TSM6963SDCA Todos los transistores

 ..1. Size:344K  taiwansemi
 tsm6963sdca.pdf

TSM6963SD 20V Dual P-Channel MOSFET Pin Definition TSSOP-8 PRODUCT SUMMARY 1. Drain 1 8. Drain 2 2. Source 1 7. Source 2 VDS (V) RDS(on)(m ) ID (A) 3. Source 1 6. Source 2 30 @ VGS = -4.5V -4.5 4. Gate 1 5. Gate 2 -20 42 @ VGS = -2.5V -3 68 @ VGS = -1.8V -2 Block Diagram Features Advance Trench Process Technology High Density Cell Design for Ultra Low

 8.1. Size:498K  taiwansemi
 tsm6968sdca.pdf

TSM6968SD 20V Dual N-Channel MOSFET w/ESD Protected PRODUCT SUMMARY TSSOP-8 Pin Definition VDS (V) RDS(on)(m ) ID (A) 1. Drain 1 8. Drain 2 2. Source 1 7. Source 2 22 @ VGS = 4.5V 6.5 3. Source 1 6. Source 2 20 4. Gate 1 5. Gate 2 29 @ VGS = 2.5V 5.5 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resi

 8.2. Size:180K  tsc
 tsm6968dca.pdf

TSM6968D 20V Dual N-Channel MOSFET w/ESD Protected Pin assignment 1. Drain 2. Source 1 VDS = 20V 3. Source 1 RDS (on), Vgs @ 4.5V, Ids @ 6.5A =22m 4. Gate 1 RDS (on), Vgs @ 2.5V, Ids @ 5.5A =29m 5, Gate 2 6. Source 2 7, Source 2 8. Drain Features Block Diagram Advanced trench process technology High density cell design for ultra low on-resistance

 9.1. Size:289K  taiwansemi
 tsm6988dcx6.pdf

TSM6988D 20V Dual N-Channel MOSFET w/ESD Protected PRODUCT SUMMARY SOT-26 Pin Definition VDS (V) RDS(on)(m ) ID (A) 1. Gate 2 6. Source 2 2. Drain 5, Drain 35 @ VGS = 4.5V 6.0 20 3. Gate 1 4. Source 1 40 @ VGS = 2.5V 5.0 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Dual N-Channel MOSFET A

 9.2. Size:240K  taiwansemi
 tsm6981dca.pdf

TSM6981D 20V Dual P-Channel MOSFET TSSOP-8 Pin Definition PRODUCT SUMMARY 1. Drain 1 8. Drain 2 VDS (V) RDS(on)(m ) ID (A) 2. Source 1 7. Source 2 3. Source 1 6. Source 2 40 @ VGS = -4.5V -5 4. Gate 1 5. Gate 2 -20 50 @ VGS = -2.5V -4 60 @ VGS = -1.8V -3 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On