SM4435 MOSFET Equivalente. Reemplazo. Hoja de especificaciones. Principales características

Número de Parte: SM4435

Tipo de FET: MOSFET

Polaridad de transistor: P

ESPECIFICACIONES MÁXIMAS

Pdⓘ - Máxima disipación de potencia: 2.5 W

|Vds|ⓘ - Voltaje máximo drenador-fuente: 30 V

|Vgs|ⓘ - Voltaje máximo fuente-puerta: 20 V

|Id|ⓘ - Corriente continua de drenaje: 9.1 A

Tjⓘ - Temperatura máxima de unión: 150 °C

CARACTERÍSTICAS ELÉCTRICAS

trⓘ - Tiempo de subida: 15 nS

Cossⓘ - Capacitancia de salida: 555 pF

RDSonⓘ - Resistencia estado encendido drenaje a fuente: 0.02 Ohm

Encapsulados: SOP8

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SM4435 datasheet

 ..1. Size:2689K  cn sps
sm4435.pdf pdf_icon

SM4435

SM4435 P-Channel Enhancement-Mode MOSFET (-30V, -9.1A) PRODUCT SUMMARY VDSS ID RDS(on) (m-ohm) Max 20 @ VGS = -10V ,ID=-9.1A -30V -9.1A 35 @ VGS = -4.5V,ID=-6.9A Features 1 Advanced Trench Process Technology. 2 High Density Cell Design for Ultra Low On-Resistance. Lead free product is acquired 3 . 4 Surface mount Package. 5 RoHS Compliant. Pin 1 / 2 / 3

 0.1. Size:494K  taiwansemi
tsm4435cs.pdf pdf_icon

SM4435

TSM4435 30V P-Channel MOSFET PRODUCT SUMMARY SOP-8 Pin Definition 1. Source VDS (V) RDS(on)(m ) ID (A) 2. Source 3. Source 21 @ VGS = -10V -9.1 4. Gate -30 35 @ VGS = -4.5V -6.9 5, 6, 7, 8. Drain Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application DC-DC Conversion Ba

 0.2. Size:202K  taiwansemi
tsm4435bcs.pdf pdf_icon

SM4435

TSM4435B 30V P-Channel MOSFET SOP-8 Pin Definition PRODUCT SUMMARY 1. Source 8. Drain VDS (V) RDS(on)(m ) ID (A) 2. Source 7. Drain 3. Source 6. Drain 21 @ VGS = -10V -9.1 4. Gate 5. Drain -30 35 @ VGS = -4.5V -6.9 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application DC-DC Conv

 0.3. Size:1086K  globaltech semi
gsm4435ws.pdf pdf_icon

SM4435

GSM4435WS GSM4435WS 30V P-Channel Enhancement Mode MOSFET Product Description Features GSM4435WS, P-Channel enhancement mode -30V/-9A,RDS(ON)= 17m @VGS=-10V MOSFET, uses Advanced Trench Technology to -30V/-7A,RDS(ON)= 24m @VGS=-4.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely low RDS (ON) These devices are particularly suited

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