AGM30P10AP Todos los transistores

 ..1. Size:1845K  cn agmsemi
 agm30p10ap.pdf

AGM30P10AP P- Channel Typical Characteristics -3V TC=25 impulse=250uS -3.5V -4.5V 25 -6V -10V -2.5V Vds Drain-Source Voltage (V) -Vgs Gate-Source Voltage (V) Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics VGS= 0V Note TJ=25 VGS=-4.5V 25 VGS=-10V -V F ,Forward Voltage [V] -I D - Drain Current (A) Figure 4. Body Diode Forward Voltage F

 5.1. Size:1340K  cn agmsemi
 agm30p10a.pdf

AGM30P10A Fig.1 Power Dissipation Derating Curve Fig.2 Typical output Characteristics 1.2 50 VGS=-10V 1 40 0.8 30 VGS=-4.5V 0.6 20 0.4 10 0.2 0 0 0.5 1 0 Drain-Source voltage (V) 0 50 100 150 200 Temperature ( C) Fig.3 Threshold Voltage V.S Junction Temperature Fig.4 Resistance V.S Drain Current Junction Temperature 30 -50 50 150 0 20 -0.

 6.1. Size:1093K  cn agmsemi
 agm30p100d.pdf

AGM30P100D Typical Characteristics -VDS,- Drain -Source Voltage (V) Tj - Junction Temperature ( C) Fig1. Typical Output Characteristics Fig2. -V Gate -Source Voltage Vs.Tj GS(TH) -VGS, -Gate -Source Voltage (V) Tj - Junction Temperature ( C) Fig3. Typical Transfer Characteristics Fig4. Normalized On-Resistance Vs. Tj -VSD, -Source-Drain Voltage (V) -VDS, -Drain -Source Vo

 6.2. Size:1316K  cn agmsemi
 agm30p100a.pdf

AGM30P100A Typical Characteristics -VDS,- Drain -Source Voltage (V) Tj - Junction Temperature ( C) Fig1. Typical Output Characteristics Fig2. -V Gate -Source Voltage Vs.Tj GS(TH) -VGS, -Gate -Source Voltage (V) Tj - Junction Temperature ( C) Fig3. Typical Transfer Characteristics Fig4. Normalized On-Resistance Vs. Tj -VSD, -Source-Drain Voltage (V) -VDS, -Drain -Source Vo

 6.3. Size:1010K  cn agmsemi
 agm30p10sr.pdf

AGM30P10SR General Description Product Summary The AGM30P10SR combines advanced trench MOSFET technology with a low resistance package to provide extremely low R . DS(ON) This device is ideal for load switch and battery BVDSS RDSON ID protection applications. -30V 9.3m -15A Features Advance high cell density Trench technology SOP8 Pin Configuration Low R to mini

 6.4. Size:1130K  cn agmsemi
 agm30p10k.pdf

AGM30P10K Typical Characteristics Power Capability Current Capability 60 55 50 50 45 40 40 35 30 30 25 20 20 15 10 10 5 TC=25oC,VG= -10V TC=25oC 0 0 0 20 40 60 80 100 120 140 160 180 0 20 40 60 80 100 120 140 160 Tmp Mounting Point Temp. ( Tmp Mounting Point Temp. ( C) C) Safe Operating Area Transient Thermal Impedance 100 2 1 Duty = 0.5 1ms 0.2

 6.5. Size:1110K  cn agmsemi
 agm30p10s.pdf

AGM30P10S General Description Product Summary The AGM30P10S combines advanced trench MOSFET technology with a low resistance package to provide extremely low R . DS(ON) This device is ideal for load switch and battery BVDSS RDSON ID protection applications. -30V 12m -14A Features Advance high cell density Trench technology SOP8 Pin Configuration Low R to minimiz