IGC15T65QEHigh Speed IGBT3 ChipFeatures: Recommended for: 650V Trench & Field Stop technology discrete components andmodules high speed switching series thirdCgeneration low VCE(sat) Applications: low EMI uninterruptible power supplies low turn-off losses welding convertersG positive temperature coefficient converters with high switching

SIGC15T65E IGBT3 Chip Features: Recommended for: 650V Trench & Field Stop technology power modules low VCE(sat) C low turn-off losses Applications: short tail current drives positive temperature coefficient easy parallelingGE Qualified according to JEDEC for target applications Chip Type VCE ICn1 ) Die Size PackageSIGC15T65E 650

SIGC15T60SE IGBT3 Chip FEATURES: This chip is used for: 600V Trench & Field Stop technology power module C low VCE(sat) discrete components low turn-off losses short tail current Applications: positive temperature coefficient G drives easy parallelingE Chip Type VCE IC Die Size PackageSIGC15T60SE 600V 30A 3.92 x 3.88 mm2 sawn on

SIGC15T60 IGBT3 Chip FEATURES: This chip is used for: 600V Trench & Field Stop technology C power module low VCE(sat) discrete components low turn-off losses short tail current Applications: positive temperature coefficient G drives easy paralleling E Chip Type VCE ICn Die Size Package Ordering Code Q67050-SIGC15T60 600V 30

SIGC15T60E IGBT3 Chip FEATURES: This chip is used for: 600V Trench & Field Stop technology power module C low VCE(sat) discrete components low turn-off losses short tail current Applications: positive temperature coefficient G drives easy parallelingE Chip Type VCE IC Die Size PackageSIGC15T60E 600V 30A 3.92 x 3.88 mm2 sawn on f

SIGC15T60UN High Speed IGBT Chip in NPT-technology CFEATURES: This chip is used for: low Eoff SGB15N60HS 600V NPT technology 100m chip Applications: G short circuit prove E Welding positive temperature coefficient PFC easy paralleling UPS Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4221-SIGC15T60UN 600V 1