FQT2P25 MOSFET Equivalente. Reemplazo. Hoja de especificaciones. Principales características
Número de Parte: FQT2P25
Tipo de FET: MOSFET
Polaridad de transistor: P
ESPECIFICACIONES MÁXIMAS
Pdⓘ - Máxima disipación de potencia: 2.5 W|Vds|ⓘ - Voltaje máximo drenador - fuente: 250 V
|Vgs|ⓘ - Voltaje máximo fuente - puerta: 30 V
|Id|ⓘ - Corriente continua de drenaje: 0.55 A
Tjⓘ - Temperatura máxima de unión: 150 °C
CARACTERÍSTICAS ELÉCTRICAS
trⓘ - Tiempo de subida: 40 nS
Cossⓘ - Capacitancia de salida: 40 pF
Rds(on)ⓘ - Resistencia estado encendido drenaje a fuente: 4 Ohm
Paquete / Cubierta: SOT223
Búsqueda de reemplazo de FQT2P25 MOSFET
FQT2P25 datasheet
fqt2p25.pdf
November 2013 FQT2P25 P-Channel QFET MOSFET -250 V, -0.55 A, 4.0 Description Features These P-Channel enhancement mode power field effect -0.55 A, -250 V, RDS(on) = 4.0 (Max.) @ VGS = -10 V, ID = -0.275 A transistors are produced using Fairchild s proprietary, planar stripe, DMOS technology. This advanced Low Gate Charge (Typ. 6.5 nC) technology has been especial
fqt2p25.pdf
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclatur
fqt2p25tf.pdf
May 2001 TM QFET FQT2P25 250V P-Channel MOSFET General Description Features These P-Channel enhancement mode power field effect -0.55A, -250V, RDS(on) = 4.0 @VGS = 10 V transistors are produced using Fairchild s proprietary, Low gate charge ( typical 6.5 nC) planar stripe, DMOS technology. Low Crss ( typical 6.5 pF) This advanced technology has been especially tailore
Otros transistores... FQA19N20C , FQA38N30 , FQB46N15 , FQI46N15 , FQP10N50CF , FDB86366F085 , FCH077N65FF085 , FCH190N65FF085 , IRF740 , FQU1N80 , FDC645N , SI3457DV , SSU1N50B , FDP070AN06A0 , FQPF5N60C , FQP9N50C , FQPF9N50C .
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