MEM2302XG-N Todos los transistores

 

MEM2302XG-N MOSFET. Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características


   Número de Parte: MEM2302XG-N
   Tipo de FET: MOSFET
   Polaridad de transistor: N

ESPECIFICACIONES MÁXIMAS


   Máxima disipación de potencia (Pd): 0.8 W
   Voltaje máximo drenador - fuente |Vds|: 20 V
   Voltaje máximo fuente - puerta |Vgs|: 12 V
   Corriente continua de drenaje |Id|: 3 A
   Temperatura máxima de unión (Tj): 150 °C

CARACTERÍSTICAS ELÉCTRICAS


   Tensión umbral entre puerta y fuente |Vgs(th)|: 1.2 V
   Carga de la puerta (Qg): 2.7 nC
   Tiempo de subida (tr): 3.1 nS
   Conductancia de drenaje-sustrato (Cd): 45 pF
   Resistencia entre drenaje y fuente RDS(on): 0.05 Ohm
   Paquete / Cubierta: SOT23

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MEM2302XG-N Datasheet (PDF)

 ..1. Size:316K  microne
mem2302xg-n.pdf

MEM2302XG-N
MEM2302XG-N

MEM2302XG-N N-Channel MOSFET MEM2302XG-N General Description Features MEM2302XG-N Series N-channel enhancement 20V/3A mode field-effect transistor These miniature surface RDS(ON), Vgs@2.5V, Ids@2.8A = 42m mount MOSFETs utilize High Cell Density process. RDS(ON), Vgs@4.5V, Ids@3A =35m Low RDS(ON) assures minimal power loss and High Density Cell Design For Ultra L

 6.1. Size:264K  microne
mem2302x.pdf

MEM2302XG-N
MEM2302XG-N

MEM2302 N-Channel MOSFET MEM2302X General Description Features MEM2302XG Series N-channel enhancement mode 20V/3A field-effect transistor ,produced with high cell density RDS(ON) =29m@ VGS=4.5V, ID=3A DMOS trench technology, which is especially used to RDS(ON) =36m@ VGS=2.5V, ID=2A minimize on-state resistance. This device particularly High Density Cell Design For Ultra

 7.1. Size:318K  microne
mem2302m3.pdf

MEM2302XG-N
MEM2302XG-N

MEM2302N-Channel MOSFET MEM2302M3General Description FeaturesMEM2302M3G Series N-channel enhancement mode 20V/3Afield-effect transistor ,produced with high cell density RDS(ON) =29m@ VGS=4.5V, ID=3ADMOS trench technology, which is especially used to RDS(ON) =36m@ VGS=2.5V, ID=2Aminimize on-state resistance. This device particularly High Density Cell Design For Ultra Low

 7.2. Size:1764K  cn vbsemi
mem2302.pdf

MEM2302XG-N
MEM2302XG-N

MEM2302www.VBsemi.twN-Channel 20 V (D-S) MOSFETFEATURESPRODUCT SUMMARY Halogen-free According to IEC 61249-2-21VDS (V) RDS(on) ()ID (A)e Qg (Typ.)Definition0.028 at VGS = 4.5 V TrenchFET Power MOSFET6a 100 % Rg Tested20 0.042 at VGS = 2.5 V 6a 8.8 nC Compliant to RoHS Directive 2002/95/EC0.050 at VGS = 1.8 V 5.6APPLICATIONS DC/DC Conver

Otros transistores... FMP36-015P , FMP76-01T , GMM3x100-01X1-SMD , FDMS0306AS , GMM3x120-0075X2-SMD , FDMS0300S , GMM3x160-0055X2-SMD , FDMC7200S , RFP50N06 , FDMC7200 , GMM3x60-015X2-SMD , FDMC0310AS , GWM100-0085X1-SL , FDMS3610S , GWM100-0085X1-SMD , FDMS3606S , GWM100-01X1-SL .

 

 
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