SSF26NS60A
MOSFET. Datasheet pdf. Equivalent
Type Designator: SSF26NS60A
Type of Transistor: MOSFET
Type of Control Channel: N
-Channel
Pdⓘ
- Maximum Power Dissipation: 208
W
|Vds|ⓘ - Maximum Drain-Source Voltage: 600
V
|Vgs|ⓘ - Maximum Gate-Source Voltage: 30
V
|Vgs(th)|ⓘ - Maximum Gate-Threshold Voltage: 4
V
|Id|ⓘ - Maximum Drain Current: 20
A
Tjⓘ - Maximum Junction Temperature: 150
°C
Qgⓘ - Total Gate Charge: 52
nC
trⓘ - Rise Time: 18
nS
Cossⓘ -
Output Capacitance: 149
pF
Rdsⓘ - Maximum Drain-Source On-State Resistance: 0.165
Ohm
Package:
D2PAK
SSF26NS60A
Transistor Equivalent Substitute - MOSFET Cross-Reference Search
SSF26NS60A
Datasheet (PDF)
..1. Size:310K silikron
ssf26ns60a.pdf
SSF26NS60AMain Product Characteristics VDSS 600V RDS(on) 0.135(typ.) ID 20AMarking and Pin D2PAKSchematic DiagramAssignmentFeatures and Benefits High dv/dt and avalanche capabilities 100% avalanche tested Low input capacitance and gate charge Low gate input resistance Description The SSF26NS60A series MOSFETs is a new technology, which combines
5.1. Size:513K silikron
ssf26ns60.pdf
SSF26NS60 Main Product Characteristics: VDSS 600V RDS(on) 0.135(typ.) ID 20A Marking a nd p in Sche ma ti c di agr a m TO220 Assignment Features and Benefits: High dv/dt and avalanche capabilities 100% avalanche tested Low input capacitance and gate charge Low gate input resistance Description: The SSF26NS60 series MOSFETs is a new technology, w
9.1. Size:458K silikron
ssf2627.pdf
SSF2627DDESCRIPTION The SSF2627 uses advanced trench technology to provide excellent RDS(ON), low gate charge. It has Gbeen optimized for power management applications requiring a wide range of gave drive voltage ratings (4.5V 25V). SSchematic diagram GENERAL FEATURES VDS = -20V,ID = -5.4A RDS(ON)
9.2. Size:304K silikron
ssf2637e.pdf
SSF2637E DESCRIPTION The SSF2637E uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as -0.5V. GENERAL FEATURES VDS = -20V,ID =-5.4A RDS(ON)
9.3. Size:344K silikron
ssf2610e.pdf
SSF2610E DESCRIPTION The SSF2610E uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. GENERAL FEATURES VDS = 20V,ID = 8A Schematic diagram RDS(ON)
9.4. Size:599K silikron
ssf2616e.pdf
SSF2616E DESCRIPTION The SSF2616E uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. GENERAL FEATURES VDS = 20V,ID = 7A Schematic diagram RDS(ON)
9.5. Size:472K silikron
ssf2649.pdf
SSF2649Main Product Characteristics: D1 D2VDSS -20V G1 G2 RDS(on) 49mohm(typ.)S1 S2ID -7.9A Marking and pin SOP-8Schematic diagramAssignmentFeatures and Benefits: Advanced trench MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and re
9.6. Size:432K goodark
ssf2641s.pdf
SSF2641S 20V P-Channel MOSFET DDESCRIPTION The SSF2641S uses advanced trench technology to provide excellent RDS(ON), low gate charge. It has Gbeen optimized for power management applications requiring a wide range of gave drive voltage ratings. SSchematic Diagram GENERAL FEATURES VDS = -20V,ID = -7.9A RDS(ON)
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