Справочник IGBT. SIGC05T60SNC

 

SIGC05T60SNC - IGBT справочник. Даташиты. Аналоги. Параметры и характеристики.

Наименование: SIGC05T60SNC

Тип управляющего канала: N-Channel

Предельно-допустимое напряжение коллектор-эмиттер (Uce): 600

Напряжение насыщения коллектор-эмиттер (Ucesat): 2

Максимально допустимое напряжение эмиттер-затвор (Ueg): 20

Максимальный постоянный ток коллектора (Ic): 4

Максимальная температура перехода (Tj): 150

Время нарастания: 16

Емкость коллектора (Cc), pf: 29

Корпус: CHIP

Аналог (замена) для SIGC05T60SNC

SIGC05T60SNC Datasheet (PDF)

1.1. sigc05t60snc.pdf Size:75K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC05T60SNC IGBT Chip in NPT-technology C FEATURES: This chip is used for: • 600V NPT technology • 100µm chip • DuoPack SGP04N60 • short circuit prove • positive temperature coefficient G Applications: E • easy paralleling • drives Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4149- SIGC05T60SNC 600V 4A 2.29 x 2.29 mm2 sawn on foil A101

5.1. sigc06t65e.pdf Size:117K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC06T65E IGBT3 Chip Features: Recommended for: • 650V Trench & Field Stop technology • power modules • low VCE(sat) C • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient • easy paralleling G E • Qualified according to JEDEC for target applications Chip Type VCE ICn1 ) Die Size Package SIGC06T65E 650

5.2. sigc07t60un.pdf Size:64K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC07T60UN High Speed IGBT Chip in NPT-technology C FEATURES: This chip is used for: • low Eoff • SKB06N60HS • 600V NPT technology • 100µm chip G Applications: • short circuit prove E • Welding • positive temperature coefficient • PFC • easy paralleling • UPS Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4220- SIGC07T60UN 60

5.3. sigc06t60g.pdf Size:105K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC06T60GE IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods • easy paralleling E • resonant applications Chip Type VCE IC Die Size Package S

5.4. sigc08t60s.pdf Size:116K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC08T60SE IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods • easy paralleling E • resonant applications Chip Type VCE IC Die Size Package S

5.5. sigc06t60e.pdf Size:116K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC06T60E IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods • easy paralleling E • resonant applications Chip Type VCE IC Die Size Package SI

5.6. sigc06t60ge.pdf Size:105K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC06T60GE IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods • easy paralleling E • resonant applications Chip Type VCE IC Die Size Package S

5.7. sigc08t60se.pdf Size:116K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC08T60SE IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods • easy paralleling E • resonant applications Chip Type VCE IC Die Size Package S

5.8. sigc04t60gse.pdf Size:118K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC04T60GSE IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods • easy paralleling E • resonant applications Chip Type VCE IC Die Size Package

5.9. sigc08t60e.pdf Size:116K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC08T60E IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods • easy paralleling E • resonant applications Chip Type VCE IC Die Size Package SI

5.10. sigc08t65e.pdf Size:116K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC08T65E IGBT3 Chip Features: Recommended for: • 650V Trench & Field Stop technology • power modules • low VCE(sat) C • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient • easy paralleling G E • Qualified according to JEDEC for target applications Chip Type VCE ICn1 ) Die Size Package SIGC08T65E 650

5.11. sigc04t60ge.pdf Size:58K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC04T60GE IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods E • easy paralleling • resonant applications Chip Type VCE IC Die Size Packa

5.12. sigc03t60se.pdf Size:117K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC03T60SE IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods • easy paralleling E • resonant applications Chip Type VCE IC Die Size Package S

5.13. sigc04t65e.pdf Size:116K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC04T65E IGBT3 Chip Features: Recommended for: • 650V Trench & Field Stop technology • power modules • low VCE(sat) C • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient • easy paralleling G E • Qualified according to JEDEC for target applications Chip Type VCE ICn1 ) Die Size Package SIGC04T65E 650

5.14. sigc04t60.pdf Size:56K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC04T60E IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods E • easy paralleling • resonant applications Chip Type VCE IC Die Size Packag

5.15. sigc04t60e.pdf Size:56K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC04T60E IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods E • easy paralleling • resonant applications Chip Type VCE IC Die Size Packag

5.16. sigc03t60snc.pdf Size:75K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC03T60SNC IGBT Chip in NPT-technology C FEATURES: This chip is used for: • 600V NPT technology • 100µm chip • IGBT Modules • short circuit prove • positive temperature coefficient G Applications: E • easy paralleling • drives Chip Type VCE ICn Die Size Package Ordering Code Q67041-A3000- SIGC03T60SNC 600V 2A 1.78 x 1.78 mm2 sawn on foil A002 ME

5.17. sigc06t60.pdf Size:75K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC06T60 IGBT3 Chip FEATURES: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses • short tail current Applications: • positive temperature coefficient • drives G • easy paralleling • white goods E • resonant applications Chip Type VCE ICn Die Size Pack

5.18. sigc04t60gs.pdf Size:72K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC04T60GS IGBT3 Chip FEATURES: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses • short tail current Applications: • positive temperature coefficient • drives G • easy paralleling • white goods E • resonant applications Chip Type VCE ICn Die Size Pa

5.19. sigc07t60snc.pdf Size:75K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC07T60SNC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology This chip is used for: • 100µm chip • DuoPack SKP06N60 • short circuit prove • positive temperature coefficient G Applications: E • easy paralleling • drives Chip Type VCE ICn Die Size Package Ordering Code Q67041-A4672- SIGC07T60SNC 600V 6A 2.6 x 2.6 mm2 sawn on foil A003 Q6

5.20. sigc04t60g.pdf Size:76K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC04T60G IGBT3 Chip FEATURES: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses • short tail current Applications: • positive temperature coefficient • drives G • easy paralleling • white goods E • resonant applications Chip Type VCE ICn Die Size Pac

5.21. sigc08t60.pdf Size:74K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC08T60 IGBT3 Chip FEATURES: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses • short tail current Applications: • positive temperature coefficient • drives G • easy paralleling • white goods E • resonant applications Chip Type VCE ICn Die Size Pack

5.22. sigc06t120cs.pdf Size:64K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC06T120CS IGBT Chip in NPT-technology C FEATURES: This chip is used for: • 1200V NPT technology • 180µm chip • SGP02N120 • short circuit prove • positive temperature coefficient Applications: G • easy paralleling • drives, SMPS, resonant E applications Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4115- SIGC06T120CS 1200V 2A 2.45 x 2.25

5.23. sigc07t60nc.pdf Size:64K _igbt

SIGC05T60SNC
SIGC05T60SNC

SIGC07T60NC IGBT Chip in NPT-technology C FEATURES: This chip is used for: • 600V NPT technology • 100µm chip • IGBT-Modules • positive temperature coefficient • easy paralleling G Applications: E • drives Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4134- SIGC07T60NC 600V 6A 2.6 x 2.6 mm2 sawn on foil A001 MECHANICAL PARAMETER: mm2 Ra

5.24. sigc03t60e.pdf Size:57K _igbt

SIGC05T60SNC
SIGC05T60SNC

 SIGC03T60E IGBT3 Chip Features: This chip is used for: • 600V Trench & Field Stop technology C • power module • low VCE(sat) • discrete components • low turn-off losses Applications: • short tail current • drives • positive temperature coefficient G • white goods E • easy paralleling • resonant applications Chip Type VCE IC Die Size Packag

Другие IGBT... SIGC03T60SNC , SIGC04T60 , SIGC04T60E , SIGC04T60G , SIGC04T60GE , SIGC04T60GS , SIGC04T60GSE , SIGC04T65E , IRG4PC60F , IGC70T120T6RL , IRGC100B120KB , IRGC100B120UB , IRGC100B60KB , IRGC100B60UB , IRGC15B120KB , IRGC15B120UB , IRGC16B120KB .

 


SIGC05T60SNC
  SIGC05T60SNC
  SIGC05T60SNC
  SIGC05T60SNC
 
SIGC05T60SNC
  SIGC05T60SNC
  SIGC05T60SNC
  SIGC05T60SNC
 

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Список транзисторов

Обновления

IGBT: IRGC16B60KB | IRGC16B120KB | IRGC15B120UB | IRGC15B120KB | IRGC100B60UB | IRGC100B60KB | IRGC100B120UB | IRGC100B120KB | IGC70T120T6RL | SIGC05T60SNC |