2301 datasheet, подбор замены

 ..1. Size:1181K  goford
 2301.pdf 

GOFORD 2301 DESCRIPTION D The 2301 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram VDSS RDS(ON) RDS(ON) ID (Typ) @-2.5V @-4.5V (Typ) -20V 64m 89 m -3 A High Power a

 ..2. Size:202K  cn shenzhen fuman elec
 2301.pdf 

FM , FM WWW.SZLCSC.COM, SHEN ZHEN FINE MADE ELECTRONICS GROUP CO., LTD. 2301 S&CIC1596 10V P MOS VDS= -10V RDS(ON), Vgs@-4.5V, Ids@-1.0A =100m @TYP RDS(ON), Vgs@-2.5V,

 0.1. Size:454K  toshiba
 rn2301 rn2302 rn2303 rn2304 rn2305 rn2306.pdf 

RN2301 RN2306 TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) RN2301,RN2302,RN2303 RN2304,RN2305,RN2306 Unit mm Switching, Inverter Circuit, Interface Circuit and Driver Circuit Applications With built-in bias resistors Simplify circuit design Reduce a quantity of parts and manufacturing process Complementary to RN1301to1306 Equivalent Circuit Bias Resi

 0.2. Size:911K  nxp
 nx2301p.pdf 

NX2301P 20 V, 2 A P-channel Trench MOSFET Rev. 1 26 October 2010 Product data sheet 1. Product profile 1.1 General description P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 1.2 Features and benefits 1.8 V RDSon rated for Low Voltage Gate Drive Very fast switching

 0.3. Size:61K  vishay
 si2301ds.pdf 

Si2301DS Vishay Siliconix P-Channel 1.25-W, 2.5-V MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A) 0.130 @ VGS = - 4.5 V -2.3 -20 20 0.190 @ VGS = - 2.5 V -1.9 TO-236 (SOT-23) G 1 3 D Ordering Information Si2301DS-T1 S 2 Top View Si2301DS (A1)* *Marking Code ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Symbol Limit Unit Drain-Source Voltage VDS -20

 0.4. Size:190K  vishay
 si2301cd.pdf 

Si2301CDS Vishay Siliconix P-Channel 20 V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( ) ID (A)a Qg (Typ.) Definition 0.112 at VGS = - 4.5 V - 3.1 TrenchFET Power MOSFET - 20 3.3 nC Compliant to RoHS Directive 2002/95/EC 0.142 at VGS = - 2.5 V - 2.7 APPLICATIONS Load Switch TO-236 (SOT-23) G

 0.5. Size:193K  vishay
 si2301cds.pdf 

Si2301CDS Vishay Siliconix P-Channel 20 V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( ) ID (A)a Qg (Typ.) Definition 0.112 at VGS = - 4.5 V - 3.1 TrenchFET Power MOSFET - 20 3.3 nC Compliant to RoHS Directive 2002/95/EC 0.142 at VGS = - 2.5 V - 2.7 APPLICATIONS Load Switch TO-236 (SOT-23) G

 0.6. Size:333K  vishay
 si2301-tp.pdf 

MCC Micro Commercial Components TM 20736 Marilla Street Chatsworth Micro Commercial Components CA 91311 SI2301 Phone (818) 701-4933 Fax (818) 701-4939 Features P-Channel -20V,-2.8A, RDS(ON)=120m @VGS=-4.5V RDS(ON)=150m @VGS=-2.5V Enhancement Mode High dense cell design for extremely low RDS(ON) Rugged and reliable Field Effect Transistor High Sp

 0.7. Size:46K  vishay
 si2301ads.pdf 

Si2301ADS New Product Vishay Siliconix P-Channel 2.5-V (G-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A)b 0.130 @ VGS = 4.5 V 2.0 20 0.190 @ VGS = 2.5 V 1.6 TO-236 (SOT-23) G 1 3 D S 2 Top View Si2301DS (1A)* *Marking Code ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Symbol 5 sec Steady State Unit Drain-Source Voltage VDS 20 V

 0.8. Size:216K  vishay
 sq2301es.pdf 

SQ2301ES www.vishay.com Vishay Siliconix Automotive P-Channel 20 V (D-S) 175 C MOSFET FEATURES Halogen-free According to IEC 61249-2-21 PRODUCT SUMMARY Definition VDS (V) - 20 TrenchFET Power MOSFET RDS(on) ( ) at VGS = - 4.5 V 0.120 AEC-Q101 Qualifiedd RDS(on) ( ) at VGS = - 2.5 V 0.180 100 % Rg and UIS Tested ID (A) - 3.9 Compliant to RoHS Directive

 0.9. Size:184K  vishay
 si2301bds.pdf 

Si2301BDS Vishay Siliconix P-Channel 2.5-V (G-S) MOSFET FEATURES PRODUCT SUMMARY Halogen-free Option Available VDS (V) RDS(on) ( ) ID (A)b Pb-free 0.100 at VGS = - 4.5 V Available - 2.4 - 20 0.150 at VGS = - 2.5 V RoHS* - 2.0 COMPLIANT TO-236 (SOT-23) G 1 3 D S 2 Top View Si2301 BDS (L1)* * Marking Code Ordering Information Si2301BDS-T1 Si2301BDS-T1-E3 (Lead (Pb)

 0.10. Size:507K  diodes
 dmg2301lk.pdf 

DMG2301LK P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits Low On-Resistance ID Max Low Input Capacitance BVDSS RDS(ON) Max TA = +25 C Fast Switching Speed ESD Protected Gate 160m @ VGS = -4.5V -2.4A Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) -20V Halogen and Antimony Free. Green Device (Note 3) 210

 0.11. Size:148K  diodes
 dmg2301u.pdf 

DMG2301U P-CHANNEL ENHANCEMENT MODE MOSFET Please click here to visit our online spice models database. Features Mechanical Data Low On-Resistance Case SOT-23 Low Input Capacitance Case Material Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 Fast Switching Speed Moisture Sensitivity Level 1 per J-STD-020D L

 0.12. Size:169K  diodes
 zxtn23015cfh.pdf 

ZXTN23015CFH 15V, SOT23, NPN medium power transistor Summary V(BR)CEX > 60V, V(BR)CEO > 15V IC(CONT) = 6A RCE(SAT) = 19m typical VCE(SAT)

 0.13. Size:190K  diodes
 zxtp23015cfh.pdf 

ZXTP23015CFH 15V, SOT23, PNP medium power transistor Summary V(BR)CES > -15V, V(BR)CEO > -15V V(BR)ECO > -6V IC(CONT) = -6A RCE(SAT) = 20m typical VCE(SAT)

 0.14. Size:527K  diodes
 dmg2301l.pdf 

DMG2301L P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits Low On-Resistance ID max Low Input Capacitance V(BR)DSS RDS(ON) max TA = +25 C Fast Switching Speed Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) 120m @ VGS = -4.5V Halogen and Antimony Free. Green Device (Note 3) -20V -3A 150m @ VGS = -2.5V De

 0.15. Size:333K  mcc
 si2301a.pdf 

 0.16. Size:971K  mcc
 sil2301.pdf 

SIL2301 Features TrenchFET Power MOSFET Epoxy Meets UL 94 V-0 Flammability Rating Moisture Sensitivity Level 1 Halogen Free Available Upon Request By Adding Suffix "-HF" Dual Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS Compliant. See Ordering Information) P-Channel MOSFET Maximum Ratings Operating Junction Temperature Range -55oC to +150oC

 0.17. Size:324K  mcc
 si2301.pdf 

MCC Micro Commercial Components TM 20736 Marilla Street Chatsworth Micro Commercial Components CA 91311 SI2301 Phone (818) 701-4933 Fax (818) 701-4939 Features P-Channel -20V,-2.8A, RDS(ON)=120m @VGS=-4.5V RDS(ON)=150m @VGS=-2.5V Enhancement Mode High dense cell design for extremely low RDS(ON) Rugged and reliable Field Effect Transistor High Sp

 0.18. Size:183K  utc
 ut2301.pdf 

UNISONIC TECHNOLOGIES CO., LTD UT2301 Power MOSFET 2.8A, 20V P-CHANNEL ENHANCEMENT MODE POWER MOSFET DESCRIPTION The UTC UT2301 is P-channel enhancement mode power MOSFET, designed in serried ranks. With fast switching speed, low on-resistance, favorable stabilization. Used in commercial and industrial surface mount applications and suited for low voltage applications su

 0.19. Size:228K  utc
 ut2301g-ae2-r ut2301g-ae3-r.pdf 

UNISONIC TECHNOLOGIES CO., LTD UT2301 Power MOSFET Y2.8A, 20V P-CHANNEL ENHANCEMENT MODE POWER MOSFET DESCRIPTION The UTC UT2301 is P-channel enhancement mode power MOSFET, designed in serried ranks. With fast switching speed, low on-resistance, favorable stabilization. Used in commercial and industrial surface mount applications and suited for low voltage applications s

 0.20. Size:159K  utc
 ut2301z.pdf 

UNISONIC TECHNOLOGIES CO., LTD UT2301Z Power MOSFET 2.3A, 20V P-CHANNEL ENHANCEMENT MODE POWER MOSFET DESCRIPTION The UTC UT2301Z is a P-channel enhancement mode power MOSFET with fast switching speed, low on-resistance and favorable stabilization. It can be used in commercial and industrial surface mount applications and suited for low voltage applications such as DC/DC co

 0.21. Size:751K  secos
 smg2301p.pdf 

SMG2301P -2.6 A, -20 V, RDS(ON) 130 m P-Channel Enhancement MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen & lead-free DESCRIPTION SC-59 The miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure A L minimal power loss and heat dissipation.Typical applications 3 3

 0.22. Size:391K  secos
 smg2301.pdf 

SMG2301 -2.6A, -20V,RDS(ON) 130m Elektronische Bauelemente P-Channel Enhancement Mode Power Mos.FET RoHS Compliant Product A suffix of "-C" specifies halogen & RoHS compliant SC-59 A Dim Min Max Description L A 2.70 3.10 3 B 1.40 1.60 The SMG2301 is universally preferred for all commercial S B Top View 2 1 C 1.00 1.30 industrial surface mount application and suited for l

 0.23. Size:119K  taiwansemi
 tsm2301bcx.pdf 

 0.24. Size:249K  taiwansemi
 tsm2301a.pdf 

TSM2301A Taiwan Semiconductor P-Channel Power MOSFET -20V, -2.8A, 130m KEY PERFORMANCE PARAMETERS Features PARAMETER VALUE UNIT Advance Trench Process Technology VDS -20 V High Density Cell Design for Ultra Low On- resistance VGS = -4.5V 130 RDS(on) (max) m VGS = -2.5V 190 Application Qg 7.2 nC Telecom power Consumer Electronics SOT-23

 0.25. Size:340K  taiwansemi
 tsm2301acx tsm2301cx.pdf 

TSM2301 20V P-Channel MOSFET PRODUCT SUMMARY SOT-23 Pin Definition VDS (V) RDS(on)(m ) ID (A) 1. Gate 130 @ VGS = -4.5V -2.8 2. Source -20 3. Drain 190 @ VGS = -2.5V -2.0 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application Load Switch PA Switch P-Channel MOSFET Orderi

 0.26. Size:118K  taiwansemi
 tsm2301.pdf 

 0.27. Size:464K  jiangsu
 cj2301.pdf 

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-23 Plastic-Encapsulate MOSFETS CJ2301 P-Channel 20-V(D-S) MOSFET SOT-23 FEATURE 1. GATE TrenchFET Power MOSFET 2. SOURCE 3. DRAIN APPLICATIONS z Load Switch for Portable Devices z DC/DC Converter MARKING S1 Maximum ratings (Ta=25 unless otherwise noted) Parameter Symbol Value Unit Drain-Source Voltage VDS -20

 0.28. Size:1302K  jiangsu
 cj2301s.pdf 

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-23 Plastic-Encapsulate MOSFETS CJ2301S P-Channel 20-V(D-S) MOSFET ID V(BR)DSS RDS(on)MAX SOT-23 112m @-4.5V -20V -2.3A 142m @-2.5V 1. GATE 2. SOURCE 3. DRAIN APPLICATION FEATURE z Load Switch for Portable Devices TrenchFET Power MOSFET z DC/DC Converter MARKING Equivalent Circuit Maximum ratings (Ta

 0.29. Size:2604K  jiangsu
 cjl2301.pdf 

JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD SOT-23-6L Plastic-Encapsulate MOSFETS CJL2301 Dual P-Channel MOSFET ID V(BR)DSS RDS(on)MAX SOT-23-6L 90m @-4.5V 125m @-2.5V -20 V -2.3A 200m @-1.8V APPLICATION FEATURE DC/DC converter TrenchFET Power MOSFET Load switch for portable devices Equivalent to Two CJ2301 Equivalent Circuit MARKING

 0.30. Size:3667K  htsemi
 si2301.pdf 

SI2301 20V P-Channel Enhancement Mode MOSFET VDS= -20V RDS(ON), Vgs@-4.5V, Ids@-2.8A 130m RDS(ON), Vgs@-2.5V, Ids@-2.0A 190m Features Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance Package Dimensions D G S SOT-23(PACKAGE) Millimeter Millimeter REF. REF. Min. Max. Min. Max. A 2.70 3.10 G 1.90 REF. B 2.40 2.80 H 1.00 1.30

 0.31. Size:395K  cet
 ces2301.pdf 

CES2301 P-Channel Enhancement Mode Field Effect Transistor FEATURES -20V, -2.8A, RDS(ON) = 100m @VGS = -4.5V. RDS(ON) = 150m @VGS = -2.5V. High dense cell design for extremely low RDS(ON). Rugged and reliable. D Lead free product is acquired. SOT-23 package. G D S G S SOT-23 ABSOLUTE MAXIMUM RATINGS TA = 25 C unless otherwise noted Parameter Symbol Limit Units Drain-Sou

 0.32. Size:416K  cet
 cen2301.pdf 

CEN2301 P-Channel Enhancement Mode Field Effect Transistor FEATURES -20V, -2.7A, RDS(ON) = 110m @VGS = -4.5V. RDS(ON) = 160m @VGS = -2.5V. High dense cell design for extremely low RDS(ON). Rugged and reliable. D Lead-free plating ; RoHS compliant. SOT-23-T package. G D S G S SOT-23-T ABSOLUTE MAXIMUM RATINGS TA = 25 C unless otherwise noted Parameter Symbol Limit Units

 0.33. Size:262K  gsme
 gms2301.pdf 

 0.34. Size:293K  gsme
 gm2301.pdf 

Guilin Strong Micro-Electronics Co.,Ltd. Guilin Strong Micro-Electronics Co.,Ltd. Guilin Strong Micro-Electronics Co.,Ltd. Guilin Strong Micro-Electronics Co.,Ltd. GM2301 SOT-23 (SOT-23 Field Effect Transistors) P-Channel Enhancement-Mode MOS FETs P-Channel Enhancement-Mode MOS FETs P-Channel Enhancement-Mode MOS FET

 0.35. Size:848K  lge
 ki2301.pdf 

 0.36. Size:566K  wietron
 wtc2301.pdf 

WTC2301 P-Channel Enhancement DRAIN CURRENT 3 DRAIN Mode Power MOSFET -2.3 AMPERES P b Lead(Pb)-Free DRAIN SOURCE VOLTAGE -20 VOLTAGE 1 GATE 2 Features SOURCE 3 *Super High Dense Cell Design For Low RDS(ON) 1 RDS(ON)

 0.37. Size:474K  willas
 se2301.pdf 

FM120-M WILLAS SE2301THRU SOT-23 Plastic-Encapsulate MOSFETS FM1200-M 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V SOD-123 PACKAGE Pb Free Product Package outline Features Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. SOD-123H Low profile surface mounted application in order to optimize

 0.38. Size:88K  hsmc
 h2301n.pdf 

Spec. No. MOS200612 HI-SINCERITY Issued Date 2006.07.01 Revised Date 2006.07.11 MICROELECTRONICS CORP. Page No. 1/4 H2301N Pin Assignment & Symbol H2301N 3 3-Lead Plastic SOT-23 P-Channel Enhancement-Mode MOSFET (-20V, -2.2A) Package Code N Pin 1 Gate 2 Source 3 Drain 2 1 Source Features Gate Drain RDS(on)

 0.39. Size:767K  aosemi
 aoca32301.pdf 

AOCA32301 30V Common-Drain Dual N-Channel MOSFET General Description Product Summary VSS Trench Power MOSFET technology 30V Low RSS(ON) ESD protection RSS(ON) (at VGS=10V)

 0.40. Size:93K  ape
 ap2301agn.pdf 

AP2301AGN RoHS-compliant Product Advanced Power P-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET Simple Drive Requirement BVDSS -20V Small Package Outline RDS(ON) 97m D Surface Mount Device ID - 3.3A S SOT-23 G Description D Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, G low on-resistance and cost-effec

 0.41. Size:56K  ape
 ap2301agn-hf.pdf 

AP2301AGN-HF Halogen-Free Product Advanced Power P-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET Simple Drive Requirement BVDSS -20V D Small Package Outline RDS(ON) 97m Surface Mount Device ID - 3.3A S RoHS Compliant & Halogen-Free SOT-23 G D Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching,l

 0.42. Size:93K  ape
 ap2301gn.pdf 

AP2301GN RoHS-compliant Product Advanced Power P-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET Simple Drive Requirement BVDSS -20V Small Package Outline RDS(ON) 130m D Surface Mount Device ID - 2.6A S SOT-23 G Description D Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, G low on-resistance and cost-effec

 0.43. Size:96K  ape
 ap2301en-hf.pdf 

AP2301EN-HF Halogen-Free Product Advanced Power P-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET Capable of 2.5V Gate Drive BVDSS -20V D Small Package Outline RDS(ON) 130m Surface Mount Device ID -2.3A S RoHS Compliant & Halogen-Free SOT-23S G D Description Advanced Power MOSFETs from APEC provide the designer with the best G combination of fast switch

 0.44. Size:93K  ape
 ap2301bgn-hf.pdf 

AP2301BGN-HF Halogen-Free Product Advanced Power P-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET Simple Drive Requirement BVDSS -20V Small Package Outline RDS(ON) 130m D Surface Mount Device ID - 2.8A RoHS Compliant & Halogen-Free S SOT-23 G Description D Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching,

 0.45. Size:97K  ape
 ap2301gn-hf.pdf 

AP2301GN-HF Halogen-Free Product Advanced Power P-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET Simple Drive Requirement BVDSS -20V Small Package Outline RDS(ON) 130m D Surface Mount Device ID - 2.6A RoHS Compliant S SOT-23 G Description D Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, G low on-resi

 0.46. Size:59K  ape
 ap2301n-hf.pdf 

AP2301N-HF Halogen-Free Product Advanced Power P-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET Capable of 2.5V Gate Drive BVDSS -20V D Small Package Outline RDS(ON) 130m Surface Mount Device ID -2.3A S RoHS Compliant & Halogen-Free SOT-23S G D Description Advanced Power MOSFETs from APEC provide the designer with the best G combination of fast switchi

 0.47. Size:150K  ape
 ap2301en.pdf 

AP2301EN-HF Halogen-Free Product Advanced Power P-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET Capable of 2.5V Gate Drive BVDSS -20V D Small Package Outline RDS(ON) 130m Surface Mount Device ID -2.3A S RoHS Compliant & Halogen-Free SOT-23S G D Description Advanced Power MOSFETs from APEC provide the designer with the best G combination of fast switch

 0.48. Size:306K  analog power
 am2301p.pdf 

Analog Power AM2301P P-Channel 20-V (D-S) MOSFET PRODUCT SUMMARY Key Features rDS(on) (m ) VDS (V) ID (A) Low r trench technology DS(on) 130 @ VGS = -4.5V -2.6 Low thermal impedance -20 190 @ VGS = -2.5V -2.2 Fast switching speed SOT-23 Typical Applications Load Switches DC/DC Conversion Motor Drives ABSOLUTE MAXIMUM RATINGS (TA = 25 C UNLE

 0.49. Size:84K  analog power
 am2301pe.pdf 

Analog Power AM2301PE P-Channel 20-V (D-S) MOSFET These miniature surface mount MOSFETs utilize a high cell density trench process to provide low PRODUCT SUMMARY rDS(on) and to ensure minimal power loss and heat VDS (V) rDS(on) (OHM) ID (A) dissipation. Typical applications are DC-DC converters and power management in portable and 0.130 @ VGS = -4.5V -2.6 -20 battery-powered product

 0.50. Size:519K  alfa-mos
 afp2301s.pdf 

AFP2301S Alfa-MOS 20V P-Channel Technology Enhancement Mode MOSFET General Description Features AFP2301S, P-Channel enhancement mode -20V/-2.8A,RDS(ON)=120m @VGS=-4.5V MOSFET, uses Advanced Trench Technology -20V/-2.0A,RDS(ON)=170m @VGS=-2.5V to provide excellent RDS(ON), low gate charge. Super high density cell design for extremely These devices are particularly

 0.51. Size:519K  alfa-mos
 afp2301.pdf 

AFP2301 Alfa-MOS 20V P-Channel Technology Enhancement Mode MOSFET General Description Features AFP2301, P-Channel enhancement mode -20V/-3.0A,RDS(ON)=105m @VGS=-4.5V MOSFET, uses Advanced Trench Technology -20V/-2.4A,RDS(ON)=155m @VGS=-2.5V to provide excellent RDS(ON), low gate charge. Super high density cell design for extremely These devices are particularly su

 0.52. Size:651K  alfa-mos
 afp2301as.pdf 

AFP2301AS Alfa-MOS 20V P-Channel Technology Enhancement Mode MOSFET General Description Features AFP2301AS, P-Channel enhancement mode -20V/-2.4A,RDS(ON)=125m @VGS=-4.5V MOSFET, uses Advanced Trench Technology -20V/-2.0A,RDS(ON)=170m @VGS=-2.5V to provide excellent RDS(ON), low gate charge. Super high density cell design for extremely These devices are particularl

 0.53. Size:651K  alfa-mos
 afp2301a.pdf 

AFP2301A Alfa-MOS 20V P-Channel Technology Enhancement Mode MOSFET General Description Features AFP2301A, P-Channel enhancement mode -20V/-2.6A,RDS(ON)=120m @VGS=-4.5V MOSFET, uses Advanced Trench Technology -20V/-2.2A,RDS(ON)=170m @VGS=-2.5V to provide excellent RDS(ON), low gate charge. Super high density cell design for extremely These devices are particularly

 0.54. Size:1114K  shenzhen
 si2301a.pdf 

Shenzhen Tuofeng Semiconductor Technology Co., Ltd Sl2301A P-Channel SI2301AMOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A) 0.080 @ VGS = -4.5 V -2.8 -20 20 0.110 @ VGS = -2.5 V -2.0 SOT-23/-3L G 1 3 D S 2 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Symbol Limit Unit Drain-Source Voltage VDS -20 V V Gate-Source Voltage VGS "8 Continuous Drain Curr

 0.55. Size:885K  shenzhen
 si2301 a1shb.pdf 

Shenzhen Tuofeng Semiconductor Technology Co., Ltd SI2301 P-Channel SI2301 MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A) 0.120 @ VGS = -4.5 V -2.8 -20 20 0.190 @ VGS = -2.5 V -1.8 (SOT-23-3L) (SOT-23) G 1 3 D S 2 Top View SI2301(A1sHB)* ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Symbol Limit Unit Drain-Source Voltage VDS -20 V V Gate-Source V

 0.56. Size:607K  cystek
 mtp2301n3.pdf 

Spec. No. C322N3 CYStech Electronics Corp. Issued Date 2004.04.05 Revised Date 2018.08.31 Page No. 1/9 20V P-Channel Enhancement Mode MOSFET BVDSS -20V MTP2301N3 ID@TA=25 C, VGS=-4.5V -3.4A 79m RDSON(TYP)@VGS=-4.5V, ID=-2.8A 116m RDSON(TYP)@VGS=-2.5V, ID=-2A Features Advanced trench process technology High density cell design for ultra low on res

 0.57. Size:302K  cystek
 mtp2301s3.pdf 

Spec. No. C322S3 CYStech Electronics Corp. Issued Date 2013.08.29 Revised Date 2013.09.09 Page No. 1/8 20V P-Channel Enhancement Mode MOSFET BVDSS -20V MTP2301S3 ID -1.6A 75m (typ.) RDSON(MAX)@VGS=-4.5V, ID=-1.6A 113m (typ.) RDSON(MAX)@VGS=-2.5V, ID=-1A Features Advanced trench process technology High density cell design for ultra low on resistance

 0.58. Size:2066K  goford
 2301h.pdf 

 0.59. Size:1274K  goford
 2301l.pdf 

GOFORD 2301L DESCRIPTION D The 2301L uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram VDSS RDS(ON) RDS(ON) ID (Typ) @-2.5V @-4.5V (Typ) -20V 64m 89 m -3 A High Power

 0.60. Size:101K  samhop
 sts2301a.pdf 

Green Product STS2301A a S mHop Microelectronics C orp. Ver 1.1 P-Channel Enhancement Mode Field Effect Transistor FEATURES PRODUCT SUMMARY Super high dense cell design for low RDS(ON). VDSS ID RDS(ON) (m ) Typ Rugged and reliable. 95 @ VGS=-4.5V Suface Mount Package. -20V -2.6A 130 @ VGS=-2.5V D S OT23-3L D G S G S (TC=25 C unless otherwise noted) ABSOLUTE MAXIMUM RAT

 0.61. Size:134K  samhop
 sts2301.pdf 

Green Product S TS 2301 S amHop Microelectronics C orp. J UL.30 2004 ver1.1 P-Channel E nhancement Mode Field E ffect Transistor PR ODUC T S UMMAR Y F E ATUR E S S uper high dense cell design for low R DS (ON). VDS S ID R DS (ON) ( m ) Max R ugged and reliable. 60 @ VG S = -4.5V -20V -3.4A 80 @ VG S = -2.5V S OT-23 package. 105 @ VG S = -1.8V D S OT-23 G S AB S OLUTE MAXI

 0.62. Size:282K  silikron
 ssf2301b.pdf 

SSF2301B D DESCRIPTION The SSF2301B uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable G for use as a load switch or in PWM applications. S Schematic diagram GENERAL FEATURES VDS = -20V,ID = -2.8A RDS(ON)

 0.63. Size:275K  silikron
 ssf2301a.pdf 

SSF2301A D DESCRIPTION The SSF2301A uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable G for use as a load switch or in PWM applications. S Schematic diagram GENERAL FEATURES VDS = -20V,ID = -4A RDS(ON)

 0.64. Size:566K  silikron
 ssf2301.pdf 

SSF2301 Main Product Characteristics D VDSS -20V G RDS(on) 60m (typ.) S ID -3A Marking and pin SOT-23 Schematic diagram Assignme nt Features and Benefits Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body re

 0.65. Size:300K  can-sheng
 cs2301 sot-23.pdf 

ShenZhen CanSheng Industry Development Co.,Ltd. www.szcansheng.com SOT-23 Plastic-Encapsulate Transistors 2301 MOSFET(P-Channel) FEATURES renchFET Power MOSFET T MAXIMUM RATINGS (TA=25 unless otherwise noted) Symbol Parameter Value Units VDS Drain-Source voltage -20 V VGS Gate-Source voltage 12 V ID Drain current -3 A PD Powe

 0.66. Size:709K  blue-rocket-elect
 brcs2301ama.pdf 

BRCS2301AMA Rev.B Apr.-2020 DATA SHEET / Descriptions SOT-23 P MOS P- CHANNEL MOSFET in a SOT-23 Plastic Package. / Features R SOT-23 DS(ON) Super high dense cell design for low RDS(ON),SOT-23 packag.Halogen-free Product. / Applications

 0.67. Size:670K  blue-rocket-elect
 brcs2301emf.pdf 

 0.68. Size:709K  blue-rocket-elect
 brcs2301ma.pdf 

 0.69. Size:795K  blue-rocket-elect
 si2301.pdf 

SI2301 Rev.F Apr.-2017 DATA SHEET / Descriptions SOT-23 P MOS P- CHANNEL MOSFET in a SOT-23 Plastic Package. / Features ,MOS Trench FET Power MOSFET 100% Rg Tested. / Applications Primarily the display screen drive applications. / Equivalen

 0.70. Size:383K  lrc
 lp2301alt1g.pdf 

LESHAN RADIO COMPANY, LTD. 20V P-Channel Enhancement-Mode MOSFET FEATURES RDS(ON) 110m @VGS=-4.5V LP2301ALT1G RDS(ON) 150m @VGS=-2.5V Super high density cell design for extremely low RDS(ON) 3 APPLICATIONS 1 Power Management in Note book 2 Portable Equipment SOT 23 Battery Powered System Load Switch DSC 3 Ordering Inform

 0.71. Size:544K  lrc
 lp2301lt1g.pdf 

 0.72. Size:907K  lrc
 lp2301blt1g lp2301blt3g.pdf 

LESHAN RADIO COMPANY, LTD. 20V P-Channel Enhancement-Mode MOSFET LP2301BLT1G V = -20V DS R Vgs@-4.5V, Ids@-2.8A = 100 m DS(ON), m 3 RDS(ON), Vgs@-2.5V, Ids@-2.0A = 150 Features Advanced trench process technology 1 High Density Cell Design For Ultra Low On-Resistance 2 Fully Characterized Avalanche Voltage and Current SOT 23 (TO 236AB) Improved Shoot-Through FOM

 0.73. Size:169K  sino
 apm2301ca.pdf 

APM2301CA P-Channel Enhancement Mode MOSFET Features Pin Description -20V/-3A D RDS(ON)= 70m (max.) @ VGS= -4.5V S RDS(ON)= 115m (max.) @ VGS= -2.5V G RDS(ON)= 250m (max.) @ VGS= -1.8V Reliable and Rugged Top View of SOT-23 Lead Free and Green Devices Available ( RoHS Compliant) D G Applications Power Management in Notebook Computer, Portable Equipment and

 0.74. Size:223K  tysemi
 nx2301p.pdf 

Product specification NX2301P 20 V, 2 A P-channel Trench MOSFET Rev. 1 26 October 2010 Product data sheet 1. Product profile 1.1 General description P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 1.2 Features and benefits 1.8 V RDSon rated for Low Voltage Gate Driv

 0.75. Size:118K  tysemi
 dmg2301u.pdf 

Product specification DMG2301U P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features Low On-Resistance ID max V(BR)DSS RDS(ON) max Low Input Capacitance TA = +25 C Fast Switching Speed 80m @ VGS = 4.5V -2.7A -20V Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) 110m @ VGS = 2.5V -2.1A Halogen and Antimony Free. Green Device (N

 0.76. Size:351K  tysemi
 ki2301ds.pdf 

SMD Type IC SMD Type MOSFE SMD Type MOSFET SMD Type MOSFET SMD Type MOSFET Product specification KI2301 DS SOT-23 Unit mm +0.1 2.9-0.1 +0.1 0.4-0.1 3 Features VDS (V) = -20V RDS(ON) 100m (VGS = -4.5V) 1 2 +0.1 +0.05 RDS(ON) 150m (VGS = -2.5V) 0.95-0.1 0.1-0.01 +0.1 1.9-0.1 D 1.Base 1.Base 1. Gate 2.Emitter 2.Emitter 2. Source 3.

 0.77. Size:284K  first silicon
 ftk2301.pdf 

SEMICONDUCTOR FTK2301 TECHNICAL DATA 20V P-Channel Enhancement-Mode MOSFET 3 Features Low on-resistance 2 R =4.5V, I =2.8A ) = 100m DS(ON) (VGS ds 1 R =2.5V, I =2.0A ) = 150m DS(ON) (VGS ds SOT 23 (TO 236AB) High Density Cell Design For Ultra Low On-Resistance Fully Characterized Avalanche Voltage and Current Improved Shoot-Through FOM 3 D We declare that

 0.78. Size:1698K  kexin
 si2301ds.pdf 

SMD Type MOSFET P-Channel Enhancement MOSFET SI2301DS (KI2301DS) Features SOT-23 Unit mm +0.1 2.9 -0.1 VDS (V) =-20V +0.1 0.4-0.1 RDS(ON) 130m (VGS =-4.5V) 3 RDS(ON) 190m (VGS =-2.5V) 1 2 +0.1 +0.05 0.95 -0.1 0.1 -0.01 +0.1 1.9 -0.1 G 1 1.Gate 3 D 2.Source S 2 3.Drain Absolute Maximum Ratings Ta = 25 Parameter Symbol Rating Unit

 0.79. Size:1943K  kexin
 si2301bds-3.pdf 

SMD Type MOSFET P-Channel Enhancement MOSFET SI2301BDS (KI2301BDS) SOT-23-3 Unit mm +0.2 2.9-0.1 +0.1 0.4 -0.1 Features 3 VDS (V) =-20V RDS(ON) 100m (VGS =-4.5V) RDS(ON) 150m (VGS =-2.5V) 1 2 +0.02 +0.1 0.15 -0.02 0.95 -0.1 +0.1 1.9 -0.2 G 1 3 D 1. Gate S 2 2. Source 3. Drain Absolute Maximum Ratings Ta = 25 Parameter Symbol 5

 0.80. Size:49K  kexin
 ki2301bds.pdf 

SMD Type Transistors P-Channel 2.5-V (G-S) MOSFET KI2301BDS SOT-23 Unit mm +0.1 2.9-0.1 +0.1 0.4-0.1 3 Features 12 RoH Lead (Pb)-Free Version is RoHS Compliant. +0.1 +0.05 0.95-0.1 0.1-0.01 +0.1 1.9-0.1 1.Base 1. Gate 2.Emitter 2. Source 3. Drain 3.collector Absolute Maximum Ratings Ta = 25 Parameter Symbol 5 sec Steady State Unit Drain-Source Voltage VDS -20 V Gate-

 0.81. Size:322K  kexin
 ki2301t.pdf 

SMD Type MOSFET P-Channel Enhancement MOSFET KI2301T SOT-23 Unit mm +0.1 2.9-0.1 +0.1 0.4 -0.1 3 Features VDS (V) =-12V ID =-2.8 A 1 2 RDS(ON) 115m (VGS =-4.5V) +0.1 +0.05 0.95-0.1 0.1 -0.01 1.9+0.1 -0.1 RDS(ON) 160m (VGS =-2.5V) 1.Gate 2.Source 3.Drain Absolute Maximum Ratings Ta = 25 Parameter Symbol Rating Unit Drain-Sou

 0.82. Size:1968K  kexin
 si2301ds-3.pdf 

SMD Type MOSFET P-Channel Enhancement MOSFET SI2301DS (KI2301DS) SOT-23-3 Unit mm +0.2 2.9-0.1 +0.1 0.4 -0.1 Features 3 VDS (V) =-20V RDS(ON) 100m (VGS =-4.5V) RDS(ON) 150m (VGS =-2.5V) 1 2 +0.02 +0.1 0.15 -0.02 0.95 -0.1 +0.1 1.9 -0.2 G 1 3 D 1. Gate S 2 2. Source 3. Drain Absolute Maximum Ratings Ta = 25 Parameter Symbol 5 se

 0.83. Size:185K  kexin
 si2301 ki2301.pdf 

SMD Type MOSFET P-Channel Enhancement MOSFET SI2301 (KI2301) Features VDS (V) =-20V RDS(ON) 130m (VGS =-4.5V) 3 RDS(ON) 190m (VGS =-2.5V) 12 Absolute Maximum Ratings Ta = 25 Parameter Symbol Rating Unit Drain-Source Voltage VDS -20

 0.84. Size:1887K  kexin
 si2301bds.pdf 

SMD Type MOSFET P-Channel Enhancement MOSFET SI2301BDS (KI2301BDS) SOT-23 Unit mm Features +0.1 2.9 -0.1 0.4+0.1 -0.1 VDS (V) =-20V 3 RDS(ON) 100m (VGS =-4.5V) RDS(ON) 150m (VGS =-2.5V) 1 2 +0.1 +0.05 0.95 -0.1 0.1-0.01 +0.1 1.9 -0.1 G 1 1.Gate 3 D 2.Source S 2 3.Drain Absolute Maximum Ratings Ta = 25 Parameter Symbol 5 sec Stea

 0.85. Size:1196K  bruckewell
 msp2301n3.pdf 

Bruckewell Technology Corp., Ltd. http //www.bruckewell.com/semicon 20V P-CHANNEL Enhancement Mode MOSFETProduct Specification MSP2301N3 FEATURES VDS=-20V RDS(ON)=130m @VGS=-4.5V, IDS=-2.8A RDS(ON)=190m @VGS=-2.5V, VDS=-20V RDS(ON)=130m @VGS=-4.5V, IDS=-2A Advanced trench process technology IDS=-2.8A RDS(ON)=190m @VGS=-2.5V, High density cell design

 0.86. Size:558K  bruckewell
 bws2301.pdf 

Bruckewell Technology Corp., Ltd. P-Channel Enhancement-Mode MOSFETs BWS2301 MECHANICAL DATA * Case SOT-23 Molded plastic * Epoxy UL94V-O rate flame retardant Dimensions in millimeter Maximum Ratings (Tc=25 C unless otherwise noted) Parameter Symbol BWS2301 Unit Drain-Source Voltage BVDSS -20 V Gate- Source Voltage VGS +/-8 V Drain Current (continuous) ID -2.3 A Dr

 0.87. Size:290K  panjit
 pj2301.pdf 

PJ2301 20V P-Channel Enhancement Mode MOSFET FEATURES RDS(ON), VGS@-1.8V,ID@-1.5A=200m RDS(ON), VGS@-4.5V,ID@-2.2A=105m 0.120(3.04) Advanced Trench Process Technology 0.110(2.80) High Density Cell Design For Ultra Low On-Resistance Specially Designed for DC/DC converters Low gate charge 0.056(1

 0.88. Size:380K  panjit
 pj2301-au.pdf 

PPJ2301-AU 20V P-Channel Enhancement Mode MOSFET SOT-23 Unit inch(mm) Voltage -20 V Current -3.1A Features RDS(ON) , VGS@-4.5V, ID@-3.1A

 0.89. Size:336K  ait semi
 am2301.pdf 

AiT Semiconductor Inc. AM2301 www.ait-ic.com MOSFET -20V P-CHANNEL ENHANCEMENT MODE DESCRIPTION FEATURES The AM2301 is the P-Channel logic enhancement -20V/-3.2A, R =90m (typ.)@V =-4.5V DS(ON) GS mode power field effect transistor is produced using -20V/-2.0A, R =130m (typ.)@V =-2.5V DS(ON) GS high cell density. Advanced trench technology to Super high density cell de

 0.90. Size:133K  anachip
 af2301p.pdf 

AF2301P 20V P-Channel Enhancement Mode MOSFET Features Product Summary - Advanced trench process technology VDS = - 20V - High density cell design for ultra low on-resistance RDS (on), VGS@-4.5V, IDS@-2.8A =130m . - Excellent thermal and electrical capabilities RDS (on), VGS@-2.5V, IDS@-2.0A =190m . - Compact and low profile SOT-23 package Pin Descriptions Pin Assignments

 0.91. Size:235K  belling
 blm2301.pdf 

Pb Free Product BLM2301 P-Channel Enhancement Mode Power MOSFET DESCRIPTION D The BLM2301 uses advanced trench technology to provide excellent R , low gate charge and operation with gate DS(ON) G voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram V = -20V,I = -3A DS D R

 0.92. Size:132K  chenmko
 chm2301esgp.pdf 

CHENMKO ENTERPRISE CO.,LTD CHM2301ESGP SURFACE MOUNT P-Channel Enhancement Mode Field Effect Transistor VOLTAGE 20 Volts CURRENT 2.8 Ampere APPLICATION * Po rtable * High speed switch FEATURE SOT-23 * Small surface mounting type. (SOT-23) * High density cell design for low RDS(ON) * Suitable for high packing density. * Rugged and reliable. (1) * High saturation current capabili

 0.93. Size:218K  chenmko
 cht2301wgp.pdf 

CHENMKO ENTERPRISE CO.,LTD CHT2301WGP SURFACE MOUNT P-Channel Enhancement Mode Field Effect Transistor VOLTAGE 20 Volts CURRENT 2.3 Ampere APPLICATION * Servo motor control. * Power MOSFET gate drivers. * Other switching applications. SC-70/SOT-323 FEATURE * Small surface mounting type. (SC-70/SOT-323) * High density cell design for low RDS(ON). * Suitable for high packing dens

 0.94. Size:272K  chenmko
 cht2301gp.pdf 

CHENMKO ENTERPRISE CO.,LTD CHT2301GP SURFACE MOUNT P-Channel Enhancement Mode Field Effect Transistor VOLTAGE 20 Volts CURRENT 2.3 Ampere APPLICATION * Servo motor control. * Power MOSFET gate drivers. * Other switching applications. SOT-23 FEATURE * Small surface mounting type. (SOT-23) * High density cell design for low RDS(ON). * Suitable for high packing density. * Rugged

 0.95. Size:117K  comchip
 cj2301-hf.pdf 

MOSFET Comchip S M D D i o d e S p e c i a l i s t CJ2301-HF P-Channel RoHS Device Halogen Free SOT-23 Features - P-Channel 20-V(D-S) MOSFET 0.118(3.00) 0.110(2.80) - Trench FET Power MOSFET. 3 - Load Switch for Portable Devices. 0.055(1.40) - DC/DC Converter. 0.047(1.20) 1 2 Mechanical data 0.079(2.00) 0.071(1.80) - Case SOT-23, molded plastic. - Terminals Solde

 0.96. Size:259K  crownpo
 cpt2301.pdf 

CTP2301 Crownpo Technology CTP2301 P-Channel Enhancement Mode MOSFET Features Description -20V/-2.3A,RDS(ON) =130 m @VGS=-4.5V The CTP2301 is the P-Channel logic enhancement mode power field effect transistors are produced using -20V/-1.9A,R =190 m @VGS=-2.5V DS(ON) high cell density , DMOS trench technology. Super high density cell design for extremely low RDS(ON

 0.97. Size:877K  globaltech semi
 gsm2301as.pdf 

20V P-Channel Enhancement Mode MOSFET Product Description Features GSM2301AS, P-Channel enhancement mode -20V/-2.4A,RDS(ON)=125m @VGS=-4.5V MOSFET, uses Advanced Trench Technology to -20V/-2.0A,RDS(ON)=170m @VGS=-2.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely low RDS (ON) These devices are particularly suited for low voltage

 0.98. Size:827K  globaltech semi
 gsm2301s.pdf 

20V P-Channel Enhancement Mode MOSFET Product Description Features GSM2301S, P-Channel enhancement mode -20V/-2.8A,RDS(ON)=120m @VGS=-4.5V MOSFET, uses Advanced Trench Technology to -20V/-2.0A,RDS(ON)=170m @VGS=-2.5V provide excellent RDS(ON), low gate charge. Super high density cell design for These devices are particularly suited for low extremely low RDS (ON) volt

 0.99. Size:816K  globaltech semi
 gsm2301a.pdf 

20V P-Channel Enhancement Mode MOSFET Product Description Features -20V/-2.6A,RDS(ON)=120m @VGS=-4.5V GSM2301A, P-Channel enhancement mode -20V/-2.2A,RDS(ON)=170m @VGS=-2.5V MOSFET, uses Advanced Trench Technology to Super high density cell design for extremely provide excellent RDS(ON), low gate charge. low RDS (ON) These devices are particularly suited for low

 0.100. Size:477K  globaltech semi
 gsm2301.pdf 

20V P-Channel Enhancement Mode MOSFET Product Description Features GSM2301, P-Channel enhancement mode -20V/-3.0A,RDS(ON)=105m @VGS=-4.5V MOSFET, uses Advanced Trench Technology to -20V/-2.4A,RDS(ON)=155m @VGS=-2.5V provide excellent RDS(ON), low gate charge. Super high density cell design for extremely These devices are particularly suited for low low RDS (ON) volta

 0.101. Size:97K  kia
 kia2301.pdf 

-2.8A -20V 2301 P-CHANNELMOSFET KIA KIA KIA SEMICONDUCTORS SEMICONDUCTORS SEMICONDUCTORS 1. Features V =-20V,R =0.12 @V =-4.5V,I =-2.8A DS DS(on) GS D V =-20V,R =0.19 @V =-2.5V,I =-1.8A DS DS(on) GS D 2.Symbol Pin Function 1 Gate 2 Source 3 Drain 3. Absolute maximumratings Parameter Symbol Rating Units Drain-source voltage V -20 V DS Gate-source voltage V +8 V GS

 0.102. Size:1077K  matsuki electric
 me2301a me2301a-g.pdf 

ME2301A/ ME2301A-G P-Channel 20V (D-S) MOSFET GENERAL DESCRIPTION FEATURES The ME2301A is the P-Channel logic enhancement mode power field RDS(ON) 75m @VGS=-4.5V effect transistors are produced using high cell density, DMOS trench RDS(ON) 95m @VGS=-2.5V technology. This high density process is especially tailored to RDS(ON) 130m @VGS=-1.8V minimize on-stat

 0.103. Size:1127K  matsuki electric
 me2301 me2301-g.pdf 

ME2301/ME2301-G P-Channel Enhancement Mode Mosfet GENERAL DESCRIPTION FEATURES RDS(ON) 110m @VGS=-4.5V The ME2301 is the P-Channel logic enhancement mode power field RDS(ON) 150m @VGS=-2.5V effect transistors are produced using high cell density , DMOS trench Super high density cell design for extremely low RDS(ON) technology. This high density process is es

 0.104. Size:1999K  matsuki electric
 me2301dc me2301dc-g.pdf 

ME2301DC/ME2301DC-G P-Channel 20V(D-S) MOSFET, ESD Protected GENERAL DESCRIPTION FEATURES The ME2301DC is the P-Channel logic enhancement mode power RDS(ON) 110m @VGS=-4.5V field effect transistors are produced using high cell density , DMOS RDS(ON) 150m @VGS=-2.5V trench technology. This high density process is especially tailored to Super high density cell design

 0.105. Size:1321K  matsuki electric
 me2301gc me2301gc-g.pdf 

ME2301GC/ ME2301GC-G P-Channel 20V (D-S) MOSFET GENERAL DESCRIPTION FEATURES RDS(ON) 75m @VGS=-4.5V The ME2301GC is the P-Channel logic enhancement mode power RDS(ON) 95m @VGS=-2.5V field effect transistors are produced using high cell density, DMOS RDS(ON) 130m @VGS=-1.8V trench technology. This high density process is especially tailored to Sup

 0.106. Size:1298K  matsuki electric
 me2301dn me2301dn-g.pdf 

ME2301DN/ME2301DN-G P-Channel 20V(D-S) MOSFET, ESD Protected GENERAL DESCRIPTION FEATURES The ME2301DN is the P-Channel logic enhancement mode power RDS(ON) 90m @VGS=-4.5V field effect transistors are produced using high cell density , DMOS RDS(ON) 130m @VGS=-2.5V trench technology. This high density process is especially tailored to Super high density cell desig

 0.107. Size:1009K  matsuki electric
 me2301s me2301s-g.pdf 

ME2301S/ME2301S-G P-Channel 20V (D-S) MOSFET GENERAL DESCRIPTION FEATURES RDS(ON) 110m @VGS=-4.5V The ME2301S is the P-Channel logic enhancement mode power field RDS(ON) 150m @VGS=-2.5V effect transistors are produced using high cell density , DMOS trench Super high density cell design for extremely low RDS(ON) technology. This high density process is espec

 0.108. Size:152K  m-mos
 mmp2301.pdf 

MMP2301 Data Sheet M-MOS Semiconductor Hong Kong Limited 20V P-Channel Enhancement-Mode MOSFET VDS= -20V RDS(ON), Vgs@-4.5V, Ids@-2.8A = 100m RDS(ON), Vgs@-2.5V, Ids@-2.0A = 150m RDS(ON), Vgs@-1.8V, Ids@-2.0A = 170m Features Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance SOT- 23 Internal Schematic Diagram Top View P-Channel MOSFET M

 0.109. Size:262K  ncepower
 nce2301a.pdf 

Pb Free Product http //www.ncepower.com NCE2301A NCE P-Channel Enhancement Mode Power MOSFET Description The NCE2301A uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. General Features VDS = -15V,ID = -3.0A Schematic diagram

 0.110. Size:257K  ncepower
 nce2301c.pdf 

Pb Free Product http //www.ncepower.com NCE2301C NCE P-Channel Enhancement Mode Power MOSFET Description D The NCE2301C uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM applications. S General Features Schematic diagram VDS = -15V,

 0.111. Size:330K  ncepower
 nce2301e.pdf 

Pb Free Product http //www.ncepower.com NCE2301E NCE P-Channel Enhancement Mode Power MOSFET Description The NCE2301E uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications .It is ESD protested. Schematic diagram General Features

 0.112. Size:598K  ncepower
 ncea2301.pdf 

http //www.ncepower.com NCEA2301 NCE P-Channel Enhancement Mode Power MOSFET Description The NCEA2301 uses advanced trench technology to provide excellent R , low gate charge and operation with gate DS(ON) voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. General Features V = -20V,I = -3A DS D R

 0.113. Size:241K  ncepower
 nce2301.pdf 

Pb Free Product http //www.ncepower.com NCE2301 NCE P-Channel Enhancement Mode Power MOSFET Description The NCE2301 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. General Features Schematic diagram VDS = -20V,ID = -3A

 0.114. Size:261K  ncepower
 nce2301f.pdf 

Pb Free Product http //www.ncepower.com NCE2301F NCE P-Channel Enhancement Mode Power MOSFET Description D The NCE2301F uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM applications. S General Features Schematic diagram VDS = -20V,

 0.115. Size:249K  ncepower
 nce2301d.pdf 

Pb Free Product http //www.ncepower.com NCE2301D NCE P-Channel Enhancement Mode Power MOSFET Description D The NCE2301D uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM applications. S General Features Schematic diagram VDS = -20V,

 0.116. Size:250K  ncepower
 nce2301b.pdf 

Pb Free Product http //www.ncepower.com NCE2301B NCE P-Channel Enhancement Mode Power MOSFET Description D The NCE2301B uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM applications. S General Features Schematic diagram VDS = -20V,

 0.117. Size:1155K  prisemi
 ppmt2301.pdf 

 0.118. Size:371K  semtron
 stp2301.pdf 

STP2301 -20V P-Channel Enhancement Mode MOSFET DESCRIPTION FEATURE The STP2301 is the P-Channel logic enhancement -20V/-3.0A, RDS(ON) =80m (typ.)@VGS =-4.5V mode power field effect transistor is produced using -20V/-2.0A, RDS(ON) =105m (typ.)@VGS =-2.5V high cell density. advanced trench technology to provide excellent RDS(ON). .low gate charge and Super h

 0.119. Size:150K  silicon standard
 ssm2301gn.pdf 

SSM2301N P-CHANNEL ENHANCEMENT-MODE POWER MOSFET Simple drive requirement BV -20V DSS Small package outline RDS(ON) 130m D Surface-mount device ID -2.3A S SOT-23 G Description D Power MOSFETs from Silicon Standard Corp. provide the designer with the best combination of fast switching, low G on-resistance and cost-effectiveness. S The SOT-23 package is widely preferred for co

 0.120. Size:509K  slkor
 sl2301.pdf 

SL2301 P-Channel Power MOSFET D General Features VDS = -20V,ID = -2.8A G RDS(ON)

 0.121. Size:1411K  slkor
 sl2301s.pdf 

SL2301S SOT-23 Package Information Dimensions in Millimeters Symbol MIN. MAX. A 0.900 1.150 A1 0.000 0.100 A2 0.900 1.050 b 0.300 0.500 c 0.080 0.150 D 2.800 3.000 E 1.200 1.400 E1 2.250 2.550 e 0.950TYP e1 1.800 2.000 L 0.550REF L1 0.300 0.500 0 8 www.slkormicro.com 3

 0.122. Size:187K  stansontech
 st2301a.pdf 

ST2301A P Channel Enhancement Mode MOSFET -3.2A DESCRIPTION ST2301A is the P-Channel logic enhancement mode power field effect transistor which is produced using high cell density, DMOS trench technology.This high density process is especially tailored to minimize on-state resistance.These devices are particularly suited for low voltage application such as cellular phone and not

 0.123. Size:322K  tiptek
 tp2301pr.pdf 

TP2301PR P-CHANNEL ENHANCEMENT-MODE MOSFET FEATURES ADVANCED TRENCH PROCESS TECHNOLOGY HIGH DENSITY CELL DESIGN FOR ULTRA LOW ON-RESISTANCE FULLY CHARACTERIZED AVALANCHE VOLTAGE AND CURRENT IMPROVED SHOOT-THROUGH FOM BOTH NORMAL AND PB FREE PRODUCT ARE AVAILABLE NORMAL 80 95% SN, 5 20% PB PB FREE 99% SN ABOVE MECHANICAL DATA WE DECLARE THAT

 0.124. Size:949K  umw-ic
 si2301a.pdf 

R UMW UMW SI2301A SOT 23 UMW SI2301A P-Channel 20-V(D-S) MOSFET ID V(BR)DSS RDS(on)MAX 112m @-4.5V -20V A -2.8 1. GATE 142m @-2.5V 2. SOURCE 3. DRAIN FEATURE APPLICATION TrenchFET Power MOSFET z z Load Switch for Portable Devices z DC/DC Converter MARKING Equivalent Circuit A1 Maximum ratings (Ta=25 unless otherwise noted) Parameter Symbol Valu

 0.125. Size:827K  umw-ic
 si2301b.pdf 

R UMW UMW SI2301B UMW SI2301B UMW SI2301B P-Channel 20-V(D-S) MOSFET UMW SI2301B ID V(BR)DSS RDS(on)MAX SOT-23 120 m @-4.5V -20V 2.5 A m @-2.5V 150 1. GATE 2. SOURCE 3. DRAIN APPLICATION FEATURE z Load Switch for Portable Devices TrenchFET Power MOSFET z DC/DC Converter MARKING Equivalent Circuit A1SHB Maximum ratings (Ta=25 unless otherwise note

 0.126. Size:497K  agertech
 atm2301psc.pdf 

ATM2301PSC P-Channel Enhancement Mode Field Effect Transistor Drain-Source Voltage -20V Drain Current -3A Features Trench FET Power MOSFET Excellent R and Low Gate Charge DS(on) R

 0.127. Size:445K  agertech
 atm2301psa.pdf 

ATM2301PSA P-Channel Enhancement Mode Field Effect Transistor Drain-Source Voltage -20V Drain Current -2.5A Features Trench FET Power MOSFET Excellent R and Low Gate Charge DS(on) R

 0.128. Size:1595K  allpower
 ap2301.pdf 

2301 P-Channel 20-V(D-S) MOSFET DATA SHEET DESCRIPTION D The 2301 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram VDSS RDS(ON) RDS(ON) ID (Typ) @-2.5V @-4.5V (Typ) -20V 64m

 0.129. Size:2119K  allpower
 ap2301b.pdf 

 0.130. Size:1796K  anbon
 as2301.pdf 

AS2301 P-Channel MOSFET SOT-23 Plastic-Encapsulate MOSFETS SOT-23 FEATURE TrenchFET Power MOSFET 1. GATE APPLICATIONS 2. SOURCE Load Switch for Portable Devices 3. DRAIN DC/DC Converter MARKING A1 Maximum ratings (Ta=25 unless otherwise noted) Characteristic Symbol Max Unit Drain-Source Voltage BVDSS -20 V -

 0.131. Size:879K  ascend
 asdm2301.pdf 

ASDM2301 20V P-CHANNEL MOSFET Product Summary Features High Power and current handing capability VDSS RDS(ON) RDS(ON) ID (Typ) (Typ) @-4.5V @-2.5V Lead free product is acquired Surface Mount Package -20V 65m 83m -3 A Application PWM applications Load switch Power management top view D G SOT-23 Absolute Maximum Ratings (TA=25 unless otherwi

 0.132. Size:830K  ascend
 asdm2301za.pdf 

ASDM2301ZA 20V P-CHANNEL MOSFET Features Product Summary High Power and current handing capability VDSS RDS(ON) RDS(ON) ID Lead free product is acquired (Typ) (Typ) @-4.5V @-2.5V Surface Mount Package -20V 65m 83m -3 A Application PWM applications Load switch Power management top view D G SOT-23 Absolute Maximum Ratings (TA=25 unless other

 0.133. Size:5352K  born
 si2301-p.pdf 

SI2301-P MOSFET ROHS P-Channel MOSFET SOT-23 - Features Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance Maximum Ratings & Thermal Characteristics (Ratings at 25 ambient temperature unless otherwise specified.) Parameter Symbol Limit Unit Drain-Source Voltage VDS -20 V Gate-Source Voltage 10 VGS ID Continuous Drain

 0.134. Size:1898K  born
 si2301s.pdf 

SI2301S MOSFET ROHS P-Channel Enhancement-Mode MOSFET SOT-23 - Features Low RDS(on) @VGS=-4.5V -3.3V Logic Level Control P Channel SOT23 Package Pb-Free, RoHS Compliant Applications V R Typ I Max (BR)DSS DS(ON) D High-side Load Switch 125m @ 4.5V Switching Circuits -20V -2.3A High Speed line Driver 140m @ 3.3V Order Information

 0.135. Size:1239K  born
 si2301f.pdf 

SI2301F P-Channel MOSFET Features Pin Configurations V = -20V DS I D = -2.2A R @V = -4.5V, Typ =95m DS(ON) GS R @V = -2.5V, Typ =130m DS(ON) GS General Description Advanced trench process technology High power and current handing capability Lead free product is acquired SOT-23 for Surface Mount Package. Application PWM applications Lo

 0.136. Size:882K  born
 bmdfn2301.pdf 

BMDFN2301 P-Channel MOSFET Features Pin Configurations V = -20V DS I D = -0.74A D R @V = -4.5V, TYP =230m DS(ON) GS R @V = -2.8V, TYP =320m DS(ON) GS R @V = -2.5V, TYP =355m DS(ON) GS R @V = -1.8V, TYP =650m DS(ON) GS S G General Description G Advanced trench process technology S D High Density Cell Design For Ultra Low On-Resistance

 0.137. Size:759K  born
 bms2301.pdf 

BMS2301 P-Channel MOSFET Features Pin Configurations V = -20V DS I D = -1.4A R @V = -4.5V, Max =100m DS(ON) GS R @V = -2.5V, Max =140m DS(ON) GS R @V = -1.8V, Max =210m DS(ON) GS General Description Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance SOT-323 for Surface Mount Package. Absolute Maximum Ratings

 0.138. Size:2373K  fuxinsemi
 fs2301.pdf 

FS2301 P-Channel SMD MOSFET Product Summary V R I (BR)DSS DS(on)MAX D 120m @-4.5V -20V -2.4A 180m @-2.5V Feature Application Advanced trench process technology Load Switch for Portable Devices High density cell design for ultra low on-resistance DC/DC Converter Package Circuit diagram D G SOT-23 S Marking A1SHB www.fuxinsemi.com Page 1 Ver2.1 FS2301 P-Ch

 0.139. Size:339K  eternal
 en2301.pdf 

Eternal Semiconductor Inc. EN2301 P-Channel Enhancement-Mode MOSFET (-20V, -2.8A) PRODUCT SUMMARY VDSS ID RDS(on) (m )Typ. 85 @ VGS = -4.5V,ID=-2.8A -20V -2.8A 105 @ VGS = -2.5V,ID=-2.0A Features Super high dense cell trench design for low RDS(on) Advanced Trench Process Technology SOT-23 package Lead Pb -free and halogen-free EN2301 Pin Assignment & Symbol

 0.140. Size:3K  fms
 as2301.txt 

 0.141. Size:20K  fms
 as2301 0002.jpg 

 0.142. Size:9K  fms
 as2301 0001.jpg 

 0.143. Size:419K  fms
 as2301.pdf 

P-Channel Enhancement Mode MOSFET Formosa MS AS2301 Product Summary V(BR)DSS RDS(on)MAX ID 64m @-4.5V -20V 80m @-2.5V -3.4A 95m @-1.8V Feature Application Advanced trench process technology Load Switch for Portable Devices High density cell design for ultra low on-resistance DC/DC Converter Package Circuit diagram SOT-23 Marking S1. Document ID http //www.form

 0.144. Size:790K  gp
 gp2301.pdf 

GP2301 20V P-Channel MOSFET Product Summary SOT-23 V R I (BR)DSS DS(on)MAX D 110m @-4.5V -20V -2.3A 140m @-2.5V Feature TrenchFET Power MOSFET Excellent RDS(on) and Low Gate Charge Schematic diagram Application DC/DC Converter Load Switch for Portable Devices Battery Switch MARKING ABSOLUTE MAXIMUM RATINGS (Ta=25 unless otherwise note

 0.145. Size:279K  guangdong hottech
 si2301.pdf 

Plastic-Encapsulate Mosfets FEATURES SI2301 P-Channel MOSFET High dense cell design for extremely low RDS(ON) Rugged and reliable Case Material Molded Plastic. Absolute Maximum Ratings (TA=25oC, unless otherwise noted) Parameter Symbol Ratings Units Drain-Source Voltage VDS -20 V 1.Gate Gate-Source Voltage VGS 8 V 2.Source SOT-23 Drain Current (Continuous) ID -2.3 A 3.Drain 1 D

 0.146. Size:1062K  huashuo
 hss2301c.pdf 

HSS2301C P-Ch 20V Fast Switching MOSFETs Description Product Summary The HSS2301C is the high cell density trenched P- V -20 V DS ch MOSFETs, which provides excellent RDSON and efficiency for most of the small power switching R 130 m DS(ON),typ and load switch applications. I -2 A D The HSS2301C meet the RoHS and Green Product requirement with full function reliability a

 0.147. Size:482K  huashuo
 hss2301b.pdf 

HSS2301B P-Ch 20V Fast Switching MOSFETs Description Product Summary The HSS2301B is the high cell density trenched P- V -20 V DS ch MOSFETs, which provides excellent RDSON and efficiency for most of the small power switching R 89 m DS(ON),typ and load switch applications. I -3 A D The HSS2301B meet the RoHS and Green Product requirement with full function reliability ap

 0.148. Size:316K  hx
 hx2301.pdf 

SOT-23 -3Plastic-Encapsulate Transistors HX2301 MOSFET(P-Channel) FEATURES TrenchFET Power MOSFET MARKING A1SHB MAXIMUM RATINGS (TA=25 unless otherwise noted) Symbol Parameter Value Units VDS Drain-Source voltage -20 V VGS Gate-Source voltage 12 V -2.8 A ID Drain current PD Power Dissipation 1 W Tj Junction Temperature 150 Tstg Storage Temperature -55-150 E

 0.149. Size:181K  hx
 hx2301a.pdf 

SOT-23 Plastic-Encapsulate Transistors HX2301A MOSFET(P-Channel) FEATURES PWM applications Load switch Power management MARKING A1SHB MAXIMUM RATINGS (TA=25 unless otherwise noted) Symbol Parameter Value Units VDS Drain-Source voltage -20 V VGS Gate-Source voltage 12 V ID Drain current -2.5 A PD Power Dissipation 0.9 W Tj Junction Temperature 150 Tstg Storage Temperature

 0.150. Size:393K  jiejie micro
 jmtl2301b.pdf 

JMTL2301B Description JMT P-channel Enhancement Mode Power MOSFET Features Application V =-20V, I =-2.5A PWM Applications DS D R

 0.151. Size:1136K  jiejie micro
 jmtl2301e.pdf 

JMTL2301E Description JMT P-channel Enhancement Mode Power MosFET Features Applications -20V, -2A Load Switch RDS(ON)

 0.152. Size:428K  jiejie micro
 jmtl2301c.pdf 

JMTL2301C Description JMT P-channel Enhancement Mode Power MOSFET Features Application V = -20V, I = -3A PWM Applications DS D R

 0.153. Size:592K  jestek
 jst2301h.pdf 

JST2301H -20V,-3A P-Channel Mosfet FEATURES SOT-23 RDS(ON) 110m @VGS=-4.5V RDS(ON) 140m @VGS=-2.5V APPLICATIONS Load Switch for Portable Devices DC/DC Converter MARKING P-CHANNEL MOSFET Maximum ratings (Ta=25 unless otherwise noted) Parameter Symbol Value Unit Drain-Source Voltage VDS -20 V Gate-Source Voltage V 12 GS I -3 D Continuous Drain Current A Pulse

 0.154. Size:353K  jsmsemi
 jsm2301s.pdf 

JSM2301S /Features 1 2 /Applications /Absolute maximum ratings(Ta=25 ) /Parameter / Symbol /Value /Unit - /Drain-Source Voltage V -20 V DS - /Gate-Source Voltage V 8 V GS /C

 0.155. Size:229K  lowpower
 lpm2301b3f.pdf 

Preliminary Datasheet LPM2301 LPM2301 -20V/-2A P-Channel Enhancement Mode Field Effect Transistor General Description Features -20V/-2.0A,RDS(ON)=170m (typ.)@VGS=-2.5V The LPM2301 is the P-channel logic enhancement -20V/-2.0A,RDS(ON)=130m (typ.)@VGS=-4.5V mode power field effect transistors are produced Super high density cell design for extremely low using high

 0.156. Size:938K  lonten
 lpsc2301.pdf 

LPSC2301 Lonten P-channel -20V, -2A, 110m Power MOSFET Description Product Summary These P-Channel enhancement mode power field VDSS -20V effect transistors are using trench DMOS RDS(on).max@ VGS=-4.5V 110m technology. This advanced technology has been ID -2A especially tailored to minimize on-state resistance, provide superior switching performance, and with stand high ener

 0.157. Size:662K  natlinear
 np2301amr-g.pdf 

NP2301A P-Channel Enhancement Mode MOSFET Description Schematic diagram The NP2301A uses advanced trench technology S to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM G applications. General Features D VDS =-20V ID =-2.8A Marking and pin assignment RDS(ON)(Typ.)=7

 0.158. Size:579K  mdd
 si2301s.pdf 

SI2301S SOT-23 Plastic-Encapsulate MOSFETS SOT-23 20V P-Channel MOSFET 3 ID Max V(BR)DSS RDS(on)Typ 125m @4.5V 1. GATE -2.3A -20V 2. SOURCE 140m @3.3V 1 3. DRAIN 2 APPLICATION Features Load Switch for Portable Devices Trench FET Power MOSFET DC/DC Converter MARKING Equivalent circuit D A1sHB G S PACKAGE SPECIFICATIONS Reel DIA. Q'TY/Ree

 0.159. Size:932K  mdd
 si2301.pdf 

SI2301 SOT-23 Plastic-Encapsulate MOSFETS SOT-23 20V P-Channel MOSFET 3 ID Max V(BR)DSS RDS(on)Typ 70m @4.5V 1. GATE -3.0A -20V 2. SOURCE 78m @3.3V 1 3. DRAIN 2 APPLICATION Features Load Switch for Portable Devices Trench FET Power MOSFET DC/DC Converter MARKING Equivalent circuit D A1sHB G S PACKAGE SPECIFICATIONS Reel DIA. Q'TY/Reel

 0.160. Size:303K  msksemi
 si2301ai-ms.pdf 

www.msksemi.com SI2301AI-MS Semiconductor Compiance General Features V = -20V,I = -3A DS D R

 0.161. Size:364K  microne
 mem2301xg-n.pdf 

MEM2301XG-N P-Channel MOSFET MEM2301XG-N General Description Features MEM2301XG-N Series P-channel enhancement -20V/-2.8A mode field-effect transistor , These miniature surface RDS(ON), Vgs@-1.8V, Ids@-1.1A = 230m mount MOSFETs utilize High Cell Density process. RDS(ON), Vgs@-2.5V, Ids@-2.0A = 140m Low RDS(ON) assures minimal power loss and RDS(ON), Vgs@-4.5V, Ids@-3.1A = 9

 0.162. Size:306K  microne
 mem2301x.pdf 

MEM2301 P-Channel MOSFET MEM2301X General Description Features MEM2301XG Series P-channel enhancement mode -20V/-2.8A field-effect transistor ,produced with high cell density RDS(ON) =93m @ VGS=-4.5V,ID=-2.8A DMOS trench technology, which is especially used to RDS(ON) =113m @ VGS=-2.5V,ID=-2A minimize on-state resistance. This device particularly High Density Cell Design

 0.163. Size:837K  cn szxunrui
 si2301a.pdf 

SOT-23 Plastic-Encapsulate MOSFETS SI2301A SI2301A P-Channel 20-V(D-S) MOSFET V(BR)DSS RDS(on)MAX ID SOT-23 0.085 @-4.5V -20V -3.0A 3 0.110 @-2.5V 1.GATE 2.SOURCE 3.DRAIN 1 2 General FEATURE TrenchFET Power MOSFET MARKING Equivalent Circuit Lead free product is acquired Surface mount package A1 w APPLICATION Load Switch for Portable Devices DC/DC Converter

 0.164. Size:809K  cn szxunrui
 si2301.pdf 

SOT-23 Plastic-Encapsulate MOSFETS SI2301 SI2301 P-Channel 20-V(D-S) MOSFET V(BR)DSS RDS(on)MAX ID SOT-23 0.100 @-4.5V -20V -2.8A 3 0.130 @-2.5V 1.GATE 2.SOURCE 3.DRAIN 1 2 General FEATURE TrenchFET Power MOSFET MARKING Equivalent Circuit Lead free product is acquired Surface mount package - A1sHB w APPLICATION Load Switch for Portable Devices DC/DC Conv

 0.165. Size:1074K  pjsemi
 pjm2301psa-s.pdf 

PJM2301PSA-S P- Enhancement Mode Field Effect Transistor Features SOT-23 VDS= -20V I = -2A D R =120m (typ) @ V =-2.5V DS(ON) GS R =88m (typ) @ V =-4.5V DS(ON) GS High power and current handing capability Halogen and Antimony Free Surface mount package 1. Gate 2.Source 3.Drain Marking S01 Drain 3 Applications Battery protection Load s

 0.166. Size:1405K  pjsemi
 pjm2301psa.pdf 

 0.167. Size:273K  cn shenzhen fuman elec
 2301p.pdf 

FM , FM WWW.SZLCSC.COM, SHEN ZHEN FINE MADE ELECTRONICS GROUP CO., LTD. 2301P( S&CIC1974) P-Channel Trench Power MOSFET Description P-channel MOSFET Features Application V =-20V, I =-2.8A D

 0.168. Size:2897K  cn puolop
 si2301a.pdf 

SI2301A 20V P-Channel Enhancement-Mode MOSFET VDS= -20V RDS(ON), Vgs@-4.5V, Ids@-3.0A 110m RDS(ON), Vgs@-2.5V, Ids@-2.0A 140m Features Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance Package Dimensions D G S SOT-23(PACKAGE) Millimeter Millimeter REF. REF. Min. Max. Min. Max. A 2.70 3.10 G 1.90 REF. B 2.40 2.80 H 1.00 1.3

 0.169. Size:2196K  cn puolop
 si2301.pdf 

SI2301 -20V P-Channel Enhancement Mode MOSFET VDS= -20V RDS(ON), Vgs@-4.5V, Ids@-2.3A 130m RDS(ON), Vgs@-2.5V, Ids@-2.0A 190m Features Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance Package Dimensions D SOT-23 G S Millimeter Millimeter REF. REF. Min. Max. Min. Max. A 2.80 3.00 G 1.80 2.00 B 2.30 2.50 H 0.90 1.1 C 1.20

 0.170. Size:695K  cn shikues
 apm2301aac.pdf 

APM2301AAC P-Channel Enhancement Mode MOSFET Feature DS(ON) GS -20V/-3A R = 120m (MAX) @V = -4.5V. DS(ON) GS R = 150m (MAX) @V = -2.5V. DS(ON) Super High dense cell design for extremely low R Reliable and Rugged SC-59 for Surface Mount Package SC-59 Applications Power Management Portable Equipment and Battery Powered Systems. A T =25 U

 0.171. Size:1025K  cn shikues
 sk2301aa.pdf 

 0.172. Size:878K  cn shikues
 sk2301a.pdf 

 0.173. Size:718K  wpmtek
 wtm2301.pdf 

WTM2301 P-Channel Enhancement Mode Power MOSFET Description The WTM2301 uses advanced trench technology to provide excellent R , low gate charge and operation with gate DS(ON) voltages as low as 2.5V. This device is suitable for use as a battery protection or in other switching application. Features V DS = -20V, lD = -3A R

 0.174. Size:1356K  cn yongyutai
 si2301.pdf 

SI2301 SOT-23 (SOT-23 Field Effect Transistors) P-Channel Enhancement-Mode MOS FETs P MOS MAXIMUM RATINGS Characteristic Symbol Max Unit Drain-Source Voltage -20 V BV DSS - Gate- Source Voltage +10 V V GS - Drain Current (continuous) I -2.2

 0.175. Size:607K  cn alj
 si2301.pdf 

SHENZHEN LONG JING MICRO-ELECTRONICS CO., LTD. SOT-23 Plastic-Encapsulate MOSFETS SI2301 P-Channel 20V(D-S) MOSFET Features V = -20V, I = -2.5A DS D R

 0.176. Size:703K  cn tuofeng
 tf2301a.pdf 

SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD SOT-23 Plastic-Encapsulate MOSFETS TF2301A TF2301A P-Channel 20-V(D-S) MOSFET V(BR)DSS RDS(on)MAX ID SOT-23 0.085 @-4.5V -20V -3.0A 3 0.110 @-2.5V 1.GATE 2.SOURCE 3.DRAIN 1 2 General FEATURE TrenchFET Power MOSFET MARKING Equivalent Circuit Lead free product is acquired Surface mount package A1 w APPLICATION L

 0.177. Size:677K  cn tuofeng
 tf2301.pdf 

SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD SOT-23 Plastic-Encapsulate MOSFETS TF2301 TF2301 P-Channel 20-V(D-S) MOSFET V(BR)DSS RDS(on)MAX ID SOT-23 0.100 @-4.5V -20V -2.8A 3 0.130 @-2.5V 1.GATE 2.SOURCE 3.DRAIN 1 2 General FEATURE TrenchFET Power MOSFET MARKING Equivalent Circuit Lead free product is acquired Surface mount package - A1sHB w APPLICATION

 0.178. Size:2248K  cn twgmc
 si2301.pdf 

SI2301 SI2305 AO3401 SOT-23 Plastic-Encapsulate MOSFETS P-Channel 20-V( D-S) MOSFET FEATURE TrenchFET Power MOSFET APPLICATIONS z Load Switch for Portable Devices z DC/DC Converter MARKING Equivalent Circuit A1SHB A09T A19T 1.GATE 2.SOURCE 3.DRAIN Maximum ratings (Ta=25 unless otherwise noted) Parameter Symbol Value Unit Drain-Source Voltage VDS -20 V Gate-Sourc

 0.179. Size:888K  winsok
 wst2301.pdf 

WST2301 P-Ch MOSFET General Description Product Summery The WST2301 is the highest performance trench BVDSS RDSON ID P-ch MOSFET with extreme high cell density , which provide excellent RDSON and gate -20V 100m -2.9A charge for most of the small power switching and load switch applications. Applications The WST2301 meet the RoHS and Green Product requirement with full fu

 0.180. Size:1114K  winsok
 wst2301a.pdf 

WST2301A P-Ch MOSFET General Description Product Summery The WST2301A is the highest performance BVDSS RDSON ID trench P-ch MOSFET with extreme high cell density , which provide excellent RDSON and -20V 140m -2.5A gate charge for most of the small power switching and load switch applications. Applications The WST2301A meet the RoHS and Green Product requirement with full

 0.181. Size:497K  cn sino-ic
 se2301.pdf 

SHANGHAI July 2005 MICROELECTRONICS CO., LTD. SE2301 20V P-Channel Enhancement-Mode MOSFET Revision B General Description Features The MOSFETs from SINO-IC provide For a single mosfet the best combination of fast switching, low VDS = -20 V on-resistance and cost-effectiveness. RDS(ON) = 100m @ VGS=-4.50V @Ids=-2.8A RDS(ON) = 150m @ VGS=-2.50V @Ids=-2.0A Gener

 0.182. Size:645K  cn vanguard
 vs2301bc.pdf 

VS2301BC -20V/-3A P-Channel Advanced Power MOSFET Features V DS -20 V P-Channel R DS(on),TYP @VGS=-4.5V 77 m Enhancement mode R DS(on),TYP @VGS=-3.3V 87 m Fast Switching R DS(on),TYP @VGS=-2.5V 103 m Pb-free lead plating; RoHS compliant I D -3 A SOT23 Tape and reel Part ID Package Type Marking information V2301BC SOT23 A1SHB 3000pcs/ree

 0.183. Size:2460K  cn sps
 sm2301.pdf 

SM2301 P-Channel Enhancement-Mode MOSFET Features 1 Advanced Trench Process Technology. 2 High Density Cell Design for Ultra Low On-Resistance. 3 Improved Shoot-Through FOM 4 RoHS Compliant PRODUCT SUMMARY VDSS ID RDS(on) (m-ohm) Max 100 @ VGS = -4.5V, ID=-2.8A 150 @ VGS = -2.5V, ID=-2.0A -20V -2.8A 170 @ VGS = -1.8V, ID=-2.0A SM2301 Pin Assignment &

 0.184. Size:871K  cn vbsemi
 mem2301.pdf 

 0.185. Size:869K  cn vbsemi
 ao2301.pdf 

AO2301 www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICATIONS

 0.186. Size:2936K  cn vbsemi
 af2301pwl.pdf 

AF2301PWL www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICATIONS

 0.187. Size:870K  cn vbsemi
 ces2301.pdf 

CES2301 www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICATIONS

 0.188. Size:869K  cn vbsemi
 mtp2301n3.pdf 

MTP2301N3 www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICATIONS

 0.189. Size:794K  cn vbsemi
 ut2301g-ae3-r.pdf 

UT2301G-AE3-R www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLIC

 0.190. Size:893K  cn vbsemi
 si2301ads-t1.pdf 

SI2301ADS-T1 www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICATION

 0.191. Size:892K  cn vbsemi
 si2301cds-t1.pdf 

SI2301CDS-T1 www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICATION

 0.192. Size:852K  cn vbsemi
 dmg2301u.pdf 

DMG2301U www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICATION

 0.193. Size:775K  cn vbsemi
 apm2301ac.pdf 

APM2301AC www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICATIO

 0.194. Size:866K  cn vbsemi
 si2301bds-t1-ge3.pdf 

SI2301BDS-T1-GE3 www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICA

 0.195. Size:913K  cn vbsemi
 kd2301.pdf 

KD2301 www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICATIONS

 0.196. Size:868K  cn vbsemi
 ap2301n.pdf 

 0.197. Size:1768K  cn vbsemi
 hm2301kr.pdf 

HM2301KR www.VBsemi.tw P-Channel 20 V (D-S) MOSFET FEATURES PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)c Qg (Typ.) Definition 0.080 at VGS = - 4.5 V - 3.1 TrenchFET Power MOSFET 4.3 nC - 20 0.100 at VGS = - 2.5 V - 2.3 100 % Rg Tested Compliant to RoHS Directive 2002/95/EC APPLICATIONS Load Switch DC/DC Convert

 0.198. Size:866K  cn vbsemi
 si2301ds-t1-ge3.pdf 

SI2301DS-T1-GE3 www.VBsemi.tw P-Channel 20-V (D-S) MOSFET FEATURES MOSFET PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 VDS (V) RDS(on) ( )ID (A)a Qg (Typ.) Definition 0.035 at VGS = - 10 V - 5e TrenchFET Power MOSFET e - 20 0.043 at VGS = - 4.5 V - 5 10 nC 100 % Rg Tested 0.061 at VGS = - 2.5 V - 4.8 Compliant to RoHS Directive 2002/95/EC APPLICAT

 0.199. Size:9298K  cn tech public
 si2301cds.pdf 

 0.200. Size:618K  cn yangzhou yangjie elec
 yjl2301g.pdf 

RoHS COMPLIANT YJL2301G P-Channel Enhancement Mode Field Effect Transistor Product Summary V -15V DS I -2.0A D R ( at V =-4.5V) 100 mohm DS(ON) GS R ( at V =-2.5V) 130 mohm DS(ON) GS R ( at V =-1.8V) 230 mohm DS(ON) GS General Description Trench Power LV MOSFET technology Low R DS(ON) Low Gate Charge Applications

 0.201. Size:593K  cn yangzhou yangjie elec
 yjl2301d.pdf 

RoHS COMPLIANT YJL2301D P-Channel Enhancement Mode Field Effect Transistor Product Summary V -15V DS I -3.8A D R ( at V =-4.5V) 52 mohm DS(ON) GS R ( at V =-2.5V) 78 mohm DS(ON) GS R ( at V =-1.8V) 110 mohm DS(ON) GS General Description Trench Power LV MOSFET technology Low R DS(ON) Low Gate Charge Applications Vi

 0.202. Size:579K  cn yangzhou yangjie elec
 yjl2301f.pdf 

RoHS COMPLIANT YJL2301F P-Channel Enhancement Mode Field Effect Transistor Product Summary V -20V DS I -2A D R ( at V =-4.5V) 120 mohm DS(ON) GS R ( at V =-2.5V) 150 mohm DS(ON) GS R ( at V =-1.8V) 250 mohm DS(ON) GS General Description Trench Power LV MOSFET technology Low R DS(ON) Low Gate Charge Applications Vi

 0.203. Size:600K  cn yangzhou yangjie elec
 yjs2301a.pdf 

RoHS COMPLIANT YJS2301A P-Channel Enhancement Mode Field Effect Transistor Product Summary V -20V DS I -3.7A D R ( at V =-4.5V) 64 mohm DS(ON) GS R ( at V =-2.5V) 80 mohm DS(ON) GS R ( at V =-1.8V) 110 mohm DS(ON) GS General Description Trench Power LV MOSFET technology Low R DS(ON) Low Gate Charge Applications Vi

 0.204. Size:519K  cn yangzhou yangjie elec
 yjl2301c.pdf 

RoHS COMPLIANT YJL2301C P-Channel Enhancement Mode Field Effect Transistor Product Summary V -20V DS I -3.4A D R ( at V =-4.5V) 64 mohm DS(ON) GS R ( at V =-2.5V) 80 mohm DS(ON) GS R ( at V =-1.8V) 110 mohm DS(ON) GS General Description Trench Power LV MOSFET technology High Power and Current handing capability Low Gate Ch

 0.205. Size:728K  cn wuxi unigroup
 ttx2301a.pdf 

TTX2301A Wuxi Unigroup Microelectronics CO.,LTD. 20V P-Channel Trench MOSFET(Preliminary) General Description Product Summary Trench Power technology VDS -20V Low RDS(ON) ID (at VGS =-4.5V) -2.6A Low Gate Charge RDS(ON) (at VGS =-10V)

 0.206. Size:572K  cn hmsemi
 hm2301a.pdf 

HM2301A P-Channel Enhancement Mode Power MOSFET DESCRIPTION D The HM2301A uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram VDS = -20V,ID = -3A RDS(ON)

 0.207. Size:652K  cn hmsemi
 hm2301c.pdf 

HM2301 P-Channel Trench Power MOSFET General Description The HM2301 uses advanced trench technology to provide excellent R , low gate charge and operation with gate DS(ON) voltages as low as -2.5V. This device is suitable for use as a battery protection or in other switching application. Features Schematic Diagram VDS = -12V,ID =-2. A R

 0.208. Size:534K  cn hmsemi
 hm2301.pdf 

HM2301 P-Channel Enhancement Mode Power MOSFET DESCRIPTION D The HM2301 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram VDS = -20V,ID = -3A RDS(ON)

 0.209. Size:1133K  cn hmsemi
 hm2301bkr.pdf 

HM2301BKR P-Channel 20V (D-S) MOSFET GENERAL DESCRIPTION FEATURES The HM2301BKR is the P-Channel logic enhancement mode power RDS(ON)= 0.48 @VGS=-4.5V field effect transistors are produced using high cell density, DMOS RDS(ON)= 0.67 @VGS=-2.5V trench technology. This high density process is especially tailored to RDS(ON)= 0.95 @VGS=-1.8V minimize on-state resist

 0.210. Size:1387K  cn hmsemi
 hm2301bsr.pdf 

HM2301BSR P-Channel 20V (D-S) MOSFET GENERAL DESCRIPTION FEATURES The HM2301BSR is the P-Channel logic enhancement mode power RDS(ON)= 0.48 @VGS=-4.5V field effect transistors are produced using high cell density, DMOS RDS(ON)= 0.67 @VGS=-2.5V trench technology. This high density process is especially tailored to RDS(ON)= 0.95 @VGS=-1.8V minimize on-state resist

 0.211. Size:803K  cn hmsemi
 hm2301b.pdf 

HM2301B P-Channel Enhancement Mode Power MOSFET Description D The HM2301B uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM applications. S General Features Schematic diagram VDS = -20V,ID = -2.5A RDS(ON)

 0.212. Size:727K  cn hmsemi
 hm2301e.pdf 

HM2301E P-Channel Trench Power MOSFET General Description The HM2301E uses advanced trench technology to provide excellent R , low gate charge and operation with gate DS(ON) voltages as low as -2.5V. This device is suitable for use as a battery protection or in other switching application. Features Schematic Diagram VDS = -12V,ID =-2.0A R

 0.213. Size:273K  cn hmsemi
 hm2301bjr.pdf 

HM2301BJR P-Channel MOSFET Description The MOSFET provide the best combination of fast switching, D 3 low on-resistance and cost-effectiveness. MOSFET Product Summary V (V) R ( ) I (mA) DS DS(on) D 0.45@ V =-4.5V GS G 1 -20 0.62@ VGS=-2.5V -800 0.86@ V =-1.8V GS S 2 Absolute maximum rating@25 Parameter Symbol Value Units Drain-Source Voltage

 0.214. Size:608K  cn hmsemi
 hm2301dr.pdf 

H P-Channel 20V (D-S) MOSFET GENERAL DESCRIPTION FEATURES The is the P-Channel logic enhancement mode power RDS(ON)= 0.48 @VGS=-4.5V field effect transistors are produced using high cell density, DMOS RDS(ON)= 0.67 @VGS=-2.5V trench technology. This high density process is especially tailored to RDS(ON)= 0.95 @VGS=-1.8V minimize on-state resistan

 0.215. Size:704K  cn hmsemi
 hm2301d.pdf 

H P-Channel 20V (D-S) MOSFET GENERAL DESCRIPTION FEATURES The is the P-Channel logic enhancement mode power RDS(ON)= 0.48 @VGS=-4.5V field effect transistors are produced using high cell density, DMOS RDS(ON)= 0.67 @VGS=-2.5V trench technology. This high density process is especially tailored to RDS(ON)= 0.95 @VGS=-1.8V minimize on-state resistance

 0.216. Size:1451K  cn hmsemi
 hm2301kr.pdf 

HM2301KR P-Channel Enhancement Mode Power MOSFET DESCRIPTION D The HM2301KR uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram VDS = -20V,ID = -3A RDS(ON)

 0.217. Size:977K  cn hmsemi
 hm2301f.pdf 

HM2301F P-Channel Enhancement Mode Power MOSFET Description D The HM2301F uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 1.8V. This device is suitable for use as a load switch or in PWM applications. S General Features Schematic diagram VDS = -20V,ID = -2.8A RDS(ON)

 0.218. Size:235K  cn haohai electr
 hpm2301.pdf 

HPM2301 P-Channel MOSFETs -2.8A,-20V P P HPM2301 P-Channel Enhancement-Mode MOS FETs P-Channel Enhancement Features Mode MOS FETs -20V, -2.8A, RDS(ON)=100m @ VGS=-10V High dense cell design for extremely low RDS(ON) Rugged and reliable Lea

 0.219. Size:491K  cn haohai electr
 h2301.pdf 

HAOHAI ELECTRONICS H2301 - 2A, -20V, P-Channel MOSFET APPLICATIONS Load switch for portable Features DC/DC converter RDS(ON) 120m @ VGS=-4.5V FEATURE RDS(ON) 170m @ VGS=-2.5V High Density Cell Design For Ultra Industry-standard pinout SOT-23 Package Low On-Resistance Compatible with Existing Surface MountTechniques

 0.220. Size:474K  pn silicon
 pm2301.pdf 

PM2301 20V P-Channel MOSFET Description Applications The PM2301 uses advanced Trench technology and designs to provide excellent R with low gate charge. PA Switch DS(ON) This device is suitable for use in PWM, load switching and Load Switch general purpose applications. Marking Information Features TrenchFET Power MOSFET 2301 Dimensions and Pin Configurati

 0.221. Size:1483K  cn apm
 ap2301bi.pdf 

AP2301BI -20V P-Channel Enhancement Mode MOSFET Description The AP2301BI uses advanced trench technology to provide excellent R , low gate charge and DS(ON) operation with gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. General Features V = -20V I =-2.3A DS D R

 0.222. Size:1798K  cn apm
 ap2301ai.pdf 

AP2301AI -20V P-Channel Enhancement Mode MOSFET Description The AP2301AI uses advanced trench technology to provide excellent R , low gate charge and DS(ON) operation with gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. General Features V = -20V I =-3.3A DS D R