FTK2341E Todos los transistores

 ..1. Size:233K  first silicon
 ftk2341e.pdf

SEMICONDUCTOR FTK2341E TECHNICAL DATA DESCRIPTION The FTK2341E uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as -2.5V. GENERAL FEATURES VDS = -20V,ID =-4A Schematic diagram RDS(ON)

 9.1. Size:420K  first silicon
 ftk2306a.pdf

SEMICONDUCTOR FTK2306A TECHNICAL DATA N-Channel MOSFET ID V(BR)DSS RDS(on)MAX SOT-23 47m @10V 30V 3.16A 65m @4.5V 1. GATE 2. SOURCE 3. DRAIN FEATURE APPLICATION TrenchFET Power MOSFET Load Switch for Portable Devices DC/DC Converter MARKING Equivalent Circuit Maximum ratings (at TA=25 unless otherwise noted) Parameter Symbol Value Unit Drain-Source

 9.2. Size:281K  first silicon
 ftk2304.pdf

SEMICONDUCTOR FTK2304 TECHNICAL DATA D DESCRIPTION The FTK2304 uses advanced trench technology to G provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 4.5V. This device is suitable for use as a load switch or in PWM applications. S Schematic diagram GENERAL FEATURES D VDS = 30V ,ID = 3.3A 3 RDS(ON)

 9.3. Size:247K  first silicon
 ftk2302.pdf

SEMICONDUCTOR FTK2302 TECHNICAL DATA 20V N-Channel Enhancement-Mode MOSFET D DESCRIPTION The FTK2302 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation G with gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. S Schematic diagram GENERAL FEATURES VDS = 20V,I

 9.4. Size:185K  first silicon
 ftk2310.pdf

SEMICONDUCTOR FTK2310 TECHNICAL DATA FTK2310 N-Channel MOSFET D G DESCRIPTION The FTK2310 uses advanced trench technology to provide excellent S Schematic diagram RDS(ON) , low gate charge and operation with gate voltage as low as 2.5V. D 3 This device is suitable for use as a battery protection or in other switching S10 application. G 1 2 S Marking and pin Assignment F

 9.5. Size:648K  first silicon
 ftk2312.pdf

SEMICONDUCTOR FTK2312 TECHNICAL DATA D DESCRIPTION The FTK2312 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation G with gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. S Schematic diagram GENERAL FEATURES D VDS = 20V,ID = 4.5A 3 RDS(ON)

 9.6. Size:338K  first silicon
 ftk2324.pdf

SEMICONDUCTOR FTK2324 TECHNICAL DATA N-Channel MOSFET SOT-23 ID V(BR)DSS RDS(on)MAX 234m @10V 100V 267m @ 6V 2A 1. GATE 278m @4.5V 2. SOURCE 3. DRA N FEATURE APPLICATION TrenchFET Power MOSFET DC/DC Converters Low RDS(ON) Load Switch Surface Mount Package LED Backlighting in LCD TVs MARKING Equivalent Circuit ABSOLUTE MAXIMUM RATINGS (Ta=25 unless

 9.7. Size:429K  first silicon
 ftk2333.pdf

SEMICONDUCTOR FTK2333 TECHNICAL DATA P-channel MOSFET DESCRIPTION D The FTK2333 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 1.8V. This device is suitable for use as G a load switch applications. S GENERAL FEATURES Schematic diagram ID V(BR)DSS RDS(on) MAX 28m @ -4.5V 32m @-3.7V S33 -6A 4

 9.8. Size:344K  first silicon
 ftk2306.pdf

SEMICONDUCTOR FTK2306 TECHNICAL DATA D DESCRIPTION The FTK2306 uses advanced trench technology to provide excellent RDS(ON), G low gate charge and operation with gate voltages as low as 2.5V. S Schematic diagram GENERAL FEATURES D VDS = 30V,ID = 5A 3 RDS(ON)

 9.9. Size:284K  first silicon
 ftk2301.pdf

SEMICONDUCTOR FTK2301 TECHNICAL DATA 20V P-Channel Enhancement-Mode MOSFET 3 Features Low on-resistance 2 R =4.5V, I =2.8A ) = 100m DS(ON) (VGS ds 1 R =2.5V, I =2.0A ) = 150m DS(ON) (VGS ds SOT 23 (TO 236AB) High Density Cell Design For Ultra Low On-Resistance Fully Characterized Avalanche Voltage and Current Improved Shoot-Through FOM 3 D We declare that