2SC5773 Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características
Número de Parte: 2SC5773 📄📄
Código: JR-
Material: Si
Polaridad de transistor: NPN
ESPECIFICACIONES MÁXIMAS
Disipación total del dispositivo (Pc): 0.7 W
Tensión colector-base (Vcb): 15 V
Tensión colector-emisor (Vce): 6 V
Tensión emisor-base (Veb): 1.5 V
Corriente del colector DC máxima (Ic): 0.08 A
Temperatura operativa máxima (Tj): 150 °C
CARACTERÍSTICAS ELÉCTRICAS
Transición de frecuencia (fT): 8000 MHz
Capacitancia de salida (Cc): 1.25 pF
Ganancia de corriente contínua (hFE): 80
Encapsulados: MPAK
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2SC5773 datasheet
2sc5773.pdf
2SC5773 Silicon NPN Epitaxial UHF / VHF wide band amplifier ADE-208-1391(Z) Preliminary 1st. Edition Mar. 2001 Features High gain bandwidth product fT = 10.8 GHz typ. High power gain and low noise figure ; PG = 11.9 dB typ., NF = 1.1 dB typ. at f = 900 MHz Outline MPAK 3 1 1. Emitter 2 2. Base 3. Collector Note Marking is JR- . This data sheet contains tentativ
2sc5773.pdf
SMD Type Transistors NPN Transistors 2SC5773 SOT-23 Unit mm 2.9+0.1 -0.1 +0.1 0.4-0.1 3 Features Collector Current Capability IC=80mA 1 2 Collector Emitter Voltage VCEO=6V +0.1 +0.05 0.95 -0.1 0.1 -0.01 +0.1 1.9 -0.1 1.Base 2.Emitter 3.collector Absolute Maximum Ratings Ta = 25 Parameter Symbol Rating Unit Collector - Base Voltage VCBO 15 Collect
2sc5778.pdf
Ordering number ENN6992 2SC5778 NPN Triple Diffused Planar Silicon Transistor 2SC5778 Ultrahigh-Definition CRT Display Horizontal Deflection Output Applications Features Package Dimensions High speed. unit mm High breakdown voltage(VCBO=1600V). 2174A High reliability(Adoption of HVP process). Adoption of MBIT process. [2SC5778] On-chip damper diode. 5.6
2sc5777.pdf
Ordering number ENN6991 2SC5777 NPN Triple Diffused Planar Silicon Transistor 2SC5777 Ultrahigh-Definition CRT Display Horizontal Deflection Output Applications Features Package Dimensions High speed. unit mm High breakdown voltage (VCBO=1600V). 2174A High reliability (Adoption of HVP process). [2SC5777] Adoption of MBIT process. 5.6 3.4 On-chip damper d
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