SM3408NSQG Todos los transistores

 

SM3408NSQG MOSFET. Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características


   Número de Parte: SM3408NSQG
   Tipo de FET: MOSFET
   Polaridad de transistor: N

ESPECIFICACIONES MÁXIMAS

   Pdⓘ - Máxima disipación de potencia: 46 W
   |Vds|ⓘ - Voltaje máximo drenador - fuente: 150 V
   |Vgs|ⓘ - Voltaje máximo fuente - puerta: 25 V
   |Id|ⓘ - Corriente continua de drenaje: 16 A
   Tjⓘ - Temperatura máxima de unión: 150 °C

CARACTERÍSTICAS ELÉCTRICAS


   trⓘ - Tiempo de subida: 6 nS
   Cossⓘ - Capacitancia de salida: 100 pF
   Rds(on)ⓘ - Resistencia estado encendido drenaje a fuente: 0.07 Ohm
   Paquete / Cubierta: DFN3.3X3.3C-8

 Búsqueda de reemplazo de MOSFET SM3408NSQG

 

SM3408NSQG Datasheet (PDF)

 ..1. Size:148K  sino
sm3408nsqg.pdf

SM3408NSQG
SM3408NSQG

SM3408NSQGN-Channel Enhancement Mode MOSFETFeatures Pin DescriptionDDDD 150V/16A,RDS(ON) = 70m(max.) @ VGS =10VGSPin 1 100% UIS + Rg TestedSS Reliable and RuggedDFN3.3x3.3C-8_EP Lead Free and Green Devices Available (RoHS Compliant)(5,6,7,8)DDDDApplications (4) G Synchronous Rectification. DC-DC Converter.S S S Load Switch.( 1, 2, 3 )

 9.1. Size:242K  taiwansemi
tsm3400cx.pdf

SM3408NSQG
SM3408NSQG

TSM3400 30V N-Channel MOSFET PRODUCT SUMMARY SOT-23 Pin Definition: VDS (V) RDS(on)(m) ID (A) 1. Gate 2. Source 28 @ VGS = 10V 5.8 3. Drain 30 33 @ VGS = 4.5V 5.0 52 @ VGS = 2.5V 4.0 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application Load Switch PA Switch Ordering Infor

 9.2. Size:235K  taiwansemi
tsm3401cx.pdf

SM3408NSQG
SM3408NSQG

TSM3401 30V P-Channel MOSFET PRODUCT SUMMARY SOT-23 Pin Definition: 1. Gate VDS (V) RDS(on)(m) ID (A) 2. Source 60 @ VGS = 10V -3.0 3. Drain -30 90 @ VGS = 4.5V -2.0 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application Load Switch PA Switch P-Channel MOSFET Ordering Info

 9.3. Size:338K  taiwansemi
tsm3404cx.pdf

SM3408NSQG
SM3408NSQG

TSM3404 30V N-Channel MOSFET SOT-23 PRODUCT SUMMARY Pin Definition: 1. Gate VDS (V) RDS(on)(m) ID (A) 2. Source 3. Drain 30 @ VGS = 10V 5.8 30 43 @ VGS = 4.5V 5.0 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application Load Switch PA Switch Ordering Information Part No. Pac

 9.4. Size:165K  sino
sm3403psqg.pdf

SM3408NSQG
SM3408NSQG

SM3403PSQGP-Channel Enhancement Mode MOSFETFeatures Pin Description -20V/-95A,DDDDRDS(ON) = 3.6m(max.) @ VGS =-10VRDS(ON) = 4.6m(max.) @ VGS =-4.5VGSRDS(ON) = 7m(max.) @ VGS =-2.5V SSRDS(ON) = 10m(max.) @ VGS =-1.8VDFN3.3x3.3B-8_EP HBM ESD protection level of 2.3KV typical 100% UIS + Rg Tested( 5,6,7,8 )DDDD Reliable and Rugged Lead Free

 9.5. Size:154K  sino
sm3406nsqg.pdf

SM3408NSQG
SM3408NSQG

SM3406NSQGN-Channel Enhancement Mode MOSFETFeatures Pin DescriptionDDDD 20V/17.8A,RDS(ON) = 3.4m(max.) @ VGS =4.5VGRDS(ON) = 4.5m(max.) @ VGS =2.5V SPin 1SSRDS(ON) = 7m(max.) @ VGS =1.8V 100% UIS + Rg TestedDFN3.3x3.3C-8_EP Reliable and Rugged(5,6,7,8)DDDD Lead Free and Green Devices Available (RoHS Compliant)(4) GApplications Power M

 9.6. Size:165K  sino
sm3404nsqg.pdf

SM3408NSQG
SM3408NSQG

SM3404NSQGN-Channel Enhancement Mode MOSFETFeatures Pin DescriptionDDD 30V/50A, DRDS(ON) =2.8m(max.) @ VGS =10VRDS(ON) =3.6m(max.) @ VGS =4.5VGSSS ESD protectionDFN3.3x3.3-8(Saw-EP) 100% UIS + Rg Tested Avalanche Rated(5,6,7,8)DDDD Reliable and Rugged Lead Free and Green Devices Available(RoHS Compliant)(4) GApplications Power Management

 9.7. Size:165K  sino
sm3405nsqg.pdf

SM3408NSQG
SM3408NSQG

SM3405NSQGN-Channel Enhancement Mode MOSFETFeatures Pin DescriptionDDD 30V/50A, DRDS(ON) = 3.2m(max.) @ VGS =4.5VRDS(ON) = 4m(max.) @ VGS =2.5VGSSS ESD protectionDFN3.3x3.3-8(Saw-EP) 100% UIS + Rg Tested Avalanche Rated(5,6,7,8)DDDD Reliable and Rugged Lead Free and Green Devices Available(RoHS Compliant)(4) GApplications Power Managemen

 9.8. Size:151K  sino
sm3402nsqg.pdf

SM3408NSQG
SM3408NSQG

SM3402NSQGN-Channel Enhancement Mode MOSFETFeatures Pin DescriptionDDD 30V/50A,DRDS(ON) =4.6m(max.) @ VGS =10VRDS(ON) =6.2m(max.) @ VGS =4.5VSGSS ESD ProtectedDFN3x3D-8_EP Avalanche Rated 100% UIS + Rg Tested(5,6,7,8)DDDD Reliable and Rugged Lead Free and Green Devices Available (RoHS Compliant)(4) GApplications Power Management in Noteb

 9.9. Size:152K  sino
sm3401nsqg.pdf

SM3408NSQG
SM3408NSQG

SM3401NSQGN-Channel Enhancement Mode MOSFETFeatures Pin DescriptionDDD 30V/50A, DRDS(ON) =2.8m(max.) @ VGS =10VRDS(ON) =3.6m(max.) @ VGS =4.5VGSSS 100% UIS + Rg TestedDFN3.3x3.3-8(Saw-EP) Avalanche Rated Reliable and Rugged(5,6,7,8)D D DD Lead Free and Green Devices Available(RoHS Compliant)Applications (4) G Power Management in Notebook Com

 9.10. Size:248K  sino
sm3407psqa.pdf

SM3408NSQG
SM3408NSQG

SM3407PSQAP-Channel Enhancement Mode MOSFETFeatures Pin DescriptionD -20V/-11A,DDDRDS(ON) = 17m (max.) @ VGS =-4.5VRDS(ON) = 25m (max.) @ VGS =-2.5VGSSRDS(ON) = 45m (max.) @ VGS =-1.8V S Reliable and RuggedDFN3.3x3.3A-8_EP Lead Free and Green Devices Available(RoHS Compliant)( 5,6,7,8 )DDDD HBM ESD protection level pass 2KVNote : The diode connected

 9.11. Size:891K  globaltech semi
gsm3400.pdf

SM3408NSQG
SM3408NSQG

GSM3400 GSM3400 30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3400, N-Channel enhancement mode 30V/4.0A,RDS(ON)=48m@VGS=10V MOSFET, uses Advanced Trench 30V/3.5A,RDS(ON)=52m@VGS=4.5V Technology to provide excellent RDS(ON), low 30V/2.8A,RDS(ON)=58m@VGS=2.5V gate charge. These devices are particularly Super high density cell des

 9.12. Size:867K  globaltech semi
gsm3404.pdf

SM3408NSQG
SM3408NSQG

GSM3404 30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3404, N-Channel enhancement mode 30V/4.0A,RDS(ON)=30m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/3.2A,RDS(ON)=34m@VGS=4.5V provide excellent RDS(ON) ,low gate charge. Super high density cell design for extremely These devices are particularly suited for low low RDS (ON) Volta

 9.13. Size:898K  globaltech semi
gsm3403a.pdf

SM3408NSQG
SM3408NSQG

GSM3403A GSM3403A 30V P-Channel Enhancement Mode MOSFET Product Description Features -30V/-2.6A,RDS(ON)=130m@VGS=-10V GSM3403A, P-Channel enhancement mode -30V/-2.2A,RDS(ON)=160m@VGS=-4.5V MOSFET, uses Advanced Trench Technology to -30V/-1.2A,RDS(ON)=270m@VGS=-2.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremel

 9.14. Size:453K  globaltech semi
gsm3402a.pdf

SM3408NSQG
SM3408NSQG

30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3402A, N-Channel enhancement mode 30V/2.4A,RDS(ON)=82m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/2.0A,RDS(ON)=87m@VGS=4.5V provide excellent RDS(ON), low gate charge. 30V/1.5A,RDS(ON)=110m@VGS=2.5V These devices are particularly suited for low Super high density cell design for

 9.15. Size:922K  globaltech semi
gsm3400a.pdf

SM3408NSQG
SM3408NSQG

GSM3400A 30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3400A, N-Channel enhancement mode 30V/2.4A,RDS(ON)=54m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/1.8A,RDS(ON)=58m@VGS=4.5V provide excellent RDS(ON), low gate charge. 30V/1.5A,RDS(ON)=65m@VGS=2.5V Super high density cell design for These devices are particularly suited for lo

 9.16. Size:885K  globaltech semi
gsm3406s.pdf

SM3408NSQG
SM3408NSQG

30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3406S, N-Channel enhancement mode 30V/4.0A,RDS(ON)=40m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/3.5A,RDS(ON)=50m@VGS=4.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely These devices are particularly suited for low low RDS (ON) voltage power

 9.17. Size:864K  globaltech semi
gsm3407s.pdf

SM3408NSQG
SM3408NSQG

GSM3407S 30V P-Channel Enhancement Mode MOSFET Product Description Features GSM3407S, P-Channel enhancement mode -30V/-3.6A,RDS(ON)=75m@VGS=-10V MOSFET, uses Advanced Trench Technology to -30V/-3.2A,RDS(ON)=95m@VGS=-4.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely low RDS (ON) These devices are particularly suited for

 9.18. Size:851K  globaltech semi
gsm3405.pdf

SM3408NSQG
SM3408NSQG

GSM3405 GSM3405 30V P-Channel Enhancement Mode MOSFET Product Description Features GSM3405, P-Channel enhancement mode -30V/-4.0A,RDS(ON)=40m@VGS=-10V MOSFET, uses Advanced Trench Technology to -30V/-2.8A,RDS(ON)=50m@VGS=-4.5V provide excellent RDS(ON) low gate charge. These Super high density cell design for extremely devices are particularly suited for low

 9.19. Size:884K  globaltech semi
gsm3406.pdf

SM3408NSQG
SM3408NSQG

30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3406, N-Channel enhancement mode 30V/4.0A,RDS(ON)=42m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/3.5A,RDS(ON)=52m@VGS=4.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely These devices are particularly suited for low low RDS (ON) voltage power

 9.20. Size:846K  globaltech semi
gsm3407as.pdf

SM3408NSQG
SM3408NSQG

30V P-Channel Enhancement Mode MOSFET Product Description Features GSM3407AS, P-Channel enhancement mode -30V/-2.8A,RDS(ON)=77m@VGS=-10.0V MOSFET, uses Advanced Trench Technology to -30V/-2.4A,RDS(ON)=102m@VGS=-4.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely These devices are particularly suited for low low RDS (ON)

 9.21. Size:1144K  globaltech semi
gsm3402.pdf

SM3408NSQG
SM3408NSQG

GSM3402 GSM3402 30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3402, N-Channel enhancement mode 30V/4.0A,RDS(ON)=75m@VGS=10V MOSFET, uses Advanced Trench 30V/3.5A,RDS(ON)=80m@VGS=4.5V Technology to provide excellent RDS(ON), low 30V/2.8A,RDS(ON)=100m@VGS=2.5V gate charge. These devices are particularly Super high density cell de

 9.22. Size:863K  globaltech semi
gsm3406a.pdf

SM3408NSQG
SM3408NSQG

30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3406A, N-Channel enhancement mode 30V/2.4A,RDS(ON)=48m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/1.8A,RDS(ON)=58m@VGS=4.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely These devices are particularly suited for low low RDS (ON) voltage power

 9.23. Size:1426K  globaltech semi
gsm3401s.pdf

SM3408NSQG
SM3408NSQG

GSM3401S GSM3401S 30V P-Channel Enhancement Mode MOSFET Product Description Features GSM3401S, P-Channel enhancement mode -30V/-4.0A RDS(ON)=65m@VGS=-10V MOSFET, uses Advanced Trench Technology -30V/-3.2A RDS(ON)=80m@VGS=-4.5V to provide excellent RDS(ON), low gate charge. -30V/-1.0A RDS(ON)=105m@VGS=-2.5V Super high density cell design for extremely These devi

 9.24. Size:898K  globaltech semi
gsm3403.pdf

SM3408NSQG
SM3408NSQG

GSM3403 GSM3403 30V P-Channel Enhancement Mode MOSFET Product Description Features -30V/-3.0A,RDS(ON)=125m@VGS=-10V GSM3403, P-Channel enhancement mode -30V/-2.6A,RDS(ON)=155m@VGS=-4.5V MOSFET, uses Advanced Trench Technology to -30V/-1.2A,RDS(ON)=220m@VGS=-2.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely

 9.25. Size:452K  globaltech semi
gsm3400as.pdf

SM3408NSQG
SM3408NSQG

30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3400AS, N-Channel enhancement mode 30V/2.8A,RDS(ON)=50m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/2.5A,RDS(ON)=55m@VGS=4.5V provide excellent RDS(ON), low gate charge. 30V/2.2A,RDS(ON)=75m@VGS=2.5V These devices are particularly suited for low Super high density cell design for

 9.26. Size:877K  globaltech semi
gsm3406as.pdf

SM3408NSQG
SM3408NSQG

30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3406AS, N-Channel enhancement mode 30V/2.8A,RDS(ON)=45m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/2.4A,RDS(ON)=55m@VGS=4.5V provide excellent RDS(ON), low gate charge. These Super high density cell design for extremely devices are particularly suited for low voltage low RDS (ON) powe

 9.27. Size:612K  globaltech semi
gsm3401as.pdf

SM3408NSQG
SM3408NSQG

30V P-Channel Enhancement Mode MOSFET Product Description Features GSM3401AS, P-Channel enhancement mode -30V/-2.4 RDS(ON)=70m@VGS=-10.0V MOSFET, uses Advanced Trench Technology to -30V/-1.8 RDS(ON)=80m@VGS=-4.5V provide excellent RDS(ON), low gate charge. -30V/-1.2 RDS(ON)=105m@VGS=-2.5V These devices are particularly suited for low Super high density cell de

 9.28. Size:921K  globaltech semi
gsm3400s.pdf

SM3408NSQG
SM3408NSQG

GSM3400S GSM3400S 30V N-Channel Enhancement Mode MOSFET Product Description Features 30V/4.0A,RDS(ON)=42m@VGS=10V GSM3400S, N-Channel enhancement mode 30V/3.0A,RDS(ON)=44m@VGS=4.5V MOSFET, uses Advanced Trench Technology 30V/2.6A,RDS(ON)=50m@VGS=2.5V to provide excellent RDS(ON), low gate charge. Super high density cell design for extremely low RDS (ON) The

 9.29. Size:605K  jsmsemi
jsm3400.pdf

SM3408NSQG
SM3408NSQG

JSM3400N-Channel 30-V(D-S) MOSFETV(BR)DSS RDS(on)MAX IDSOT-23 SOT-23-3L/0.028@ 10V31.GATE30V5.8A0.033@ 4.5V2.SOURCE3.DRAIN10.052@ 2.5V2General FEATUREEquivalent CircuitMARKINGTrenchFET Power MOSFETLead free product is acquiredSurface mount packageA01TF wAPPLICATION*wweek codeLoad Switch for Portable DevicesDC/DC Convert

 9.30. Size:546K  jsmsemi
jsm3401l.pdf

SM3408NSQG
SM3408NSQG

JSM3401LP-Channel 30-V(D-S) MOSFETV(BR)DSS RDS(on)MAX IDSOT-23-3L0.053@-10V3-30V 0.065@-4.5V 1.GATE-4.2A2.SOURCE0.085@-2.5V3.DRAIN12MARKING Equivalent CircuitGeneral FEATURETrenchFET Power MOSFETLead free product is acquiredSurface mount packageA19TF wAPPLICATION*wweek codeLoad Switch for Portable DevicesDC/DC ConverterMaximu

 9.31. Size:9601K  cn sps
sm3401.pdf

SM3408NSQG
SM3408NSQG

SM3401Features Schematic diagram SOT-23Top ViewGDSPRODUCT SUMMARY VDSS ID RDS(on) (m-ohm) Max 52@ VGS = -10V65@ VGS = -4.5V -30V -4.4A 85 @ VGS =- 2.5V Ordering Information Ordering Number Pin AssignmentPackage PackingLead Free Halogen Free 1 2 3 SM3401SR GSM3401SR L SOT-23 G S D Tape ReelSM3401 X X X (1) SSOT-23(1)Packa

 9.32. Size:3541K  cn sps
sm3407.pdf

SM3408NSQG
SM3408NSQG

SM3407P-Channel Enhancement-Mode MOSFET (-30V, -4.3A)Pb PRODUCT SUMMARY VDSS ID RDS(on) (m-ohm) Max 60 @ VGS = -10 V,ID=-4.3A -30V -4.3A 78 @ VGS = -4.5V,ID=-3.0A Features 1 Super high dense cell trench design for low RDS(on). 2 Rugged and reliable. 3 SOT-23 package 4 RoHS Compliant.SM3407 Pin Assignment & Symbol Ordering Information

 9.33. Size:4431K  cn sps
sm3400.pdf

SM3408NSQG
SM3408NSQG

SM3400N-Channel Enhancement Mode Field Effect TransistorP-Channel Enhancement-Mode MOSFETFeatures 1Advanced Trench Process Technology. 2High Density Cell Design for Ultra Low On-Resistance. 3Improved Shoot-Through FOM 4RoHS Compliant D SOT-23Top ViewGDSG S PRODUCT SUMMARY VDSS ID RDS(on) (m-ohm) Max 28@ VGS = 10V33 @ VGS = 4.5V 30V 5.8A

 9.34. Size:771K  cn sps
sm3402srl.pdf

SM3408NSQG
SM3408NSQG

SM3402SRL30V /4A Single N Power MOSFET B N03B N 30V /4A Single N Power MOSFET 4N03BGeneral Description 30 VV DS30V /4A Single N Power MOSFET 45.5 mRDS(on),TYP@VGS=10VVery low on-resistance RDS(on) @ VGS=4.5 V 71.5 mRDS(on),TYP@VGS=4.5Pb-free lead plating; RoHS compliant 4 AIDTape and reelPart ID Package Type Markinginfomation100% UIS Tested100% Rg TestedSM340

 9.35. Size:765K  cn sps
sm3404srl.pdf

SM3408NSQG
SM3408NSQG

SM3404SRL30V /5A Single N Power MOSFET B N03B N 30V /5A Single N Power MOSFET 5N03BGeneral Description 30 VV DS30V /5A Single N Power MOSFET 30.1 mRDS(on),TYP@VGS=10VVery low on-resistance RDS(on) @ VGS=4.5 V 47.3 mRDS(on),TYP@VGS=4.5Pb-free lead plating; RoHS compliant 5 AIDTape and reelPart ID Package Type Markinginfomation100% UIS Tested100% Rg TestedSM340

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