All MOSFET. SMG2371P Datasheet

 

SMG2371P Datasheet and Replacement


   Type Designator: SMG2371P
   Type of Transistor: MOSFET
   Type of Control Channel: P -Channel
   Pdⓘ - Maximum Power Dissipation: 1.3 W
   |Vds|ⓘ - Maximum Drain-Source Voltage: 100 V
   |Vgs|ⓘ - Maximum Gate-Source Voltage: 20 V
   |Id|ⓘ - Maximum Drain Current: 1 A
   Tjⓘ - Maximum Junction Temperature: 150 °C
   trⓘ - Rise Time: 3.8 nS
   Cossⓘ - Output Capacitance: 54 pF
   Rdsⓘ - Maximum Drain-Source On-State Resistance: 1.2 Ohm
   Package: SC59
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SMG2371P Datasheet (PDF)

 ..1. Size:815K  secos
smg2371p.pdf pdf_icon

SMG2371P

SMG2371P -1A, -100V, RDS(ON) 1.2 P-Channel Enhancement MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen & lead-free FEATURES SC-59 Low RDS(on) trench technology. A Low thermal impedance. L3 Fast switching speed. 3Top View C B11 22K EAPPLICATIONS D PoE Power Sourcing Equipment H JF G

 8.1. Size:136K  secos
smg2370n.pdf pdf_icon

SMG2371P

SMG2370N 1.8 A, 100 V, RDS(ON) 280 m N-Channel Enhancement Mode Mos.FET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen and lead-free DESCRIPTION SC-59 These miniature surface mount MOSFETs utilize a High Cell Density trench process to provide Low RDS(on) and to ALensure minimal power loss and heat dissipation. Typical 33

 9.1. Size:355K  secos
smg2343pe.pdf pdf_icon

SMG2371P

SMG2343PE -3.6 A, -30 V, RDS(ON) 57 m P-Channel Enhancement MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen & lead-free SC-59 DESCRIPTION These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC

 9.2. Size:407K  secos
smg2334n.pdf pdf_icon

SMG2371P

SMG2334N 3.5A, 30V, RDS(ON) 60m N-Channel Enhancement MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen & lead-free DESCRIPTION SC-59 These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and AL to ensure minimal power loss and heat dissipation. 33Top View C B11 2

Datasheet: FMP36-015P , FMP76-01T , GMM3x100-01X1-SMD , FDMS0306AS , GMM3x120-0075X2-SMD , FDMS0300S , GMM3x160-0055X2-SMD , FDMC7200S , CS150N03A8 , FDMC7200 , GMM3x60-015X2-SMD , FDMC0310AS , GWM100-0085X1-SL , FDMS3610S , GWM100-0085X1-SMD , FDMS3606S , GWM100-01X1-SL .

History: 2SJ420 | ME7845S | UF630G-TA3-T | HGK070N15S | AP9915H | QS8K11 | UF630G-TM3-T

Keywords - SMG2371P MOSFET datasheet

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