF ..AP30T10GP-HF
AP30T10GS-HF ..AP4800AGM-HF
AP4800BGM-HF ..AP9408AGH
AP9408AGI ..AP9930AGM
AP9930GM-HF ..APT1004RGN
APT1004RKN ..APT50M50L2LL
APT50M50PVR ..AUIRF3710ZS
AUIRF3805 ..AUIRLR3915
AUIRLS3034 ..BLF202
BLF2043F ..BSB028N06NN3G
BSB053N03LPG ..BSS123
BSS123A ..BUK653R7-30C
BUK654R0-75C ..BUK9217-75B
BUK9219-55A ..BUZ50A-TO220M
BUZ50ASM ..CED20P10
CED21A2 ..CEP02N7G
CEP02N9 ..CPH3355
CPH3356 ..DMP210DUDJ
DMP210DUFB4 ..FCP9N60N
FCPF11N60 ..FDC642P_F085
FDC645N ..FDM3622
FDM47-06KC5 ..FDMS7608S
FDMS7620S ..FDP8860
FDP8870 ..FDS8926A
FDS8928A ..FQB1P50
FQB22P10 ..FQPF3N25
FQPF3N80C ..FRS240R
FRS244D ..H5N2008P
H5N2301PF ..HAT2080R
HAT2080T ..HUF75332S3S
HUF75333G3 ..IPB022N04LG
IPB023N04NG ..IPD14N06S2-80
IPD15N06S2L-64 ..IPI80N04S3-06
IPI80N04S3-H4 ..IPP90R1K0C3
IPP90R1K2C3 ..IRF2807
IRF2807L ..IRF644
IRF644A ..IRF7450
IRF7451 ..IRF9533
IRF9540 ..IRFH3702
IRFH3707 ..IRFP140
IRFP1405 ..IRFR3411
IRFR3504Z ..IRFS750A
IRFS820 ..IRFW520A
IRFW530A ..IRL8113
IRL8113L ..IRLU3717
IRLU3802 ..IXFH16N120P
IXFH16N50P ..IXFK64N50Q3
IXFK64N60P ..IXFP8N50PM
IXFQ10N80P ..IXFV74N20PS
IXFV96N15P ..IXTA32P20T
IXTA36N30P ..IXTH41N25
IXTH420N04T2 ..IXTP1R4N120P
IXTP1R4N60P ..IXTT16N10D2
IXTT16N20D2 ..JFTJ105
K1109 ..KMB7D0DN40Q
KMB7D0DN40QA ..KU310N10P
KU390N10P ..MTB3D0N03ATH8
MTB40N06E3 ..MTN2510LE3
MTN2510LJ3 ..MTP6405N6
MTP658G6 ..NTD20N03L27
NTD20N06 ..NTR4501
NTR4502P ..PHT6N03LT
PHT6N06LT ..PSMN1R2-30YLC
PSMN1R3-30YL ..RF1S530SM
RF1S540SM ..RJK03E5DPA
RJK03E6DPA ..RQJ0602EGDQS
RQJ0603LGDQA ..SDF08N50
SDF08N60 ..SFP9Z34
SFR2955 ..SMG2306NE
SMG2310A ..SML40J93
SML40L57 ..SPA08N80C3
SPA11N60C3 ..SSDF9504
SSE110N03-03P ..SSM3J16TE
SSM3J304T ..SSM6P05FU
SSM6P09FU ..STB19NF20
STB200N4F3 ..STD3N25-1
STD3N25T4 ..STF26NM60N
STF28NM50N ..STK830P
STK900 ..STP14NK50Z
STP14NK60Z ..STP5N30LFI
STP5N50 ..STS4DNFS30L
STS4DPF20L ..STU616S
STU618S ..TF252TH
TF256 ..TK80S04K3L
TK80S06K3L ..TPCA8046-H
TPCA8047-H ..UP672
UP9971 ..WTC2305
WTC2305DS ..ZXMP10A16K
ZXMP10A17E6 ..ZXMS6006SG
 
2SK3911 All MOSFET Data Sheet. Parameters and Characteristics. MOSFET Cross Reference Database.
 

2SK3911 MOSFET transistor datasheet. Parameters and characteristics.

Type Designator: 2SK3911

Type of 2SK3911 transistor: MOSFET

Type of control channel: N -Channel

Maximum power dissipation (Pd), W: 150

Maximum drain-source voltage |Uds|, V: 600

Maximum gate-source voltage |Ugs|, V:

Maximum drain current |Id|, A: 20

Maximum junction temperature (Tj), °C:

Rise Time of 2SK3911 transistor (tr), nS:

Drain-source Capacitance (Cd), pF:

Maximum drain-source on-state resistance (Rds), Ohm:

Package: TO3P(N)

Equivalent transistors for 2SK3911 - Cross-Reference Search

2SK3911 PDF doc:

1.1. 2sk3911.pdf Size:193K _toshiba

2SK3911
2SK3911
2SK3911 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (MACHII ?-MOSVI) 2SK3911 Switching Regulator Applications Unit: mm Small gate charge: Qg = 60 nC (typ.) Low drain-source ON resistance: RDS (ON) = 0.22? (typ.) High forward transfer admittance: |Yfs| = 11 S (typ.) Low leakage current: IDSS = 500 ?A (VDS = 600 V) Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 600 V Drain-gate voltage (RGS = 20 k?) VDGR 600 V Gate-source voltage VGSS 30 V DC (Note 1) ID 20 1. Gate Drain current A 2. Drain (heatsink) Pulse (Note 1) IDP 80 3. Source Drain power dissipation (Tc = 25C) PD 150 W JEDEC ? Single pulse avalanche energy EAS 792 mJ (Note 2) JEITA SC-65 Avalanche current IAR 20 A TOSHIBA 2-16C1B Repetitive avalanche energy (Note 3) EAR 15 mJ Weight: 4.6 g (typ.) Channel temperature Tch 150 C Storage temperature

4.1. 2sk3918.pdf Size:160K _nec

2SK3911
2SK3911
DATA SHEET MOS FIELD EFFECT TRANSISTOR 2SK3918 SWITCHING N-CHANNEL POWER MOS FET DESCRIPTION ORDERING INFORMATION The 2SK3918 is N-channel MOS FET device that PART NUMBER PACKAGE features a low on-state resistance and excellent switching 2SK3918 TO-251 (MP-3) characteristics, and designed for low voltage high current 2SK3918-ZK TO-252 (MP-3ZK) applications such as DC/DC converter with synchronous rectifier. (TO-251) FEATURES • Low on-state resistance RDS(on)1 = 7.5 mΩ MAX. (VGS = 10 V, ID = 24 A) • Low Ciss: Ciss = 1300 pF TYP. • 5 V drive available ABSOLUTE MAXIMUM RATINGS (TA = 25°C) (TO-252) Drain to Source Voltage (VGS = 0 V) VDSS 25 V Gate to Source Voltage (VDS = 0 V) VGSS ±20 V Drain Current (DC) (TC = 25°C) ID(DC) ±48 A Drain Current (pulse) Note1 ID(pulse) ±192 A Total Power Dissipation (TC = 25°C) PT1 29 W Total Power Dissipation PT2 1.0 W Channel Temperature Tch 150 °C Storage Temperature Tstg -55 to +150 °

5.1. 2sk3906.pdf Size:179K _toshiba

2SK3911
2SK3911
2SK3906 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (MACH II ?-MOS VI) 2SK3906 Switching Regulator Applications Unit: mm Small gate charge: Qg = 60 nC (typ.) Fast reverse recovery time: trr = 400 ns (typ.) Low drain-source ON-resistance: RDS (ON) = 0.27 ? (typ.) High forward transfer admittance: |Yfs| = 15S (typ.) Low leakage current: IDSS = 500 ?A (VDS = 600 V) Enhancement mode: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 600 V Drain-gate voltage (RGS = 20 k?) VDGR 600 V Gate-source voltage VGSS 30 V 1. Gate 2. Drain(heat sink) DC (Note 1) ID 20 3. Source Drain current A Pulse (Note 1) IDP 80 JEDEC ? Drain power dissipation (Tc = 25C) PD 150 W JEITA SC-65 Single-pulse avalanche energy EAS 792 mJ (Note 2) TOSHIBA 2-16C1B Avalanche current IAR 20 A Weight: 4.6 g (typ.) Repetitive avalanche energy (Note 3) EAR 15 m

5.2. 2sk3904.pdf Size:238K _toshiba

2SK3911
2SK3911
2SK3904 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (?-MOSVI) 2SK3904 Switching Regulator Applications Unit: mm Low drain-source ON resistance: RDS (ON) = 0.2 ? (typ.) High forward transfer admittance: ?Yfs? = 9.5 S (typ.) Low leakage current: IDSS = 100 ?A (max) (VDS = 450 V) Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 450 V Drain-gate voltage (RGS = 20 k?) VDGR 450 V Gate-source voltage VGSS 30 V DC (Note 1) ID 19 Drain current A 1. GATE Pulse (Note 1) IDP 76 2. DRAIN (HEATSINK) 3. SOURCE Drain power dissipation (Tc = 25C) PD 150 W Single pulse avalanche energy JEDEC ? EAS 820 mJ (Note 2) JEITA SC-65 Avalanche current IAR 19 A TOSHIBA 2-16C1B Repetitive avalanche energy (Note 3) EAR 15 mJ Weight: 4.6 g (typ.) Channel temperature Tch 150 C Storage temperature range Tstg -55~150 C Note: Using cont

5.3. 2sk3905.pdf Size:239K _toshiba

2SK3911
2SK3911
2SK3905 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (?-MOSVI) 2SK3905 Switching Regulator Applications Unit: mm Low drain-source ON resistance: RDS (ON) = 0.25 ? (typ.) High forward transfer admittance: ?Yfs? = 8.2 S (typ.) Low leakage current: IDSS = 100 ?A (max) (VDS = 500 V) Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 500 V Drain-gate voltage (RGS = 20 k?) VDGR 500 V Gate-source voltage VGSS 30 V DC (Note 1) ID 17 Drain current A 1. GATE Pulse (Note 1) IDP 68 2. DRAIN (HEATSINK) 3. SOURCE Drain power dissipation (Tc = 25C) PD 150 W Single pulse avalanche energy JEDEC ? EAS 816 mJ (Note 2) JEITA SC-65 Avalanche current IAR 17 A TOSHIBA 2-16C1B Repetitive avalanche energy (Note 3) EAR 15 mJ Weight: 4.6 g (typ.) Channel temperature Tch 150 C Storage temperature range Tstg -55~150 C Note: Using con

5.4. 2sk3934.pdf Size:288K _toshiba

2SK3911
2SK3911
2SK3934 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (?-MOSVI) 2SK3934 Switching Regulator Applications Unit: mm Low drain-source ON resistance: RDS (ON) = 0.23? (typ.) High forward transfer admittance: |Yfs| = 8.2 S (typ.) Low leakage current: IDSS = 100 ?A (VDS = 500 V) Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 500 V Drain-gate voltage (RGS = 20 k?) VDGR 500 V Gate-source voltage VGSS 30 V DC (Note 1) ID 15 Drain current A Pulse (t = 1 ms) 1: Gate IDP 60 (Note 1) 2: Drain 3: Source Drain power dissipation (Tc = 25C) PD 50 W JEDEC ? Single pulse avalanche energy EAS 1.08 J (Note 2) JEITA SC-67 Avalanche current IAR 15 A TOSHIBA 2-10U1B Repetitive avalanche energy (Note 3) EAR 5.0 mJ Weight: 1.7 g (typ.) Channel temperature Tch 150 C Storage temperature range Tstg -55~150 C Note: Using continuous

5.5. 2sk3903.pdf Size:239K _toshiba

2SK3911
2SK3911
2SK3903 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (?-MOSVI) 2SK3903 Switching Regulator Applications Unit: mm Low drain-source ON resistance: RDS (ON) = 0.32 ? (typ.) High forward transfer admittance: ?Yfs? = 7.5 S (typ.) Low leakage current: IDSS = 100 ?A (max) (VDS = 600 V) Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 600 V Drain-gate voltage (RGS = 20 k?) VDGR 600 V Gate-source voltage VGSS 30 V DC (Note 1) ID 14 1. GATE Drain current A 2. DRAIN (HEATSINK) Pulse (Note 1) IDP 56 3. SOURCE Drain power dissipation (Tc = 25C) PD 150 W Single pulse avalanche energy JEDEC ? EAS 806 mJ (Note 2) JEITA SC-65 Avalanche current IAR 14 A TOSHIBA 2-16C1B Repetitive avalanche energy (Note 3) EAR 15 mJ Channel temperature Tch 150 C Weight: 4.6 g (typ.) Storage temperature range Tstg -55~150 C Note: Using c

5.6. 2sk3907.pdf Size:213K _toshiba

2SK3911
2SK3911
2SK3907 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (MACHII ?-MOSVI) 2SK3907 Switching Regulator Applications Unit: mm Small gate charge: Qg = 60 nC (typ.) Low drain-source ON resistance: RDS (ON) = 0.18 ? (typ.) High forward transfer admittance: |Yfs| = 12 S (typ.) Low leakage current: IDSS = 500 ?A (VDS = 500 V) Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 500 V Drain-gate voltage (RGS = 20 k?) VDGR 500 V Gate-source voltage VGSS 30 V DC (Note 1) ID 23 Drain current A 1. GATE Pulse (Note 1) IDP 92 2. DRAIN (HEATSINK) 3. SOURCE Drain power dissipation (Tc = 25C) PD 150 W Single pulse avalanche energy JEDEC ? EAS 552 mJ (Note 2) JEITA SC-65 Avalanche current IAR 23 A TOSHIBA 2-16C1B Repetitive avalanche energy (Note 3) EAR 15 mJ Weight: 4.6 g (typ.) Channel temperature Tch 150 C Storage temperatu

5.7. 2sk3935.pdf Size:313K _toshiba

2SK3911
2SK3911
2SK3935 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (?-MOSVI) 2SK3935 Switching Regulator Applications Unit: mm Low drain-source ON resistance : RDS (ON) = 0.18? (typ.) High forward transfer admittance : |Yfs| = 10 S (typ.) Low leakage current : IDSS = 100 ?A (max) (VDS = 450 V) Enhancement model : Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 450 V Drain-gate voltage (RGS = 20 k?) VDGR 450 V Gate-source voltage VGSS 30 V 1: Gate DC (Note 1) ID 17 A 2: Drain Drain current 3: Source Pulse (Note 1) IDP 68 A Drain power dissipation PD 50 W JEDEC - Single pulse avalanche energy JEITA SC-67 EAS 918 mJ (Note 2) TOSHIBA 2-10U1B Avalanche current IAR 17 A Weight: 1.7 g (typ.) Repetitive avalanche energy (Note 3) EAR 5 mJ Channel temperature Tch 150 C Storage temperature range Tstg -55~150 C Note: Using continuously under hea

5.8. 2sk3994.pdf Size:255K _toshiba

2SK3911
2SK3911
2SK3994 TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type (?-MOS V) 2SK3994 Switching Regulator, DC/DC Converter Applications Unit: mm Motor Drive Applications Low drain-source ON-resistance : RDS (ON) = 90 m? (typ.) High forward transfer admittance : |Yfs| = 10 S (typ.) Low leakage current : IDSS = 100 ?A (max) (VDS = 250 V) Enhancement mode : Vth = 3.0 to 5.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 250 V Drain-gate voltage (RGS = 20 k?) VDGR 250 V Gate-source voltage VGSS 30 V DC (Note 1) ID 20 A Drain current Pulse (Note 1) IDP 80 A Drain power dissipation (Tc = 25C) PD 45 W JEDEC Single-pulse avalanche energy EAS 487 mJ JEITA SC-67 (Note 2) TOSHIBA 2-10R1B Avalanche current IAR 20 A Repetitive avalanche energy (Note 3) EAR 4.5 mJ Weight: 1.9 g (typ.) Channel temperature Tch 150 C Storage temperature range Tstg -55~150 C Note: Using con

5.9. 2sk3947.pdf Size:182K _toshiba

2SK3911
2SK3911
2SK3947 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (?-MOSVI) 2SK3947 Switching Regulator Applications Unit: mm Low drain-source ON-resistance: RDS (ON) = 1.1 ? (typ.) High forward transfer admittance: |Yfs| = 5.0S (typ.) Low leakage current: IDSS = 100 ?A (VDS = 600 V) Enhancement mode: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 600 V Drain-gate voltage (RGS = 20 k?) VDGR 600 V Gate-source voltage VGSS 30 V DC (Note 1) ID 6 1: Gate Drain current A 2: Drain Pulse (t = 1 ms) IDP 24 3: Source (Note 1) Drain power dissipation (Tc = 25C) PD 40 W Single-pulse avalanche energy EAS 345 mJ JEDEC ? (Note 2) JEITA SC-67 Avalanche current IAR 6 A Repetitive avalanche energy (Note 3) EAR 4 mJ TOSHIBA 2-10U1B Channel temperature Tch 150 C Weight: 1.7 g (typ.) Storage temperature range Tstg -55~150 C Note: Using continuously

5.10. 2sk3936.pdf Size:180K _toshiba

2SK3911
2SK3911
2SK3936 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (MACH II ?-MOS VI) 2SK3936 Switching Regulator Applications Unit: mm Small gate charge: Qg = 60 nC (typ.) Fast reverse recovery time: trr = 380 ns (typ.) Low drain-source ON-resistance: RDS (ON) = 0.2 ? (typ.) High forward transfer admittance: |Yfs| = 16.5 S (typ.) Low leakage current: IDSS = 500 ?A (VDS = 500 V) Enhancement mode: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 500 V Drain-gate voltage (RGS = 20 k?) VDGR 500 V Gate-source voltage VGSS 30 V 1. Gate 2. Drain(heat sink) DC (Note 1) ID 23 3. Source Drain current A Pulse (Note 1) IDP 92 JEDEC ? Drain power dissipation (Tc = 25C) PD 150 W JEITA SC-65 Single-pulse avalanche energy EAS 759 mJ (Note 2) TOSHIBA 2-16C1B Avalanche current IAR 23 A Weight: 4.6 g (typ.) Repetitive avalanche energy (Note 3) EAR 15

5.11. 2sk3940.pdf Size:188K _toshiba

2SK3911
2SK3911
2SK3940 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (U-MOSIII) 2SK3940 Switching Regulator, DC/DC Converter Applications Unit: mm Motor Drive Applications Low drain-source ON-resistance: RDS (ON) = 5.6 m? (typ.) High forward transfer admittance: |Yfs| = 90 S (typ.) Low leakage current: IDSS = 100 A (VDS = 75 V) Enhancement-mode: Vth = 3.0 to 5.0 V (VDS = 10 V, ID = 1 mA) Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 75 V Drain-gate voltage (RGS = 20 k?) VDGR 75 V Gate-source voltage VGSS 20 V ID 70 DC (Note 1) Drain current A 1. GATE IDP 280 Pulse (Note 1) 2. DRAIN (HEAT SINK) 3. SOURCE Drain power dissipation (Tc = 25C) PD 150 W Single-pulse avalanche energy EAS 444 mJ JEDEC ? (Note 2) Avalanche current IAR 70 A JEITA ? Repetitive avalanche energy (Note 3) EAR 15 mJ TOSHIBA 2-16C1B Channel temperature Tch 175 C Weight: 4.6 g (typ.) Storage temperature range Tstg

5.12. 2sk3900.pdf Size:151K _nec

2SK3911
2SK3911
DATA SHEET MOS FIELD EFFECT TRANSISTOR 2SK3900 SWITCHING N-CHANNEL POWER MOS FET DESCRIPTION ORDERING INFORMATION The 2SK3900 is N-channel MOS Field Effect Transistor PART NUMBER PACKAGE designed for high current switching applications. 2SK3900-ZP TO-263 (MP-25ZP) FEATURES • Super low on-state resistance (TO-263) RDS(on)1 = 8.0 mΩ MAX. (VGS = 10 V, ID = 41 A) RDS(on)2 = 10 mΩ MAX. (VGS = 4.5 V, ID = 41 A) • Low C iss: C iss = 3500 pF TYP. • Built-in gate protection diode ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Drain to Source Voltage (VGS = 0 V) VDSS 60 V Gate to Source Voltage (VDS = 0 V) VGSS ±20 V Drain Current (DC) (TC = 25°C) ID(DC) ±82 A Drain Current (pulse) Note1 ID(pulse) ±246 A Total Power Dissipation (TC = 25°C) PT1 104 W Total Power Dissipation (TA = 25°C) PT2 1.5 W Channel Temperature Tch 150 °C Storage Temperature Tstg -55 to +150 °C Single Avalanche Energy Note2 EAS 141 mJ Repetitive Avalanche Current Note3

5.13. 2sk3929.pdf Size:114K _fuji

2SK3911
2SK3911
2SK3929-01MR N-CHANNEL SILICON POWER MOSFET Outline Drawings (mm) 200406 TO-220F FUJI POWER MOSFET Super FAP-G Series Features High speed switching Low on-resistance No secondary breadown Low driving power Avalanche-proof Applications Switching regulators DC-DC converters UPS (Uninterruptible Power Supply) Maximum ratings and characteristic Absolute maximum ratings (Tc=25C unless otherwise specified) Item Symbol Ratings Unit Remarks Equivalent circuit schematic Drain-source voltage VDS 600 V Drain(D) VDSX 600 V VGS=-30V Continuous Drain Current ID 11 A Pulsed Drain Current ID(puls] 44 A Gate-Source Voltage VGS 30 V Maximum Avalanche current IAR 11 A Note *1 Gate(G) Non-Repetitive EAS 439.1 mJ Note *2 Source(S) Maximum Avalanche Energy < Note *1:Tch 150C,Repetitive and Non-repetitive = Repetitive EAR 7 mJ Note *3 Note *2:StartingTch=25C,IAS=5A,L=32.2mH, Maximum Avalanche Energy VCC=60V,RG=50? Maximum Drain-Source dV/dt dVDS/dt 20 kV/s <

5.14. 2sk3932.pdf Size:105K _fuji

2SK3911
2SK3911
2SK3932-01MR N-CHANNEL SILICON POWER MOSFET Outline Drawings (mm) 200406 TO-220F FUJI POWER MOSFET Super FAP-G Series Features High speed switching Low on-resistance No secondary breadown Low driving power Avalanche-proof Applications Switching regulators DC-DC converters UPS (Uninterruptible Power Supply) Maximum ratings and characteristic Absolute maximum ratings (Tc=25C unless otherwise specified) Equivalent circuit schematic Item Symbol Ratings Unit Remarks Drain-source voltage VDS 500 V Drain(D) VDSX 500 V VGS=-30V Continuous Drain Current ID 11 A Pulsed Drain Current ID(puls] 44 A Gate-Source Voltage VGS 30 V Gate(G) Maximum Avalanche current IAR 11 A Note *1 Source(S) Non-Repetitive EAS 453.9 mJ Note *2 Maximum Avalanche Energy < Note *1:Tch 150C,Repetitive and Non-repetitive = Repetitive EAR 6.0 mJ Note *3 Note *2:StartingTch=25C,IAS=4.4A,L=43mH, Maximum Avalanche Energy VCC=50V,RG=50? Maximum Drain-Source dV/dt dVDS/dt 20 kV/s

5.15. 2sk3931.pdf Size:101K _fuji

2SK3911
2SK3911
2SK3931-01 N-CHANNEL SILICON POWER MOSFET Outline Drawings (mm) 200406 TO-220AB FUJI POWER MOSFET Super FAP-G Series Features High speed switching Low on-resistance No secondary breadown Low driving power Avalanche-proof Applications Switching regulators DC-DC converters UPS (Uninterruptible Power Supply) Maximum ratings and characteristic Absolute maximum ratings Equivalent circuit schematic (Tc=25C unless otherwise specified) Drain(D) Item Symbol Ratings Unit Remarks Drain-source voltage VDS 500 V VDSX 500 V VGS=-30V Continuous Drain Current ID 11 A Pulsed Drain Current ID(puls] 44 A Gate(G) Gate-Source Voltage VGS 30 V Source(S) Maximum Avalanche current IAR 11 A Note *1 Non-Repetitive EAS 453.9 mJ Note *2 < Note *1:Tch 150C,Repetitive and Non-repetitive = Maximum Avalanche Energy Note *2:StartingTch=25C,IAS=4.4A,L=43mH, Repetitive EAR 16.5 mJ Note *3 VCC=50V,RG=50? Maximum Avalanche Energy EAS limited by maximum channel temperature

See also transistors datasheet: 2SK3844 , 2SK3846 , 2SK3847 , 2SK3869 , 2SK3903 , 2SK3904 , 2SK3905 , 2SK3907 , IRFB3306 , 2SK3934 , 2SK3935 , 2SK3947 , 2SK3994 , 2SK4002 , 2SK4012 , 2SK4015 , 2SK4016 .

Keywords

 2SK3911 Datasheet  2SK3911 Datenblatt  2SK3911 RoHS  2SK3911 Distributor
 2SK3911 Application Notes  2SK3911 Component  2SK3911 Circuit  2SK3911 Schematic
 2SK3911 Equivalent  2SK3911 Cross Reference  2SK3911 Data Sheet  2SK3911 Fiche Technique

 

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