IGC06R60D Todos los transistores

 ..1. Size:145K  infineon
 igc06r60d.pdf

IGC06R60D TRENCHSTOPTM RC-Series for hard switching applications IGBT chip with monolithically integrated diode in packages offering space saving advantage Features TRENCHSTOPTM Reverse Conducting (RC) technology for 600V applications offering Optimised VCEsat and VF for low conduction losses Smooth switching performance leading to low EMI levels Very tight param

 0.1. Size:116K  infineon
 igc06r60de.pdf

IGC06R60DE TRENCHSTOPTM RC-Series for hard switching applications IGBT chip with monolithically integrated diode in packages offering space saving advantage Features TRENCHSTOPTM Reverse Conducting (RC) technology for 600V applications offering Optimised VCEsat and VF for low conduction losses Smooth switching performance leading to low EMI levels Very tight parameter dist

 9.1. Size:64K  infineon
 sigc06t120cs.pdf

SIGC06T120CS IGBT Chip in NPT-technology C FEATURES This chip is used for 1200V NPT technology 180 m chip SGP02N120 short circuit prove positive temperature coefficient Applications G easy paralleling drives, SMPS, resonant E applications Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4115- SIGC06T120CS 1200V 2A 2.45 x 2.25

 9.2. Size:75K  infineon
 sigc06t60.pdf

SIGC06T60 IGBT3 Chip FEATURES This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses short tail current Applications positive temperature coefficient drives G easy paralleling white goods E resonant applications Chip Type VCE ICn Die Size Pack

 9.3. Size:105K  infineon
 sigc06t60ge.pdf

SIGC06T60GE IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package S

 9.4. Size:117K  infineon
 sigc06t65e.pdf

SIGC06T65E IGBT3 Chip Features Recommended for 650V Trench & Field Stop technology power modules low VCE(sat) C low turn-off losses Applications short tail current drives positive temperature coefficient easy paralleling G E Qualified according to JEDEC for target applications Chip Type VCE ICn1 ) Die Size Package SIGC06T65E 650

 9.5. Size:116K  infineon
 sigc06t60e.pdf

SIGC06T60E IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package SI

 9.6. Size:105K  infineon
 sigc06t60g.pdf

SIGC06T60GE IGBT3 Chip Features This chip is used for 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses Applications short tail current drives positive temperature coefficient G white goods easy paralleling E resonant applications Chip Type VCE IC Die Size Package S