Справочник MOSFET. SSF1030B

 

SSF1030B MOSFET - описание производителя. Даташиты. Основные параметры и характеристики. Поиск аналога. Справочник


   Наименование прибора: SSF1030B
   Тип транзистора: MOSFET
   Полярность: N
   Pdⓘ - Максимальная рассеиваемая мощность: 8.8 W
   |Vds|ⓘ - Предельно допустимое напряжение сток-исток: 100 V
   |Vgs|ⓘ - Предельно допустимое напряжение затвор-исток: 20 V
   |Vgs(th)|ⓘ - Пороговое напряжение включения: 4 V
   |Id|ⓘ - Максимально допустимый постоянный ток стока: 7 A
   Tjⓘ - Максимальная температура канала: 175 °C
   Qgⓘ - Общий заряд затвора: 42 nC
   trⓘ - Время нарастания: 40 ns
   Cossⓘ - Выходная емкость: 135 pf
   Rdsⓘ - Сопротивление сток-исток открытого транзистора: 0.03 Ohm
   Тип корпуса: SOP8

 Аналог (замена) для SSF1030B

 

 

SSF1030B Datasheet (PDF)

 ..1. Size:390K  silikron
ssf1030b.pdf

SSF1030B
SSF1030B

SSF1030B Feathers: Advanced trench process technology ID =7A Ultra low Rdson, typical 25mohm BV=100V High avalanche energy, 100% test Rdson=25mtyp. Fully characterized avalanche voltage and current Description: The SSF1030B is a new generation of middle voltage and high current NChannel enhancement mode trench power MOSFET. This new technology

 7.1. Size:826K  silikron
ssf1030d.pdf

SSF1030B
SSF1030B

SSF1030D Feathers: ID =45A Advanced trench process technology BV=100V Ultra low Rdson, typical 23mohm Rdson=23mtyp. High avalanche energy, 100% test Fully characterized avalanche voltage and current Description: The SSF1030D is a new generation of middle voltage and high current NChannel enhancement mode trench power MOSFET. This new technology increa

 7.2. Size:536K  silikron
ssf1030.pdf

SSF1030B
SSF1030B

SSF1030 Main Product Characteristics: VDSS 100V RDS(on) 20.5m (typ.) ID 45A Mar ki ng a nd p in Sche ma ti c di agr a m TO-220 Assignment Features and Benefits: Advanced Process Technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recov

 9.1. Size:255K  fairchild semi
ssf10n60a.pdf

SSF1030B
SSF1030B

SSF10N60AAdvanced Power MOSFETFEATURESBVDSS = 600 V Avalanche Rugged TechnologyRDS(on) = 0.8 Rugged Gate Oxide Technology Lower Input CapacitanceID = 6.9 A Improved Gate Charge Extended Safe Operating AreaTO-3PF Lower Leakage Current : 25 A (Max.) @ VDS = 600V Low RDS(ON) : 0.646 (Typ.)1231.Gate 2. Drain 3. SourceAbsolute Maximum RatingsSymbol

 9.2. Size:577K  samsung
ssf10n80a.pdf

SSF1030B
SSF1030B

Advanced Power MOSFETFEATURESBVDSS = 800 V Avalanche Rugged TechnologyRDS(on) = 0.95 Rugged Gate Oxide Technology Lower Input CapacitanceID = 6.5 A Improved Gate Charge Extended Safe Operating Area Lower Leakage Current : 25 A (Max.) @ VDS = 800V Low RDS(ON) : 0.746 (Typ.)1231.Gate 2. Drain 3. SourceAbsolute Maximum RatingsSymbol Characteristic Val

 9.3. Size:579K  samsung
ssf10n90a.pdf

SSF1030B
SSF1030B

Advanced Power MOSFETFEATURESBVDSS = 900 V Avalanche Rugged TechnologyRDS(on) = 1.2 Rugged Gate Oxide Technology Lower Input CapacitanceID = 6.5 A Improved Gate Charge Extended Safe Operating Area Lower Leakage Current : 25 A (Max.) @ VDS = 900V Low RDS(ON) : 0.938 (Typ.)1231.Gate 2. Drain 3. SourceAbsolute Maximum RatingsSymbol Characteristic Valu

 9.4. Size:532K  silikron
ssf10n65.pdf

SSF1030B
SSF1030B

SSF10N65 Main Product Characteristics: VDSS 650V RDS(on) 0.9 (typ.) ID 10A Marking a nd p in Schematic diagram TO-220 Assignment Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery

 9.5. Size:851K  silikron
ssf1016d.pdf

SSF1030B
SSF1030B

SSF1016D Feathers: ID =60A Advanced trench process technology BV=100V avalanche energy, 100% test Rdson=16m (Max.) Fully characterized avalanche voltage and current Description: The SSF1016D is a new generation of high voltage and low current NChannel enhancement mode trench power MOSFET. This new technology increases the device reliability and electrical par

 9.6. Size:659K  silikron
ssf1009.pdf

SSF1030B
SSF1030B

SSF1009 Main Product Characteristics: VDSS 100V RDS(on) 7.2mohm(typ.) ID 100A Ma r k ing an d pin Sche ma ti c di agr a m TO220 Assignment Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body rec

 9.7. Size:417K  silikron
ssf1010.pdf

SSF1030B
SSF1030B

SSF1010Main Product Characteristics: VDSS 100V RDS(on) 9.5mohm(typ.)ID 100AMarking and pin TO220Schematic diagramAssignmentFeatures and Benefits: Advanced trench MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery 17

 9.8. Size:384K  silikron
ssf1010a.pdf

SSF1030B
SSF1030B

SSF1010AMain Product Characteristics: VDSS 100V RDS(on) 9.5mohm(typ.)ID 100AMarking and pin D2PAKSchematic diagramAssignmentFeatures and Benefits: Advanced trench MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recov

 9.9. Size:672K  silikron
ssf1006.pdf

SSF1030B
SSF1030B

SSF1006 Main Product Characteristics: VDSS 100V RDS(on) 4.6m (typ.) ID 200A Mar ki ng a nd p in Sche ma ti c di agr a m TO220 Assignment Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body

 9.10. Size:716K  silikron
ssf1090a.pdf

SSF1030B
SSF1030B

SSF1090AMain Product Characteristics: VDSS 100V RDS(on) 72m(typ) ID 15A Marking and pin D2PAKSchematic diagramAssignmentFeatures and Benefits: Advanced trench MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery

 9.11. Size:458K  silikron
ssf1020.pdf

SSF1030B
SSF1030B

SSF1020 Feathers: ID =60A Advanced trench process technology BV=100V Ultra low Rdson, typical 16mohm Rdson=16mTyp. High avalanche energy, 100% test Fully characterized avalanche voltage and current Description: The SSF1020 is a new generation of middle voltage and high current NChannel enhancement mode trench power MOSFET. This new technology i

 9.12. Size:685K  silikron
ssf1020d.pdf

SSF1030B
SSF1030B

SSF1020D Main Product Characteristics: VDSS 100V RDS(on) 16m(typ.) ID 60A DPAK Ma rk in g an d pi n Sc h ema t ic diag r am Assignment Features and Benefits: Advanced trench MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body re

 9.13. Size:921K  silikron
ssf1006a.pdf

SSF1030B
SSF1030B

SSF1006A Feathers: ID =200A Advanced trench process technology BV=100V avalanche energy, 100% test Rdson=4.7m Typ. Fully characterized avalanche voltage and current Description: The SSF1006A is a new generation of high voltage and low current NChannel enhancement mode trench power MOSFET. This new technology increases the device reliability and electri

 9.14. Size:544K  silikron
ssf1016a.pdf

SSF1030B
SSF1030B

SSF1016AMain Product Characteristics: VDSS 100V RDS(on) 13.8mohm(typ.) ID 75A Marking and pin D2PAKSchematic diagramAssignmentFeatures and Benefits: Advanced trench MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recover

 9.15. Size:453K  silikron
ssf1020a.pdf

SSF1030B
SSF1030B

SSF1020A Feathers: ID =60A Advanced trench process technology BV=100V Ultra low Rdson, typical 16mohm Rdson=20mmax. High avalanche energy, 100% test Fully characterized avalanche voltage and current Description: The SSF1020A is a new generation of middle voltage and high current NChannel enhancement mode trench power SSF1020A TOP View (D2PAK) MOSFET. This ne

 9.16. Size:731K  silikron
ssf1016.pdf

SSF1030B
SSF1030B

SSF1016 Feathers: ID =75A Advanced trench process technology BV=100V avalanche energy, 100% test Rdson=16m (Max.) Fully characterized avalanche voltage and current Description: The SSF1016 is a new generation of high voltage and low current NChannel enhancement mode trench power MOSFET. This new technology increases the device reliability and electrical

 9.17. Size:410K  silikron
ssf1007.pdf

SSF1030B
SSF1030B

SSF1007Main Product Characteristics: VDSS 100V RDS(on) 5.8mohmTypID 130A Features and Benefits: SSF1007 TOP View (TO220) Advanced trench MOSFET process technology Special designed for convertors and power controls Ultra low on-resistance 175 operating temperature High Avalanche capability and 100% tested Description: It utilizes the latest trench

 9.18. Size:531K  silikron
ssf10n60.pdf

SSF1030B
SSF1030B

SSF10N60 Main Product Characteristics: VDSS 600V RDS(on) 0.69 (typ.) ID 10A Marking a nd p in Schematic diagram TO-220 Assignment Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery

 9.19. Size:509K  silikron
ssf1090.pdf

SSF1030B
SSF1030B

SSF1090 Feathers: ID =15A Advanced trench process technology BV=100V Special designed for Convertors and power controls Rdson=0.06 (Typ.) High density cell design for ultra low Rdson Fully characterized Avalanche voltage and current Avalanche Energy 100% test Description: The SSF1090 is a new generation of high voltage and low current NChannel en

 9.20. Size:464K  silikron
ssf1006h.pdf

SSF1030B
SSF1030B

SSF1006H Main Product Characteristics: VDSS 100V RDS(on) 5m (typ.) ID 200A Marking a nd p in TO-247 Schematic diagram Assignment Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery

 9.21. Size:528K  silikron
ssf10n60f.pdf

SSF1030B
SSF1030B

SSF10N60F Main Product Characteristics: VDSS 600V RDS(on) 0.69ohm(typ.) ID 10A Marking and p in TO220F Schematic diagram Assignment Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery

 9.22. Size:333K  silikron
ssf10n90f1.pdf

SSF1030B
SSF1030B

SSF10N90F1Main Product Characteristics:V 900VDSSR (on) 0.85(typ.)DSI 10A DMarking and pinTO-3PSchematic diagramAssignmentFeatures and Benefits: Advanced MOSFET process technology Low On Resistance Low Gate Charge Fast switching and reverse body recoveryDescription:It utilizes the latest processing techniques to achieve the high cell density a

 9.23. Size:436K  silikron
ssf1090d.pdf

SSF1030B
SSF1030B

SSF1090D Main Product Characteristics: VDSS 100V RDS(on) 60m (typ.) ID 15A TO-252 (D-PAK) Marking and pi n Sc he mat ic d ia gram Assignment Features and Benefits: Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body

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