ME8205E
MOSFET. Datasheet pdf. Equivalent
Type Designator: ME8205E
Type of Transistor: MOSFET
Type of Control Channel: N
-Channel
Pdⓘ
- Maximum Power Dissipation: 1.3
W
|Vds|ⓘ - Maximum Drain-Source Voltage: 20
V
|Vgs|ⓘ - Maximum Gate-Source Voltage: 12
V
|Vgs(th)|ⓘ - Maximum Gate-Threshold Voltage: 1
V
|Id|ⓘ - Maximum Drain Current: 6
A
Tjⓘ - Maximum Junction Temperature: 150
°C
Qgⓘ - Total Gate Charge: 21.9
nC
trⓘ - Rise Time: 441
nS
Cossⓘ -
Output Capacitance: 100
pF
Rdsⓘ - Maximum Drain-Source On-State Resistance: 0.022
Ohm
Package:
SOT-26
ME8205E
Transistor Equivalent Substitute - MOSFET Cross-Reference Search
ME8205E
Datasheet (PDF)
..1. Size:1053K matsuki electric
me8205e me8205e-g.pdf 
ME8205E/ME8205E-G Dual N-Channel 20V (D-S) MOSFET GENERAL DESCRIPTION FEATURES The ME8205E is the Dual N-Channel logic enhancement mode RDS(ON)22m@VGS=4.5V power field effect transistor, produced using high cell density DMOS RDS(ON)23m@VGS=4.0V trench technology. This high density process is especially tailored to RDS(ON)26m@VGS=3.0V minimize on-state r
8.1. Size:1302K matsuki electric
me8205b me8205b-g.pdf
ME8205B/ME8205B-G N-Channel 20V(D-S) MOSFET FEATURES GENERAL DESCRIPTION RDS(ON) 30 m@VGS=4.5V The ME8205B-G is the N-Channel logic enhancement mode power RDS(ON) 35m@VGS=2.5V field effect transistors are produced using high cell density, DMOS Super high density cell design for extremely low RDS(ON) trench technology. This high density process is especi
9.1. Size:256K fairchild semi
fdme820nzt.pdf
October 2013FDME820NZTN-Channel PowerTrench MOSFET 20 V, 9 A, 18 mFeatures General Description Max rDS(on) = 18 m at VGS = 4.5 V, ID = 9 AThis Single N-Channel MOSFET has been designed usingFairchild Semiconductors advanced Power Trench process to Max rDS(on) = 24 m at VGS = 2.5 V, ID = 7.5 Aoptimize the rDS(ON) @ VGS = 1.8 V on special MicroFET Max rDS(on) = 32 m
9.2. Size:723K onsemi
fdme820nzt.pdf
FDME820NZTN-Channel PowerTrench MOSFETGeneral Description20 V, 9 A, 18 mThis Single N-Channel MOSFET has been designed using FeaturesON Semiconductors advanced Power Trench process to Max rDS(on) = 18 m at VGS = 4.5 V, ID = 9 Aoptimize the rDS(ON) @ VGS = 1.8 V on special MicroFET Max rDS(on) = 24 m at VGS = 2.5 V, ID = 7.5 A leadframe. Max rDS(on) = 32 m at VG
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