SM4435 MOSFET Equivalente. Reemplazo. Hoja de especificaciones. Principales características
Número de Parte: SM4435
Tipo de FET: MOSFET
Polaridad de transistor: P
ESPECIFICACIONES MÁXIMAS
Pdⓘ - Máxima disipación de potencia: 2.5 W
|Vds|ⓘ - Voltaje máximo drenador-fuente: 30 V
|Vgs|ⓘ - Voltaje máximo fuente-puerta: 20 V
|Id|ⓘ - Corriente continua de drenaje: 9.1 A
Tjⓘ - Temperatura máxima de unión: 150 °C
CARACTERÍSTICAS ELÉCTRICAS
trⓘ - Tiempo de subida: 15 nS
Cossⓘ - Capacitancia de salida: 555 pF
RDSonⓘ - Resistencia estado encendido drenaje a fuente: 0.02 Ohm
Encapsulados: SOP8
Búsqueda de reemplazo de SM4435 MOSFET
- Selecciónⓘ de transistores por parámetros
SM4435 datasheet
sm4435.pdf
SM4435 P-Channel Enhancement-Mode MOSFET (-30V, -9.1A) PRODUCT SUMMARY VDSS ID RDS(on) (m-ohm) Max 20 @ VGS = -10V ,ID=-9.1A -30V -9.1A 35 @ VGS = -4.5V,ID=-6.9A Features 1 Advanced Trench Process Technology. 2 High Density Cell Design for Ultra Low On-Resistance. Lead free product is acquired 3 . 4 Surface mount Package. 5 RoHS Compliant. Pin 1 / 2 / 3
tsm4435cs.pdf
TSM4435 30V P-Channel MOSFET PRODUCT SUMMARY SOP-8 Pin Definition 1. Source VDS (V) RDS(on)(m ) ID (A) 2. Source 3. Source 21 @ VGS = -10V -9.1 4. Gate -30 35 @ VGS = -4.5V -6.9 5, 6, 7, 8. Drain Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application DC-DC Conversion Ba
tsm4435bcs.pdf
TSM4435B 30V P-Channel MOSFET SOP-8 Pin Definition PRODUCT SUMMARY 1. Source 8. Drain VDS (V) RDS(on)(m ) ID (A) 2. Source 7. Drain 3. Source 6. Drain 21 @ VGS = -10V -9.1 4. Gate 5. Drain -30 35 @ VGS = -4.5V -6.9 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application DC-DC Conv
gsm4435ws.pdf
GSM4435WS GSM4435WS 30V P-Channel Enhancement Mode MOSFET Product Description Features GSM4435WS, P-Channel enhancement mode -30V/-9A,RDS(ON)= 17m @VGS=-10V MOSFET, uses Advanced Trench Technology to -30V/-7A,RDS(ON)= 24m @VGS=-4.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely low RDS (ON) These devices are particularly suited
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