SIGC03T60SE Todos los transistores

 ..1. Size:117K  infineon
 sigc03t60se.pdf

SIGC03T60SE IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package S

 4.1. Size:75K  infineon
 sigc03t60snc.pdf

SIGC03T60SNC IGBT Chip in NPT-technology C FEATURES This chip is used for 600V NPT technology 100 m chip IGBT Modules short circuit prove positive temperature coefficient G Applications E easy paralleling drives Chip Type VCE ICn Die Size Package Ordering Code Q67041-A3000- SIGC03T60SNC 600V 2A 1.78 x 1.78 mm2 sawn on foil A002 ME

 5.1. Size:57K  infineon
 sigc03t60e.pdf

SIGC03T60E IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods E easy paralleling resonant applications Chip Type VCE IC Die Size Packag

 9.1. Size:56K  infineon
 sigc04t60.pdf

SIGC04T60E IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods E easy paralleling resonant applications Chip Type VCE IC Die Size Packag

 9.2. Size:76K  infineon
 sigc04t60g.pdf

SIGC04T60G IGBT3 Chip FEATURES This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses short tail current Applications positive temperature coefficient drives G easy paralleling white goods E resonant applications Chip Type VCE ICn Die Size Pac

 9.3. Size:64K  infineon
 sigc06t120cs.pdf

SIGC06T120CS IGBT Chip in NPT-technology C FEATURES This chip is used for 1200V NPT technology 180 m chip SGP02N120 short circuit prove positive temperature coefficient Applications G easy paralleling drives, SMPS, resonant E applications Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4115- SIGC06T120CS 1200V 2A 2.45 x 2.25

 9.4. Size:116K  infineon
 sigc08t65e.pdf

SIGC08T65E IGBT3 Chip Features Recommended for 650V Trench & Field Stop technology power modules low VCE(sat) C low turn-off losses Applications short tail current drives positive temperature coefficient easy paralleling G E Qualified according to JEDEC for target applications Chip Type VCE ICn1 ) Die Size Package SIGC08T65E 650

 9.5. Size:75K  infineon
 sigc06t60.pdf

SIGC06T60 IGBT3 Chip FEATURES This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses short tail current Applications positive temperature coefficient drives G easy paralleling white goods E resonant applications Chip Type VCE ICn Die Size Pack

 9.6. Size:105K  infineon
 sigc06t60ge.pdf

SIGC06T60GE IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package S

 9.7. Size:64K  infineon
 sigc07t60un.pdf

SIGC07T60UN High Speed IGBT Chip in NPT-technology C FEATURES This chip is used for low Eoff SKB06N60HS 600V NPT technology 100 m chip G Applications short circuit prove E Welding positive temperature coefficient PFC easy paralleling UPS Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4220- SIGC07T60UN 60

 9.8. Size:116K  infineon
 sigc08t60se.pdf

SIGC08T60SE IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package S

 9.9. Size:117K  infineon
 sigc06t65e.pdf

SIGC06T65E IGBT3 Chip Features Recommended for 650V Trench & Field Stop technology power modules low VCE(sat) C low turn-off losses Applications short tail current drives positive temperature coefficient easy paralleling G E Qualified according to JEDEC for target applications Chip Type VCE ICn1 ) Die Size Package SIGC06T65E 650

 9.10. Size:75K  infineon
 sigc07t60snc.pdf

SIGC07T60SNC IGBT Chip in NPT-technology C FEATURES 600V NPT technology This chip is used for 100 m chip DuoPack SKP06N60 short circuit prove positive temperature coefficient G Applications E easy paralleling drives Chip Type VCE ICn Die Size Package Ordering Code Q67041-A4672- SIGC07T60SNC 600V 6A 2.6 x 2.6 mm2 sawn on foil A003 Q6

 9.11. Size:74K  infineon
 sigc08t60.pdf

SIGC08T60 IGBT3 Chip FEATURES This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses short tail current Applications positive temperature coefficient drives G easy paralleling white goods E resonant applications Chip Type VCE ICn Die Size Pack

 9.12. Size:58K  infineon
 sigc04t60ge.pdf

SIGC04T60GE IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods E easy paralleling resonant applications Chip Type VCE IC Die Size Packa

 9.13. Size:72K  infineon
 sigc04t60gs.pdf

SIGC04T60GS IGBT3 Chip FEATURES This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses short tail current Applications positive temperature coefficient drives G easy paralleling white goods E resonant applications Chip Type VCE ICn Die Size Pa

 9.14. Size:116K  infineon
 sigc06t60e.pdf

SIGC06T60E IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package SI

 9.15. Size:75K  infineon
 sigc05t60snc.pdf

SIGC05T60SNC IGBT Chip in NPT-technology C FEATURES This chip is used for 600V NPT technology 100 m chip DuoPack SGP04N60 short circuit prove positive temperature coefficient G Applications E easy paralleling drives Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4149- SIGC05T60SNC 600V 4A 2.29 x 2.29 mm2 sawn on foil A101

 9.16. Size:116K  infineon
 sigc08t60s.pdf

SIGC08T60SE IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package S

 9.17. Size:56K  infineon
 sigc04t60e.pdf

SIGC04T60E IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods E easy paralleling resonant applications Chip Type VCE IC Die Size Packag

 9.18. Size:116K  infineon
 sigc08t60e.pdf

SIGC08T60E IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package SI

 9.19. Size:116K  infineon
 sigc04t65e.pdf

SIGC04T65E IGBT3 Chip Features Recommended for 650V Trench & Field Stop technology power modules low VCE(sat) C low turn-off losses Applications short tail current drives positive temperature coefficient easy paralleling G E Qualified according to JEDEC for target applications Chip Type VCE ICn1 ) Die Size Package SIGC04T65E 650

 9.20. Size:105K  infineon
 sigc06t60g.pdf

SIGC06T60GE IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package S

 9.21. Size:118K  infineon
 sigc04t60gse.pdf

SIGC04T60GSE IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package

 9.22. Size:64K  infineon
 sigc07t60nc.pdf

SIGC07T60NC IGBT Chip in NPT-technology C FEATURES This chip is used for 600V NPT technology 100 m chip IGBT-Modules positive temperature coefficient easy paralleling G Applications E drives Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4134- SIGC07T60NC 600V 6A 2.6 x 2.6 mm2 sawn on foil A001 MECHANICAL PARAMETER mm2 Ra