FDZ208P
MOSFET. Datasheet pdf. Equivalent
Type Designator: FDZ208P
Marking Code: 208P
Type of Transistor: MOSFET
Type of Control Channel: P
-Channel
Pdⓘ
- Maximum Power Dissipation: 2.2
W
|Vds|ⓘ - Maximum Drain-Source Voltage: 30
V
|Vgs|ⓘ - Maximum Gate-Source Voltage: 25
V
|Vgs(th)|ⓘ - Maximum Gate-Threshold Voltage: 3
V
|Id|ⓘ - Maximum Drain Current: 12.5
A
Tjⓘ - Maximum Junction Temperature: 150
°C
Qgⓘ - Total Gate Charge: 25
nC
trⓘ - Rise Time: 11
nS
Cossⓘ -
Output Capacitance: 614
pF
Rdsⓘ - Maximum Drain-Source On-State Resistance: 0.0105
Ohm
Package: BGA16
FDZ208P
Transistor Equivalent Substitute - MOSFET Cross-Reference Search
FDZ208P
Datasheet (PDF)
..1. Size:193K fairchild semi
fdz208p.pdf 
February 2006 FDZ208P P-Channel 30 Volt PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced 30 Volt P-Channel 12.5 A, 30 V. rDS(on) = 10.5 m @ VGS = 10 V Trench II Process with 25 Volts Vgs. Abs. Max Gate rDS(on) = 16.5 m @ VGS = 4.5 V Rating for the ultimate low rDS(on) Battery Protection MOSFET. Th
9.1. Size:217K fairchild semi
fdz206p.pdf
February 2006 FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced 2.5V specified 13 A, 20 V. rDS(on) = 9.5 m @ VGS = 4.5 V PowerTrench process with state of the art BGA rDS(on) = 14.5 m @ VGS = 2.5 V packaging, the FDZ206P minimizes both PCB space and rDS(on). This BGA M
9.2. Size:167K fairchild semi
fdz202p.pdf
January 2004 FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced 2.5V specified 5.5 A, 20 V. RDS(ON) = 45 m @ VGS = 4.5 V PowerTrench process with state of the art BGA RDS(ON) = 75 m @ VGS = 2.5 V packaging, the FDZ202P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a
9.3. Size:170K fairchild semi
fdz209n.pdf
May 2004 FDZ209N 60V N-Channel PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced PowerTrench process 4 A, 60 V. RDS(ON) = 80 m @ VGS = 5 V with state-of-the-art BGA packaging, the FDZ209N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging Occupies only 5 mm2 of PCB area: only 55% of the
9.4. Size:174K fairchild semi
fdz201n.pdf
January 2004 FDZ201N N-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced 2.5V specified 9 A, 20 V. RDS(ON) = 18 m @ VGS = 4.5 V PowerTrench process with state-of-the-art BGARDS(ON) = 30 m @ VGS = 2.5 V packaging, the FDZ201N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a Occupies onl
9.5. Size:166K fairchild semi
fdz204p.pdf
January 2004 FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced 2.5V specified 4.5 A, 20 V. RDS(ON) = 45 m @ VGS = 4.5 V PowerTrench process with state of the art BGA RDS(ON) = 75 m @ VGS = 2.5 V packaging, the FDZ204P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a
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