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IXTQ40N50Q
MOSFET transistor datasheet. Parameters and characteristics. Type Designator: IXTQ40N50Q
Type of IXTQ40N50Q
transistor: MOSFET
Type of control channel: N
-Channel Maximum power dissipation (Pd), W: 500
Maximum drain-source voltage |Uds|, V: 500V
Maximum gate-source voltage |Ugs|, V:
Maximum drain current |Id|, A: 40
Maximum junction temperature (Tj), °C:
Rise Time of IXTQ40N50Q
transistor (tr), nS: 600ns
Drain-source Capacitance (Cd), pF:
Maximum drain-source on-state resistance (Rds), Ohm: 0.14
Package: TO3P
Equivalent transistors for IXTQ40N50Q
IXTQ40N50Q
PDF documents for downloads:
5.1. ixta460p2-ixtp460p2-ixtq460p2-ixth460p2.pdf Size:154K _ixys |
| PolarP2TM VDSS = 500V
IXTA460P2
ID25 = 24A
Power MOSFET
IXTP460P2
? ?
RDS(on) ? ?
? 270m?
? ?
? ?
IXTQ460P2
N-Channel Enhancement Mode
trr(typ) = 400ns
Avalanche Rated IXTH460P2
Fast Intrinsic Diode
TO-220AB (IXTP)
TO-263 AA (IXTA)
TO-3P (IXTQ)
G
G
S D
G
D S
D (Tab)
D (Tab) S
D (Tab)
Symbol Test Conditions Maximum Ratings
VDSS TJ = 25°C to 150°C 500 V
VDGR TJ = 25°C to 150°C, RGS = 1M? 500 V TO-247 (IXTH)
VGSS Continuous ± 30 V
VGSM Transient ± 40 V
ID25 TC = 25°C24 A
IDM TC = 25°C, Pulse Width Limited by TJM 50 A G
D
D (Tab)
S
IA TC = 25°C12 A
EAS TC = 25°C 750 mJ
G = Gate D = Drain
dv/dt IS ? IDM, VDD ? VDSS, TJ ? 150°C 15 V/ns
S = Source Tab = Drain
PD TC = 25°C 480 W
TJ -55 ... +150 °C
TJM 150 °C
Tstg -55 ... +150 °C
Features
TL Maximum Lead Temperature for Soldering 300 °C
Avalanche Rated
TSOLD Plastic Body for 10s 260 °C
Fast Intrinsic Diode
FC Mounting Force TO-263 10..65 / 2.2..14.6 Nm/lb.in.
Dynamic dv/dt Rated
Md Mo |
5.2. ixtq470p2.pdf Size:89K _ixys |
| Advance Technical Information
PolarP2TM VDSS = 500V
IXTQ470P2
ID25 = 42A
Power MOSFET
? ?
RDS(on) ? ?
? 145m?
? ?
? ?
trr(typ) = 400ns
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
TO-3P
Symbol Test Conditions Maximum Ratings
VDSS TJ = 25°C to 150°C 500 V
VDGR TJ = 25°C to 150°C, RGS = 1M? 500 V
G
D
VGSS Continuous ± 30 V
S
Tab
VGSM Transient ± 40 V
ID25 TC = 25°C42 A
G = Gate D = Drain
IDM TC = 25°C, Pulse Width Limited by TJM 126 A
S = Source Tab = Drain
IA TC = 25°C42 A
EAS TC = 25°C 1.3 J
dv/dt IS ? IDM, VDD ? VDSS, TJ ? 150°C 10 V/ns
PD TC = 25°C 830 W
Features
TJ -55 ... +150 °C
TJM 150 °C Avalanche Rated
Tstg -55 ... +150 °C
Fast Intrinsic Diode
Dynamic dv/dt Rated
TL Maximum Lead Temperature for Soldering 300 °C
Low Package Inductance
TSOLD Plastic Body for 10s 260 °C
Md Mounting Torque 1.13/10 Nm/lb.in.
Advantages
Weight 5.5 g
High Power Density
Easy to Mount
Space Savings
Applications
Symbo |
5.3. ixta42n25p_ixtp42n25p_ixtq42n25p.pdf Size:252K _ixys |
| IXTA 42N25P VDSS = 250 V
PolarHTTM
IXTP 42N25P ID25 = 42 A
Power MOSFET
? ?
IXTQ 42N25P RDS(on) ? 84 m?
? ?
? ?
? ?
N-Channel Enhancement Mode
Avalanche Rated
TO-263 (IXTA)
Symbol Test Conditions Maximum Ratings
G
VDSS TJ = 25° C to 150° C 250 V
S
VDGR TJ = 25° C to 150° C; RGS = 1 M? 250 V (TAB)
VGS Continuous ±20 V
TO-220 (IXTP)
VGSM Transient ±30 V
ID25 TC = 25° C42 A
IDM TC = 25° C, pulse width limited by TJM 110 A
IAR TC = 25° C42 A
(TAB)
G
D
S
EAR TC = 25° C30 mJ
EAS TC = 25° C 1.0 J
TO-3P (IXTQ)
dv/dt IS ?IDM, di/dt ?100 A/µs, VDD ?VDSS, 10 V/ns
TJ ?150° C, RG = 10 ?
PD TC = 25° C 300 W
TJ -55 ... +150 °C
G
TJM 150 °C
D
(TAB)
S
Tstg -55 ... +150 °C
TL 1.6 mm (0.062 in.) from case for 10 s 300 °C
TSOLD Plastic body for 10 s 260 ° C
G = Gate D = Drain
S = Source TAB = Drain
Md Mounting torque (TO-3P / TO-220) 1.13/10 Nm/lb.in.
Weight TO-3P 5.5 g
TO-220 4 g
Features
TO-263 3 g
l
International standard packages
l
Unclamped Inductiv |
5.4. ixtp450p2_ixth450p2_ixtq450p2.pdf Size:111K _ixys |
| Advance Technical Information
PolarP2TM VDSS = 500V
IXTP450P2
ID25 = 16A
Power MOSFET
IXTQ450P2
? ?
RDS(on) ? ?
? 330m?
? ?
? ?
IXTH450P2
trr(typ) = 400ns
N-Channel Enhancement Mode
Avalanche Rated
TO-220AB (IXTP)
Fast Intrinsic Diode
G
D
Tab
S
Symbol Test Conditions Maximum Ratings
VDSS TJ = 25°C to 150°C 500 V
TO-3P (IXTQ)
VDGR TJ = 25°C to 150°C, RGS = 1M? 500 V
VGSS Continuous ± 30 V
VGSM Transient ± 40 V
G
D
ID25 TC = 25°C16 A
S
IDM TC = 25°C, Pulse Width Limited by TJM 35 A
Tab
IA TC = 25°C16 A
TO-247(IXTH)
EAS TC = 25°C 750 mJ
dv/dt IS ? IDM, VDD ? VDSS, TJ ? 150°C 10 V/ns
PD TC = 25°C 300 W
TJ -55 ... +150 °C G
D
Tab
TJM 150 °C
S
Tstg -55 ... +150 °C
G = Gate D = Drain
TL Maximum Lead Temperature for Soldering 300 °C
S = Source Tab = Drain
TSOLD Plastic Body for 10s 260 °C
Md Mounting Torque 1.13/10 Nm/lb.in.
Features
Weight TO-220 3.0 g
TO-3P 5.5 g
Avalanche Rated
TO-247 6.0 g
Fast Intrinsic Diode
Dynamic dv/dt Ra |
5.5. ixtq44n50p.pdf Size:148K _ixys |
| IXTQ 44N50P VDSS = 500 V
PolarHVTM
ID25 = 44 A
Power MOSFET
? ?
RDS(on) ? 140 m?
? ?
? ?
? ?
N-Channel Enhancement Mode
Avalanche Rated
Symbol Test Conditions Maximum Ratings
TO-3P (IXTQ)
VDSS TJ = 25° C to 150° C 500 V
VDGR TJ = 25° C to 150° C; RGS = 1 M? 500 V
VGS Continuous ±30 V
VGSM Transient ±40 V
G
ID25 TC = 25° C44 A
D
(TAB)
IDM TC = 25° C, pulse width limited by TJM 110 A
S
IAR TC = 25° C44 A
EAR TC = 25° C55 mJ
G = Gate D = Drain
EAS TC = 25° C 1.7 J
S = Source TAB = Drain
dv/dt IS ?IDM, di/dt ?100 A/µs, VDD ?VDSS, 10 V/ns
TJ ?150° C, RG = 10 ?
PD TC = 25° C 650 W
TJ -55 ... +150 °C
Features
TJM 150 °C
Tstg -55 ... +150 °C
l
International standard packages
l
Unclamped Inductive Switching (UIS)
TL 1.6 mm (0.062 in.) from case for 10 s 300 °C
TSOLD Plastic body for 10 s 260 °C rated
l
Low package inductance
Md Mounting torque(TO-247) 1.13/10 Nm/lb.in.
- easy to drive and to protect
Weight 6g
Advantages
l
Easy to mount
l
Symbol |
5.6. ixtq480p2.pdf Size:89K _ixys |
| Advance Technical Information
PolarP2TM VDSS = 500V
IXTQ480P2
ID25 = 52A
Power MOSFET
? ?
RDS(on) ? ?
? 120m?
? ?
? ?
trr(typ) = 400ns
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
TO-3P
Symbol Test Conditions Maximum Ratings
VDSS TJ = 25°C to 150°C 500 V
VDGR TJ = 25°C to 150°C, RGS = 1M? 500 V
G
D
VGSS Continuous ± 30 V
S
Tab
VGSM Transient ± 40 V
ID25 TC = 25°C52 A
G = Gate D = Drain
IDM TC = 25°C, Pulse Width Limited by TJM 150 A
S = Source Tab = Drain
IA TC = 25°C52 A
EAS TC = 25°C 1.5 J
dv/dt IS ? IDM, VDD ? VDSS, TJ ? 150°C 10 V/ns
PD TC = 25°C 960 W
Features
TJ -55 ... +150 °C
TJM 150 °C Avalanche Rated
Tstg -55 ... +150 °C
Fast Intrinsic Diode
Dynamic dv/dt Rated
TL Maximum Lead Temperature for Soldering 300 °C
Low Package Inductance
TSOLD Plastic Body for 10s 260 °C
Md Mounting Torque 1.13/10 Nm/lb.in.
Advantages
Weight 5.5 g
High Power Density
Easy to Mount
Space Savings
Applications
Symbo |
See also transistors datasheet: IXTQ30N50P
, IXTQ30N60L2
, IXTQ30N60P
, IXTQ32P20T
, IXTQ36N30P
, IXTQ36N50P
, IXTQ36P15P
, IXTQ40N50L2
, BSS138
, IXTQ42N25P
, IXTQ44N50P
, IXTQ44P15T
, IXTQ450P2
, IXTQ460P2
, IXTQ470P2
, IXTQ480P2
, IXTQ48N20T
. Keywords| IXTQ40N50Q
Datasheet | IXTQ40N50Q
Datenblatt | IXTQ40N50Q
RoHS | IXTQ40N50Q
Distributor | | IXTQ40N50Q
Application Notes | IXTQ40N50Q
Component | IXTQ40N50Q
Circuit | IXTQ40N50Q
Schematic | | IXTQ40N50Q
Equivalent | IXTQ40N50Q
Cross Reference | IXTQ40N50Q
Data Sheet | IXTQ40N50Q
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