FDN308P Todos los transistores

 

FDN308P MOSFET. Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características


   Número de Parte: FDN308P
   Código: 308
   Tipo de FET: MOSFET
   Polaridad de transistor: P

ESPECIFICACIONES MÁXIMAS

   Pdⓘ - Máxima disipación de potencia: 0.5 W
   |Vds|ⓘ - Voltaje máximo drenador - fuente: 20 V
   |Vgs|ⓘ - Voltaje máximo fuente - puerta: 12 V
   |Id|ⓘ - Corriente continua de drenaje: 1.5 A
   Tjⓘ - Temperatura máxima de unión: 150 °C

CARACTERÍSTICAS ELÉCTRICAS

   |Vgs(th)|ⓘ - Tensión umbral entre puerta y fuente: 1.5 V
   Qgⓘ - Carga de la puerta: 3.8 nC
   trⓘ - Tiempo de subida: 10 nS
   Cossⓘ - Capacitancia de salida: 83 pF
   Rds(on)ⓘ - Resistencia estado encendido drenaje a fuente: 0.125 Ohm
   Paquete / Cubierta: SSOT3

 Búsqueda de reemplazo de MOSFET FDN308P

 

FDN308P Datasheet (PDF)

 ..1. Size:94K  fairchild semi
fdn308p.pdf

FDN308P FDN308P

February 2001 FDN308P P-Channel 2.5V Specified PowerTrench MOSFETGeneral Description Features This P-Channel 2.5V specified MOSFET uses a rugged 20 V, 1.5 A. RDS(ON) = 125 m @ VGS = 4.5 V gate version of Fairchilds advanced PowerTrench RDS(ON) = 190 m @ VGS = 2.5 V process. It has been optimized for power management applications with

 ..2. Size:209K  onsemi
fdn308p.pdf

FDN308P FDN308P

Is Now Part ofTo learn more about ON Semiconductor, please visit our website at www.onsemi.comPlease note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductors system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclatur

 9.1. Size:144K  fairchild semi
fdn306p.pdf

FDN308P FDN308P

December 2001 FDN306P P-Channel 1.8V Specified PowerTrench MOSFET General Description Features This P-Channel 1.8V specified MOSFET uses 2.6 A, 12 V. RDS(ON) = 40 m @ VGS = 4.5 V Fairchilds advanced low voltage PowerTrench process. RDS(ON) = 50 m @ VGS = 2.5 V It has been optimized for battery power management RDS(ON) = 80 m @ VG

 9.2. Size:113K  fairchild semi
fdn304p.pdf

FDN308P FDN308P

January 2001FDN304PP-Channel 1.8V Specified PowerTrench MOSFETGeneral Description FeaturesThis P-Channel 1.8V specified MOSFET uses 2.4 A, 20 V. RDS(ON) = 52 m @ VGS = 4.5 VFairchilds advanced low voltage PowerTrench process.RDS(ON) = 70 m @ VGS = 2.5 VIt has been optimized for battery power managementRDS(ON) = 100 m @ VGS = 1.8

 9.3. Size:123K  fairchild semi
fdn304pz.pdf

FDN308P FDN308P

March 2003 FDN304PZ P-Channel 1.8V Specified PowerTrench MOSFET General Description Features This P-Channel 1.8V specified MOSFET uses 2.4 A, 20 V. RDS(ON) = 52 m @ VGS = 4.5 V Fairchilds advanced low voltage PowerTrench process. RDS(ON) = 70 m @ VGS = 2.5 V It has been optimized for battery power management RDS(ON) = 100 m @ VGS = 1.8 V app

 9.4. Size:103K  fairchild semi
fdn302p.pdf

FDN308P FDN308P

October 2000FDN302PP-Channel 2.5V Specified PowerTrench MOSFETGeneral Description FeaturesThis P-Channel 2.5V specified MOSFET uses a rugged 20 V, 2.4 A. RDS(ON) = 0.055 @ VGS = 4.5 Vgate version of Fairchilds advanced PowerTrenchRDS(ON) = 0.080 @ VGS = 2.5 Vprocess. It has been optimized for power managementapplications with a wide

 9.5. Size:260K  onsemi
fdn306p.pdf

FDN308P FDN308P

Is Now Part ofTo learn more about ON Semiconductor, please visit our website at www.onsemi.comPlease note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductors system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclatur

 9.6. Size:220K  onsemi
fdn304p.pdf

FDN308P FDN308P

Is Now Part ofTo learn more about ON Semiconductor, please visit our website at www.onsemi.comPlease note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductors system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclatur

 9.7. Size:239K  onsemi
fdn304p2.pdf

FDN308P FDN308P

Is Now Part ofTo learn more about ON Semiconductor, please visit our website at www.onsemi.comPlease note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductors system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclatur

 9.8. Size:1261K  kexin
fdn304p.pdf

FDN308P FDN308P

SMD Type MOSFETP-Channel MOSFETFDN304P (KDN304P)SOT-23Unit: mm+0.12.9 -0.1 Features+0.10.4 -0.1 VDS (V) =-20V 3 ID =-2.4A (VGS =-4.5V) RDS(ON) 52m (VGS =-4.5V) RDS(ON) 70m (VGS =-2.5V)1 2+0.1+0.050.95-0.1 0.1-0.01 RDS(ON) 100m (VGS =-1.8V)+0.11.9-0.11.GateD2.Source3.DrainG S Absolute Maximum Ratings

 9.9. Size:1458K  kexin
fdn304p-3.pdf

FDN308P FDN308P

SMD Type MOSFETP-Channel MOSFETFDN304P (KDN304P)SOT-23-3Unit: mm+0.22.9-0.1+0.10.4 -0.13 Features VDS (V) =-20V ID =-2.4A (VGS =-4.5V)1 2 RDS(ON) 52m (VGS =-4.5V)+0.02+0.10.15 -0.020.95 -0.1+0.1 RDS(ON) 70m (VGS =-2.5V) 1.9-0.2 RDS(ON) 100m (VGS =-1.8V)1.Gate2.SourceD 3.DrainG S Absolute Maximum Rati

 9.10. Size:819K  umw-ic
fdn304p.pdf

FDN308P FDN308P

RUMW UMW FDN304P SOT-23 Plastic-Encapsulate MOSFETS P-Channel 20-V(D-S) MOSFETFDN304P V(BR)DSS RDS(on)MAX ID52m@ -4.5V-20 V -2.4A70m@ -2.5V100m@ -1.8VFEATUREAPPLICATION TrenchFET Power MOSFET Battery protection Supper high density cell design Load switch Battery management MARKING Equivalent CircuitSOT23 1. GATE 2. SOURCE 3. DR

 9.11. Size:372K  cn shikues
fdn306p.pdf

FDN308P FDN308P

 9.12. Size:531K  cn shikues
fdn304p.pdf

FDN308P FDN308P

 9.13. Size:454K  cn shikues
fdn302p.pdf

FDN308P FDN308P

FDN302PP-Channel Enhancement Mode MOSFETChannel Enhancement Mode MOSFETChannel Enhancement Mode MOSFETChannel Enhancement Mode MOSFET Channel Enhancement Mode MOSFETFeature Feature -20V/ RDS(ON) = 120m(MAX) @VGS = -4.5V. 20V/-2.4A, DS(ON) = 120m(MAX) @V = RDS(ON) = 150m(MAX) @VGS = -2.5V. DS(ON) = 150m(MAX) @V = Super High dense cell design for extremely lo

 9.14. Size:1475K  cn vbsemi
fdn306p.pdf

FDN308P FDN308P

FDN306Pwww.VBsemi.twP-Channel 20-V (D-S) MOSFETFEATURESMOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21VDS (V) RDS(on) ()ID (A)a Qg (Typ.)Definition0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFETe- 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/ECAPPLICATIONS

 9.15. Size:869K  cn vbsemi
fdn304p-nl.pdf

FDN308P FDN308P

FDN304P-NLwww.VBsemi.twP-Channel 30 V (D-S) MOSFETFEATURESPRODUCT SUMMARY TrenchFET Power MOSFET 100 % Rg TestedVDS (V) RDS(on) () Typ.ID (A)a Qg (Typ.)0.046 at VGS = - 10 V - 5.60.049 at VGS = - 6 V - 5 11.4 nC- 30APPLICATIONS0.054 at VGS = - 4.5 V -4.5 For Mobile Computing- Load Switch- Notebook Adaptor SwitchSTO-236- DC/DC Converter(SOT-

 9.16. Size:852K  cn vbsemi
fdn302p.pdf

FDN308P FDN308P

FDN302Pwww.VBsemi.twP-Channel 20-V (D-S) MOSFETFEATURESMOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21VDS (V) RDS(on) ()ID (A)a Qg (Typ.)Definition0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFETe- 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/ECAPPLICATIONS

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