SSF2336 Todos los transistores

 

SSF2336 MOSFET. Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características


   Número de Parte: SSF2336
   Tipo de FET: MOSFET
   Polaridad de transistor: N

ESPECIFICACIONES MÁXIMAS


   Máxima disipación de potencia (Pd): 1.25 W
   Voltaje máximo drenador - fuente |Vds|: 20 V
   Voltaje máximo fuente - puerta |Vgs|: 12 V
   Corriente continua de drenaje |Id|: 4.2 A
   Temperatura máxima de unión (Tj): 150 °C

CARACTERÍSTICAS ELÉCTRICAS


   Tensión umbral entre puerta y fuente |Vgs(th)|: 1.2 V
   Carga de la puerta (Qg): 9 nC
   Tiempo de subida (tr): 50 nS
   Conductancia de drenaje-sustrato (Cd): 100 pF
   Resistencia entre drenaje y fuente RDS(on): 0.045 Ohm
   Paquete / Cubierta: SOT23

 Búsqueda de reemplazo de MOSFET SSF2336

 

SSF2336 Datasheet (PDF)

 ..1. Size:264K  silikron
ssf2336.pdf

SSF2336
SSF2336

SSF2336 DDESCRIPTION The SSF2336 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation Gwith gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. S Schematic diagram GENERAL FEATURES VDS = 20V,ID = 4.2A RDS(ON)

 9.1. Size:229K  silikron
ssf2314.pdf

SSF2336
SSF2336

SSF2314 DDESCRIPTION The SSF2314 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation Gwith gate voltages as low as 0.65V. This device is suitable for use as a Battery protection or in other Switching application. SSchematic diagram GENERAL FEATURES V = 20V,I = 4.5A DS DR

 9.2. Size:342K  silikron
ssf2300.pdf

SSF2336
SSF2336

SSF2300DDESCRIPTION The SSF2300 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation Gwith gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. SSchematic diagram GENERAL FEATURES VDS = 20V,ID = 2.4A RDS(ON)

 9.3. Size:401K  silikron
ssf2300a.pdf

SSF2336
SSF2336

SSF2300A DDESCRIPTION The SSF2300A uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation Gwith gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. S Schematic diagram GENERAL FEATURES VDS = 20V,ID = 4.5A RDS(ON)

 9.4. Size:200K  silikron
ssf2316e.pdf

SSF2336
SSF2336

SSF2316E GENERAL FEATURES VDS = 20V,ID = 7A RDS(ON)

 9.5. Size:535K  silikron
ssf2341e.pdf

SSF2336
SSF2336

SSF2341E Main Product Characteristics: VDSS -20V RDS(on) 37m (typ.) ID -4A Marking and pin SOT-23 Schematic diagram Assignme nt Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery

 9.6. Size:302K  silikron
ssf2306.pdf

SSF2336
SSF2336

SSF2306 DDESCRIPTION The SSF2306 uses advanced trench technology to provide excellent RDS(ON), Glow gate charge and operation with gate voltages as low as 2.5V. SGENERAL FEATURES Schematic diagram VDS = 30V,ID = 5A RDS(ON)

 9.7. Size:282K  silikron
ssf2301b.pdf

SSF2336
SSF2336

SSF2301BDDESCRIPTION The SSF2301B uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable Gfor use as a load switch or in PWM applications. SSchematic diagram GENERAL FEATURES VDS = -20V,ID = -2.8A RDS(ON)

 9.8. Size:302K  silikron
ssf2300b.pdf

SSF2336
SSF2336

SSF2300B DDESCRIPTION The SSF2300B uses advanced trench technology to provide excellent R , low gate charge and operation DS(ON)Gwith gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. S Schematic diagram GENERAL FEATURES V = 20V,I = 4.5A DS DR

 9.9. Size:317K  silikron
ssf2307b.pdf

SSF2336
SSF2336

SSF2307BDDESCRIPTION The SSF2307B uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable Gfor use as a load switch or in PWM applications. SSchematic diagram GENERAL FEATURES VDS = -20V,ID = -3A RDS(ON)

 9.10. Size:383K  silikron
ssf2356g8.pdf

SSF2336
SSF2336

SSF2356G8 Main Product Characteristics: VDSS 20V RDS(on) 0.4 (typ.) ID 0.54A SOT-363 Marking and P in Schematic Diagram Assignment Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery

 9.11. Size:341K  silikron
ssf2318e.pdf

SSF2336
SSF2336

SSF2318EDESCRIPTION The SSF2318E uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. GENERAL FEATURES VDS = 20V,ID =6.5A Schematic diagram RDS(ON)

 9.12. Size:275K  silikron
ssf2301a.pdf

SSF2336
SSF2336

SSF2301ADDESCRIPTION The SSF2301A uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable Gfor use as a load switch or in PWM applications. SSchematic diagram GENERAL FEATURES VDS = -20V,ID = -4A RDS(ON)

 9.13. Size:323K  silikron
ssf2305.pdf

SSF2336
SSF2336

SSF2305DDESCRIPTION The SSF2305 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 0.5V. This device is suitable Gfor use as a load switch or in PWM applications. SSchematic diagram GENERAL FEATURES VDS = -20V,ID = -3A RDS(ON)

 9.14. Size:566K  silikron
ssf2301.pdf

SSF2336
SSF2336

SSF2301 Main Product Characteristics: DVDSS -20V G RDS(on) 60m (typ.) SID -3A Marking and pin SOT-23 Schematic diagram Assignme nt Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body re

 9.15. Size:387K  silikron
ssf2302.pdf

SSF2336
SSF2336

SSF2302DDESCRIPTION The SSF2302 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation Gwith gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. SSchematic diagram GENERAL FEATURES VDS = 20V,ID = 2.4A D3RDS(ON)

 9.16. Size:281K  silikron
ssf2312.pdf

SSF2336
SSF2336

SSF2312DDESCRIPTION The SSF2312 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation Gwith gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. SSchematic diagram GENERAL FEATURES D VDS = 20V,ID = 4.5A 3RDS(ON)

 9.17. Size:445K  goodark
gdssf2300.pdf

SSF2336
SSF2336

GDSSF2300 DDESCRIPTION The SSF2300 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation Gwith gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. SSchematic diagram GENERAL FEATURES VDS = 20V,ID = 2.4A RDS(ON)

 9.18. Size:911K  cn vbsemi
ssf2341e.pdf

SSF2336
SSF2336

SSF2341Ewww.VBsemi.twP-Channel 20-V (D-S) MOSFETFEATURESMOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21VDS (V) RDS(on) ()ID (A)a Qg (Typ.)Definition0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFETe- 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/ECAPPLICATION

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