IRL3303L Todos los transistores

 

IRL3303L MOSFET. Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características


   Número de Parte: IRL3303L
   Tipo de FET: MOSFET
   Polaridad de transistor: N

ESPECIFICACIONES MÁXIMAS

   Pdⓘ - Máxima disipación de potencia: 68 W
   |Vds|ⓘ - Voltaje máximo drenador - fuente: 30 V
   |Vgs|ⓘ - Voltaje máximo fuente - puerta: 16 V
   |Id|ⓘ - Corriente continua de drenaje: 38 A
   Tjⓘ - Temperatura máxima de unión: 175 °C

CARACTERÍSTICAS ELÉCTRICAS

   |Vgs(th)|ⓘ - Tensión umbral entre puerta y fuente: 1(min) V
   Qgⓘ - Carga de la puerta: 26(max) nC
   trⓘ - Tiempo de subida: 200 nS
   Cossⓘ - Capacitancia de salida: 340 pF
   Rds(on)ⓘ - Resistencia estado encendido drenaje a fuente: 0.026 Ohm
   Paquete / Cubierta: TO262

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IRL3303L Datasheet (PDF)

 ..1. Size:292K  international rectifier
irl3303lpbf irl3303spbf.pdf

IRL3303L
IRL3303L

PD - 95578IRL3303LPbFIRL3303SPbFl Logic-Level Gate DriveHEXFET Power MOSFETl Advanced Process TechnologyDl Surface Mount (IRL3303S)VDSS = 30Vl Low-profile through-hole (IRL3303L)l 175C Operating TemperatureRDS(on) = 0.026l Fast SwitchingGl Fully Avalanche RatedID = 38Al Lead-FreeSDescriptionFifth Generation HEXFETs from International Rectifierutili

 ..2. Size:158K  international rectifier
irl3303s irl3303l.pdf

IRL3303L
IRL3303L

PD - 9.1323BIRL3303S/LHEXFET Power MOSFET Logic-Level Gate Drive Advanced Process TechnologyDVDSS = 30V Surface Mount (IRL3303S) Low-profile through-hole (IRL3303L) 175C Operating Temperature RDS(on) = 0.026 Fast SwitchingG Fully Avalanche RatedID = 38ASDescriptionFifth Generation HEXFETs from International Rectifierutilize advanced processing techniques

 7.1. Size:103K  international rectifier
irl3303.pdf

IRL3303L
IRL3303L

PD - 9.1322BIRL3303HEXFET Power MOSFET Logic-Level Gate DriveD Advanced Process TechnologyVDSS = 30V Dynamic dv/dt Rating 175C Operating TemperatureRDS(on) = 0.026 Fast SwitchingG Fully Avalanche RatedID = 38ASDescriptionFifth Generation HEXFETs from International Rectifierutilize advanced processing techniques to achieve thelowest possible on-resistan

 7.2. Size:1331K  international rectifier
irl3303pbf.pdf

IRL3303L
IRL3303L

PD - 94887IRL3303PbFHEXFET Power MOSFET Lead-Freewww.irf.com 112/11/03IRL3303PbF2 www.irf.comIRL3303PbFwww.irf.com 3IRL3303PbF4 www.irf.comIRL3303PbFwww.irf.com 5IRL3303PbF6 www.irf.comIRL3303PbFPeak Diode Recovery dv/dt Test Circuit+Circuit Layout ConsiderationsD.U.T Low Stray Inductance Ground Plane Low Leakage Inductance

 8.1. Size:323K  international rectifier
irl3302spbf.pdf

IRL3303L
IRL3303L

PD- 95587IRL3302SPbFHEXFET Power MOSFETDVDSS = 20VRDS(on) = 0.020G Lead-FreeSID = 39Awww.irf.com 107/20/04IRL3302SPbF2 www.irf.comIRL3302SPbFwww.irf.com 3IRL3302SPbF4 www.irf.comIRL3302SPbFwww.irf.com 5IRL3302SPbF6 www.irf.comIRL3302SPbFPeak Diode Recovery dv/dt Test Circuit+Circuit Layout Considerations Low Stray Induct

 8.2. Size:129K  international rectifier
irl3302s.pdf

IRL3303L
IRL3303L

PD - 9.1692AIRL3302SPRELIMINARYHEXFET Power MOSFET Advanced Process TechnologyD Surface MountVDSS = 20V Optimized for 4.5V-7.0V Gate Drive Ideal for CPU Core DC-DC ConvertersRDS(on) = 0.020W Fast SwitchingGID = 39ASDescriptionThese HEXFET Power MOSFETs were designedspecifically to meet the demands of CPU core DC-DCconverters. Advanced processing techniques

 8.3. Size:88K  international rectifier
irl3302.pdf

IRL3303L
IRL3303L

PD 9.1696AIRL3302PRELIMINARYHEXFET Power MOSFET Advanced Process TechnologyD Optimized for 4.5V Gate DriveVDSS = 20V Ideal for CPU Core DC-DC Converters 150C Operating TemperatureRDS(on) = 0.020W Fast SwitchingGDescriptionID = 39AThese HEXFET Power MOSFETs were designed Sspecifically to meet the demands of CPU core DC-DCconverters in the PC environment. Adv

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