GOFORD3400DESCRIPTION The 3400 uses advanced trench technology to provide Dexcellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a GBattery protection or in other Switching application. GENERAL FEATURES SSchematic diagram VDSS RDS(ON) RDS(ON) RDS(ON) ID @4.5V (Typ) @ 2.5V (Typ) @ 10V (Typ)mm

3400 N-Channel Enhancement Mode Field Effect Transistor V(BR)DSS RDS(ON)MAX ID SOT-23 35m@10V SOT-23 Plastic-Encapsulate MOSFET 30V 40m@4.5V 5.8A 52m@2.5V Features SOT-23 High dense cell design for extremely low RDS(on). Exceptional on-resistance and maximum DC current capability. Load/Power Switching. Interfacing Swi

March 2015FCD3400N80Z / FCU3400N80ZN-Channel SuperFET II MOSFET800 V, 2 A, 3.4 Features Description RDS(on) = 2.75 (Typ.) SuperFET II MOSFET is Fairchild Semiconductors brand-newhigh voltage super-junction (SJ) MOSFET family that is utilizing Ultra Low Gate Charge (Typ. Qg = 7.4 nC)charge balance technology for outstanding low on-resistance Low Eoss (Typ.

DMC3400SDW COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET Product Summary Features and Benefits Low On-Resistance ID max Device V(BR)DSS RDS(ON) max Low Input Capacitance TA = +25C Fast Switching Speed 0.4 @ VGS = 10V 0.65A ESD Protected Gate Q1 30 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) 0.7 @ VGS = 4.5V 0.52A Halogen an

SIL3400AFeatures High Density Cell Design For Low RDS(ON) Exceptional On-Resistance and Maximum DC Current Capability Epoxy Meets UL 94 V-0 Flammability Rating Moisture Sensitivity Level 1N-CHANNEL Halogen Free Available Upon Request By Adding Suffix "-HF" Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHSMOSFETCompliant. See Ordering Information)

M C CRMicro Commercial Components Micro Commercial Components20736 Marilla Street ChatsworthCA 91311SI3400APhone: (818) 701-4933Fax: (818) 701-4939Features Halogen free available upon request by adding suffix "-HF"N-Channel Epoxy meets UL 94 V-0 flammability rating Moisture Sensitivity Level 1Enhancement Mode High dense cell design for extremely low

Is Now Part ofTo learn more about ON Semiconductor, please visit our website at www.onsemi.comPlease note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductors system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclatur

UNISONIC TECHNOLOGIES CO., LTD UT3400 Power MOSFET 5.8A, 30V N-CHANNEL ENHANCEMENT MODE POWER 3MOSFET 21SOT-23(EIAJ SC-59) DESCRIPTION The UTC UT3400 is an N-ch enhancement MOSFET providing 3the customers with perfect RDS(ON) and low gate charge. This device can be operated with 2.5V low gate voltage. 2The UTC UT3400 is optimized for applications, such as a lo

UNISONIC TECHNOLOGIES CO., LTD UT3400 Power MOSFET N-CHANNEL ENHANCEMENT MODE POWER MOSFET DESCRIPTION The UTC UT3400 is an N-ch enhancement MOSFET providing the customers with perfect RDS(ON) and low gate charge. This device can be operated with 2.5V low gate voltage. The UTC UT3400 is optimized for applications, such as a load switch or in PWM. FEATURES * VDS (V)=30V

SMG34005.8A, 30V,RDS(ON) 28mElektronische Bauelemente N-Channel Enhancement Mode Power Mos.FETRoHS Compliant ProductSC-59ADim Min MaxDescription LA 2.70 3.10The SMG3400 uses advanced trench technology to provide*3B 1.40 1.60SBTop Viewexcellent on-resistance extremely efficient and 2 1C 1.00 1.30cost-effectiveness device.D 0.35 0.50The SMG3400 is uni

TSM3400 30V N-Channel MOSFET PRODUCT SUMMARY SOT-23 Pin Definition: VDS (V) RDS(on)(m) ID (A) 1. Gate 2. Source 28 @ VGS = 10V 5.8 3. Drain 30 33 @ VGS = 4.5V 5.0 52 @ VGS = 2.5V 4.0 Features Block Diagram Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Application Load Switch PA Switch Ordering Infor

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-23 Plastic-Encapsulate MOSFETS CJ3400A N-Channel Enhancement Mode Field Effect Transistor SOT-23 ID V(BR)DSS RDS(on)MAX 32m@10V30V 38m@4.5V5.8A1. GATE 45m@2.5V2. SOURCE 3. DRAIN FEATURE APPLICATION High dense cell design for extremely low RDS(ON) Load/Power Switching Exceptional on-resistanc

MOSFETComchipS M D D i o d e S p e c i a l i s tCJ3400-HF (N-Channel )Reverse Voltage: 30 VoltsForward Current: 5.8 ARoHS DeviceHalogen Free SOT-23Features0.118(3.00)0.110(2.80) - N-Channel Enhancement mode field effect transistor. 3 - High dense cell design for extermely low RDS(ON)0.055(1.40)0.047(1.20) - Exceptional on-resistance and maximum DC current capab

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-23 Plastic-Encapsulate MOSFETS CJ3400 N-Channel Enhancement Mode Field Effect Transistor SOT-23 FEATURE 1. GATE High dense cell design for extremely low RDS(ON) 2. SOURCE Exceptional on-resistance and maximum DC current capability 3. DRAIN MARKING: R0 Maximum ratings ( Ta=25 unless otherwise noted) Parameter

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-23-3L Plastic-Encapsulate MOSFETS CJK3400A N-Channel Enhancement Mode Field Effect Transistor ID V(BR)DSS RDS(on)MAX SOT-23-3L 32m@10V30V 38m@4.5V5.8A45m@2.5V1. GATE 2. SOURCE 3. DRAIN DFEATURE APPLICATION High dense cell design for extremely low RDS(ON) Load/Power Switching Exceptional on-r

JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD SOT-23-3L Plastic-Encapsulate MOSFETS CJK3400AH N-Channel Enhancement Mode Field Effect TransistorID V(BR)DSS RDS(on)MAX SOT-23-3L 27m@10V30V 32m@4.5V5.8A48m@2.5V1. GATE 2. SOURCE 3. DRAIN DFEATURE APPLICATION High dense cell design for extremely low RDS(ON) Load/Power Switching Exceptional on-resist

SEMICONDUCTOR KTC3400TECHNICAL DATA EPITAXIAL PLANAR NPN TRANSISTORDIFFERENTIAL AMP. APPLICATION.B CFEATURES Matched Pairs for Differential Amplifiers. High Breakdown Voltage : VCEO=120V(Min.). Low Noise : NF=1dB(Typ.), 10dB(Max.).N DIM MILLIMETERS Complementary to KTA2400.A 4.70 MAXEKB 4.80 MAXGC 3.70 MAXDD 0.45E 1.00F 1.27G 0.85MAXIMUM RATING (Ta=25 )

AO340030V N-Channel Enhancement Mode MOSFETVDS= 30V RDS(ON), Vgs@10V, Ids@5.8A

AO3400N-Channel 30V(D-S) MOSFETDESCRIPTION The 3400 uses advanced trench technology to provide Dexcellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a GBattery protection or in other Switching application. SGENERAL FEATURES Schematic diagram VDSS RDS(ON) RDS(ON) RDS(ON) ID @4.5V (Typ) @ 2.5V (Typ) @ 1

FM120-MWILLASTHRUSE3400FM1200-M1.0A SURFACE MOUNT SCHOTTKYSOT-23 Plastic-Encapsulate MOSFETS BARRIER RECTIFIERS -20V- 200VSOD-123 PACKAGE Pb Free ProduPackage outlineFeatures Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.SOD-123H Low profile surface mounted application in order to optimize bo

AO3400A30V N-Channel MOSFETGeneral Description Product SummaryVDS30VThe AO3400A combines advanced trench MOSFETtechnology with a low resistance package to provide ID (at VGS=10V) 5.7Aextremely low RDS(ON). This device is suitable for use as a RDS(ON) (at VGS=10V)

AO3400C30V N-Channel MOSFETGeneral Description Product SummaryVDS Trench Power MOSFET technology 30V Low RDS(ON) ID (at VGS=4.5V) 6.2A Low Gate Charge RDS(ON) (at VGS=10V)

AO340030V N-Channel MOSFETGeneral Description Product SummaryVDS30VThe AO3400 combines advanced trench MOSFETtechnology with a low resistance package to provide ID (at VGS=10V) 5.8Aextremely low RDS(ON). This device is suitable for use as a RDS(ON) (at VGS=10V)

Analog Power AM3400NN-Channel 200-V (D-S) MOSFETPRODUCT SUMMARYKey Features: rDS(on) (m)VDS (V) ID (A) Low r trench technology DS(on)950 @ VGS = 10V1.2 Low thermal impedance 2001100 @ VGS = 5.5V1.1 Fast switching speed Typical Applications: White LED boost converters TSOP-6 Automotive Systems Industrial DC/DC Conversion Circuits ABSOL

AFN3400 Alfa-MOS 30V N-Channel Technology Enhancement Mode MOSFET General Description Features AFN3400, N-Channel enhancement mode 30V/4.0A,RDS(ON)=48m@VGS=10V MOSFET, uses Advanced Trench Technology 30V/3.5A,RDS(ON)=52m@VGS=4.5V to provide excellent RDS(ON), low gate charge. 30V/2.8A,RDS(ON)=58m@VGS=2.5V These devices are particularly suited for low Super

AFN3400S Alfa-MOS 30V N-Channel Technology Enhancement Mode MOSFET General Description Features AFN3400S, N-Channel enhancement mode 30V/4.0A,RDS(ON)=42m@VGS=10V MOSFET, uses Advanced Trench Technology 30V/3.0A,RDS(ON)=44m@VGS=4.5V to provide excellent RDS(ON), low gate charge. 30V/2.6A,RDS(ON)=50m@VGS=2.5V These devices are particularly suited for low Sup

AFN3400AS Alfa-MOS 30V N-Channel Technology Enhancement Mode MOSFET General Description Features AFN3400AS, N-Channel enhancement mode 30V/2.8A,RDS(ON)=46m@VGS=10V MOSFET, uses Advanced Trench Technology 30V/2.5A,RDS(ON)=50m@VGS=4.5V to provide excellent RDS(ON), low gate charge. 30V/2.2A,RDS(ON)=58m@VGS=2.5V These devices are particularly suited for low 3

AFN3400A Alfa-MOS 30V N-Channel Technology Enhancement Mode MOSFET General Description Features AFN3400A, N-Channel enhancement mode 30V/2.4A,RDS(ON)=54m@VGS=10V MOSFET, uses Advanced Trench Technology 30V/1.8A,RDS(ON)=58m@VGS=4.5V to provide excellent RDS(ON), low gate charge. 30V/1.5A,RDS(ON)=65m@VGS=2.5V These devices are particularly suited for low 30V

Shenzhen Tuofeng Semiconductor Technology Co., Ltd AO3400AO3400N-Channel Enhancement Mode Field Effect TransistorGeneral Description FeaturesThe AO3400 uses advanced trench technology to VDS (V) = 30Vprovide excellent RDS(ON), low gate charge and ID = 4.8 A (VGS = 10V)operation with gate voltages as low as 2.5V. This RDS(ON)

Spec. No. : C414N3 Issued Date : 2007.07.05 CYStech Electronics Corp.Revised Date : 2017.05.03 Page No. : 1/ 9 30V N-CHANNEL Enhancement Mode MOSFET BVDSS 30VMTN3400N3 ID@VGS=10V, TA=25C 5.8A 20m VGS=10V, ID=5.8A22m RDSON(TYP) VGS=4.5V, ID=5A 27m VGS=2.5V, ID=4A Features Low on-resistance Low gate charge Excellent thermal and electrical

3400HGOFORDDescription DThe 3400H uses advanced trench technology to provide excellent RDS(ON) and low gate charge.This device is suitable Gfor use as a load switch and PWM applications. SGenera Features Schematic diagram VDSS RDS(ON) RDS(ON) RDS(ON) ID @ (Typ) @10V 4.5V (Typ) @ 2.5V (Typ)m27 m m 40 5.830V 30 A High Power and current handing cap

GOFORD3400LDESCRIPTION The 3400L uses advanced trench technology to provide Dexcellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a GBattery protection or in other Switching application. SGENERAL FEATURES Schematic diagram VDSS RDS(ON) RDS(ON) RDS(ON) ID @4.5V (Typ) @2.5V (Typ) (Typ)10V 3400L 3

S TS 3400S amHop Microelectronics C orp.S ep.21 2004N-Channel E nhancement Mode Field E ffect TransistorPR ODUC T S UMMAR Y F E ATUR E SS uper high dense cell design for low R DS (ON).VDS S ID R DS (ON) ( m ) MaxR ugged and reliable.50 @ VG S = 10V30V 3.5AS OT-23 package.70 @ VG S =4.5VDS OT-23GSAB S OLUTE MAXIMUM R ATINGS (TA=25 C unless otherwise noted)Li

BRCS3400MC Rev. F Dec.-2019 DATA SHEET / Descriptions SOT23-3 N MOS N- CHANNEL MOSFET in a SOT23-3 Plastic Package. / Features VDS (V) = 30V ID = 5.8 A (VGS = 10V) RDS(ON)

AO3400 Rev.B Oct.-2017 DATA SHEET / Descriptions SOT23-3 N MOS N- CHANNEL MOSFET in a SOT23-3 Plastic Package. / Features VDS (V) = 30V ID = 5.8 A (VGS = 10V) RDS(ON)

SEMICONDUCTORFTK3400TECHNICAL DATAN-Channel Enhancement Mode Field Effect Transistor DFEATURE GHigh dense cell design for extremely low R SDS(ON)Schematic diagram Exceptional on-resistance and maximum DC current capability D3R0G 1 2 SMarking and pin AssignmentSOT-23 top view Maximum ratings ( Ta=25 unless otherwise noted) Parameter Symbol Value Unit

SMD Type ICSMD Type MOSFETN-Channel Enhancement ModeField Effect TransistorKO3400(AO3400)SOT-23Unit: mm+0.1Features 2.9-0.1+0.10.4-0.1VDS (V) = 30V3ID =5.8 A(VGS =10V)RDS(ON) 28m (VGS = 10V)12RDS(ON) 33m (VGS =4.5V)+0.1+0.050.95-0.1 0.1-0.01+0.11.9-0.1RDS(ON) 52m (VGS =2.5V)1.Base1. Gate2.Emitter2. Source3. Drain3.collectorAbsolute Maxim

SMD Type MOSFETN-Channel MOSFETAO3400A (KO3400A)SOT-23Unit: mm+0.12.9 -0.10.4+0.1-0.13 Features VDS (V) = 30V ID = 5.7 A (VGS = 10V)1 2 RDS(ON) 26.5m (VGS = 10V)+0.1+0.050.95 -0.1 0.1 -0.01+0.11.9 -0.1 RDS(ON) 32m (VGS = 4.5V) RDS(ON) 48m (VGS = 2.5V)1. Gate2. Source3. DrainDDG GSS Absolute

SMD Type ICSMD Type MOSFETN-Channel Enhancement MOSFETAO3400 (KO3400)SOT-23-3Unit: mm+0.22.9 -0.1Features+0.10.4-0.13VDS (V) = 30VID = 5.8 A (VGS = 10V)RDS(ON) 28m (VGS = 10V)1 2RDS(ON) 33m (VGS = 4.5V)+0.02+0.10.15 -0.020.95 -0.1RDS(ON) 52m (VGS = 2.5V) D+0.11.9 -0.21. Gate2. SourceGS 3. DrainAbsolute Maximum Ratings Ta = 25Parameter Sy

SMD Type ICSMD Type MOSFETN-Channel MOSFETKO3400SOT-89Unit:mmFeatures1.70 0.1VDS (V) = 30VID = 5.8 A (VGS = 10V)RDS(ON) 28m (VGS = 10V)RDS(ON) 33m (VGS = 4.5V)RDS(ON) 52m (VGS = 2.5V)0.42 0.10.46 0.11.Gate2.Drain3.SourceDGSAbsolute Maximum Ratings Ta = 25Parameter Symbol Rating UnitDrain-Source Voltage VDS 30 VGate-Source Voltage VGS 12 VContinu

SMD Type MOSFETN-Channel MOSFETAO3400A (KO3400A)SOT-23-3Unit: mm+0.22.9 -0.1+0.10.4-0.13 Features VDS (V) = 30V ID = 5.7 A (VGS = 10V) RDS(ON) 26.5m (VGS = 10V) 1 2+0.02+0.10.15 -0.020.95 -0.1 RDS(ON) 32m (VGS = 4.5V)+0.11.9 -0.2 RDS(ON) 48m (VGS = 2.5V)1. Gate2. SourceDD3. DrainG GSS Absol

SMD Type ICSMD Type MOSFETN-Channel Enhancement ModeField Effect TransistorAO3400 (KO3400)SOT-23Unit: mm+0.1Features 2.9 -0.1+0.10.4 -0.1VDS (V) = 30V3ID = 5.8 A (VGS = 10V)RDS(ON) 28m (VGS = 10V)1 2RDS(ON) 33m (VGS = 4.5V)+0.1+0.050.95 -0.1 0.1 -0.01+0.11.9 -0.1RDS(ON) 52m (VGS = 2.5V)1.Base1. Gate2.Emitter2. Source3. Drain3.collectorAb

PPJA3400 30V N-Channel Enhancement Mode MOSFET SOT-23 Unit: inch(mm)30 V 4.9A Voltage Current Features RDS(ON) , VGS@10V, ID@4.9A

AiT Semiconductor Inc. AM3400 www.ait-ic.com MOSFET 30V N-CHANNEL ENHANCEMENT MODE DESCRIPTION FEATURES The AM3400 is the N-Channel logic enhancement 30V/5.8A, R =28m(typ.)@V =10V DS(ON) GSmode power field effect transistor is produced using 30V/5.0A, R =30m(typ.)@V =4.5V DS(ON) GShigh cell density. Advanced trench technology to 30V/3.5A, R =40m(typ.)@V =2.

AiT Semiconductor Inc. AM3400A www.ait-ic.com MOSFET 30V N-CHANNEL ENHANCEMENT MODE DESCRIPTION FEATURES The AM3400A is the N-Channel logic enhancement 30V/5.8A, R =22m(typ.)@V =10V DS(ON) GSmode power field effect transistor is produced using 30V/5.0A, R =25m(typ.)@V =4.5V DS(ON) GShigh cell density. Advanced trench technology to 30V/3.5A, R =31m(typ.)@V =

Pb Free Product BLM3400 N-Channel Enhancement Mode Power MOSFET DESCRIPTION The BLM3400 uses advanced trench technology to provide Dexcellent R , low gate charge and operation with gate DS(ON)voltages as low as 2.5V. This device is suitable for use as a GBattery protection or in other Switching application. SGENERAL FEATURES V = 30V,I = 5.8A Schematic diagram DS

Single N-channel MOSFETELM13400CA-SGeneral description Features ELM13400CA-S uses advanced trench technology to Vds=30Vprovide excellent Rds(on), low gate charge and low gate Id=5.8A (Vgs=10V)resistance. Rds(on)

Single N-channel MOSFETELM53400CA-SGeneral description Features ELM53400CA-S uses advanced trench technology to Vds=20Vprovide excellent Rds(on), low gate charge and low gate Id=1.8A (Vgs=4.5V)resistance. Rds(on)

Single N-channel MOSFETELM33400CA-SGeneral description Features ELM33400CA-S uses advanced trench technology to Vds=30Vprovide excellent Rds(on), low gate charge and low gate Id=6A resistance. Rds(on)

GSM3400 GSM3400 30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3400, N-Channel enhancement mode 30V/4.0A,RDS(ON)=48m@VGS=10V MOSFET, uses Advanced Trench 30V/3.5A,RDS(ON)=52m@VGS=4.5V Technology to provide excellent RDS(ON), low 30V/2.8A,RDS(ON)=58m@VGS=2.5V gate charge. These devices are particularly Super high density cell des

GSM3400A 30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3400A, N-Channel enhancement mode 30V/2.4A,RDS(ON)=54m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/1.8A,RDS(ON)=58m@VGS=4.5V provide excellent RDS(ON), low gate charge. 30V/1.5A,RDS(ON)=65m@VGS=2.5V Super high density cell design for These devices are particularly suited for lo

30V N-Channel Enhancement Mode MOSFET Product Description Features GSM3400AS, N-Channel enhancement mode 30V/2.8A,RDS(ON)=50m@VGS=10V MOSFET, uses Advanced Trench Technology to 30V/2.5A,RDS(ON)=55m@VGS=4.5V provide excellent RDS(ON), low gate charge. 30V/2.2A,RDS(ON)=75m@VGS=2.5V These devices are particularly suited for low Super high density cell design for

GSM3400S GSM3400S 30V N-Channel Enhancement Mode MOSFET Product Description Features 30V/4.0A,RDS(ON)=42m@VGS=10V GSM3400S, N-Channel enhancement mode 30V/3.0A,RDS(ON)=44m@VGS=4.5V MOSFET, uses Advanced Trench Technology 30V/2.6A,RDS(ON)=50m@VGS=2.5V to provide excellent RDS(ON), low gate charge. Super high density cell design for extremely low RDS (ON) The

4.8A30V3400N-CHANNELMOSFETKIAKIAKIASEMICONDUCTORSSEMICONDUCTORSSEMICONDUCTORS1.DescriptionThe KIA3400 uses advanced trench technology to provide excellent R ,lowgate chargeDS(on)and operation with gate voltages as lowas 2.5V.This device is suitable for use as a load switch or in PWMapplications.Standard Product KIA3400 is Pb-free(meets ROHS & Sony 259 specifications

MMN3400Package Level Data SheetM-MOS Semiconductor Hong Kong Limited30V N-Channel Enhancement-Mode MOSFETVDS= 30VRDS(ON), Vgs@10V, Ids@5.8A = 41mRDS(ON), Vgs@4.5V, Ids@5.0A = 45mRDS(ON), Vgs@2.5V, Ids@4.0A = 59mFeaturesAdvanced trench process technologyHigh Density Cell Design For Ultra Low On-ResistanceSOT-23 Internal Schematic DiagramDrain Gate Source To

Pb Free Producthttp://www.ncepower.com NCE3400NCE N-Channel Enhancement Mode Power MOSFET Description DThe NCE3400 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate Gvoltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. SGeneral Features Schematic diagram

http://www.ncepower.com NCE3400XNCE N-Channel Enhancement Mode Power MOSFET Description DThe NCE3400X uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate Gvoltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. SGeneral Features Schematic diagram VDS = 30V,

http://www.ncepower.com NCE3400AYNCE N-Channel Enhancement Mode Power MOSFET Description DThe NCE3400AY uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate Gvoltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. SGeneral Features Schematic diagram VDS = 30

STN3400A 30V N-Channel Enhancement Mode MOSFETDESCRIPTIONFEATUREThe STN3400A is the N-Channel logic 30V/5.6A, RDS(ON) =28m(typ.)@VGS =10V enhancement mode power field effect transistor is 30V/5.0A, RDS(ON) =30m(typ.)@VGS =4.5V produced using high cell density. advanced trench 30V/3.2A, RDS(ON) =35m(typ.)@VGS =2.5V technology to provide excellent RDS

STN3400 30V N-Channel Enhancement Mode MOSFETDESCRIPTIONFEATUREThe STN3400 is the N-Channel logic enhancement 30V/5.8A, RDS(ON) =24m(typ.)@VGS =10V mode power field effect transistor is produced using 30V/5.0A, RDS(ON) =26m(typ.)@VGS =4.5V high cell density. advanced trench technology to 30V/3.5A, RDS(ON) =30m(typ.)@VGS =2.5V provide excellent RDS(

SMC3400 30V N-Channel Enhancement Mode MOSFETDESCRIPTIONFEATUREThe SMC3400 is the N-Channel logic enhancement 30V/5A, RDS(ON) =25m(typ.)@VGS =10V mode power field effect transistor is produced using 30V/4A, RDS(ON) =28m(typ.)@VGS =4.5V high cell density. advanced trench technology to 30V/3A, RDS(ON) =37m(typ.)@VGS =2.5V provide excellent RDS(ON).lo

SL3400N-Channel Power MOSFET DGeneral Features VDS = 30V,ID = 5.8A GRDS(ON)

ST3400S23RG N Channel Enhancement Mode MOSFET 5.8A DESCRIPTION The ST3400S23RG is the N-Channel logic enhancement mode power field effect transistor is produced using high cell density, DMOS trench technology. This high-density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage application such as cellular phon

ST3400SRG N Channel Enhancement Mode MOSFET 5.8A DESCRIPTION The ST3400SRG is the N-Channel logic enhancement mode power field effect transistor is produced using high cell density, DMOS trench technology. This high-density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage application such as cellular phone and

RUMWUMW AO3400AUMW AO3400AN-Channel Enhancement ModeFeaturesSOT23 VDS (V) = 30VID = 5.8 A (VGS = 10V)RDS(ON) 28m (VGS = 10V)RDS(ON) 33m (VGS = 4.5V)RDS(ON) 52m (VGS = 2.5V)1. GATE 2. SOURCE 3. DRAIN Absolute Maximum Ratings Ta = 25Parameter Symbol Rating UnitDrain-Source Voltage VDS 30 VGate-Source Voltage VGS 12 VContinuous Drain Current TA=25 5.8ID

ATM3400ANSAN-Channel Enhancement Mode Field Effect TransistorDrain-Source Voltage: 30V Drain Current: 5.8AFEATURESSOT-23 Trench FET Power MOSFET R

AIIP ERAP3400S DATA SHEET N-Channel pwer MOSFETI Descriptions N MOS N- CHA NNEL MOSFET in a SOT23 Plastic Package. SOT23 oI Features V s(V) = 30V oA lo = 5.8 (VGs = 10V) s 2Ro coN)

AS3400 N-Channel Enhancement Mode MOSFETProduct Summary V(BR)DSS RDS(on)MAX ID 27m@10V 30V 33m@4.5V 5.6A 51m@2.5V Feature Application Advanced trench process technology Load Switch for Portable Devices High density cell design for ultra low on-resistance DC/DC Converter Package Circuit diagram SOT-23 Marking 3400. Document ID Issued Date Revised Date Revisio

ASDM3400ZB30V N-Channel MOSFETGeneral FeaturesProduct Summary High Power and current handing capabilityVDS 30 V Lead free product is acquiredRDS(on),Typ.@ VGS=10 V 29 m Surface Mount PackageID 5.8AAvailable in SOT23-3 PackageApplications PWM applications Load switch Power managementSOT23-3 Top ViewN-channelAbsolute Maximum Ratings T

ASDM340030V N-CHANNEL MOSFETProduct SummaryFEATURES V = 30V, I =5ADS DRDS(ON) RDS(ON)IDVDS RDS(ON)R

AO3400AMOSFET ROHSN-Channel Enhancement-Mode MOSFET SOT-23-FeaturesAdvanced trench process technologyHigh Density Cell Design For Ultra Low On-ResistanceMAXIMUM RANTINGSCharacteristic Symbol Max UnitDrain-Source Voltage BV 30 VDSSGate- Source VoltageV +12 VGSDrain Current (continuous) 5.8 AIDDrain Current (pulsed) I 30 ADMTotal Device Dissipat

Eternal Semiconductor Inc. EV3400N-Channel Enhancement-Mode MOSFET (30V, 5.8A)PRODUCT SUMMARYVDSS ID RDS(on) (m) Typ. 25@ VGS = 10 V,ID=5.8A30V 5.8A 36@ VGS = 4.5 V,ID=5.0A 40@ VGS = 2.5V,ID=4.0AFeatures Super high dense cell trench design for low RDS(on) Rugged and reliable SOT-23-3L package LeadPb-free and halogen-freeEV3400 Pin Assignment & Symb

Plastic-Encapsulate MosfetsAO3400FEATURESN-Channel MOSFETThe AO3400 is the N-Channel logic enhancement mode powerfield effect transistor is produced using high cell density, DMOStrench technology.This high-density process is especially tailored to minimize on-stateresistance. These devices are particularly suited for low voltage applicationsuch as cellular phone and notebook c

AO3400A N-Ch 30V Fast Switching MOSFETs Description Product Summary The AO3400A is the high cell density trenched N-VDS 30 V ch MOSFETs, which provides excellent RDSON and efficiency for most of the small power switching RDS(ON),typ 27 m and load switch applications. ID 5.2 A The AO3400A meet the RoHS and Green Product requirement with full function reliability approve

HSS3400A Description Product Summary VDS 30 V The HSS3400A is the high cell density trenched N-ch MOSFETs, which provides excellent RDSON RDS(ON),max 26 m and efficiency for most of the small power switching and load switch applications. ID 5.5 A The HSS3400A meet the RoHS and Green Product requirement with full function reliability approved. l Green Device Available

SOT-23-3 Plastic-Encapsulate Transistors HX3400 MOSFET(N-Channel) FEATURES High Power and current handing capability Lead free product is acquired Surface Mout Package MARKING: XORBMAXIMUM RATINGS (TA=25 unless otherwise noted) Symbol Parameter Value UnitsVDS Drain-Source voltage 30 V VGS Gate-Source voltage 12 VID Drain current 5.8 A PD Power Dissipation 1.4 W

SOT-23-3 Plastic-Encapsulate TransistorsHX3400AMOSFET(N-Channel)FEATURESTrenchFET Power MOSFETLoad Switch for Portable DevicesDC/DC ConverterMARKING:A09TMAXIMUM RATINGS (TA=25 unless otherwise noted)Symbol Parameter Value UnitsVDS Drain-Source voltage 20 VVGS Gate-Source voltage 8 VID Drain current 3.6 APD Power Dissipation 1 WTj Junction Temperature 150 Ts

JST340030V,5.8AN-Channel MosfetFEATURESSOT-23RDS(ON) 33m @VGS=10VRDS(ON) 39m @VGS=4.5VRDS(ON) 60m @VGS=2.5VAPPLICATIONSLoad/Power SwitchingInterfacing SwitchingMARKING N-CHANNEL MOSFETMaximum ratings (Ta=25 unless otherwise noted)Parameter Symbol Value UnitDrain-Source Voltage VDS 30VGate-Source Voltage V 12GSI 5.8DContinuous Drain

JSM3400N-Channel 30-V(D-S) MOSFETV(BR)DSS RDS(on)MAX IDSOT-23 SOT-23-3L/0.028@ 10V31.GATE30V5.8A0.033@ 4.5V2.SOURCE3.DRAIN10.052@ 2.5V2General FEATUREEquivalent CircuitMARKINGTrenchFET Power MOSFETLead free product is acquiredSurface mount packageA01TF wAPPLICATION*wweek codeLoad Switch for Portable DevicesDC/DC Convert

Preliminary Datasheet LPM3400 N-Channel Enhancement Mode Field Effect Transistor General Description Features The LPM3400 uses advanced trench technology to 20V/5A, R 33m(max.)@VGS=4.5V DS(ON)provide excellent R , low gate charge and 20V/4A, R 52m(max.)@VGS=2.5V DS(ON) DS(ON)operation with gate voltages as low as 1.1V. This Super high density cell design for

LNSC3400Lonten N-channel 30V, 5.8A, 26m Power MOSFETDescription Product SummaryThese N-Channel enhancement mode power field V 30VDSSeffect transistors are using trench DMOS RDS(on).max@ V =10V 26mGStechnology. This advanced technology has been I 5.8ADespecially tailored to minimize on-state resistance,provide superior switching performance, and withstand high energy

LNSA3400Lonten N-channel 30V, 5.8A, 26m Power MOSFETDescription Product SummaryThese N-Channel enhancement mode power field V 30VDSSeffect transistors are using trench DMOS RDS(on).max@ V =10V 26mGStechnology. This advanced technology has been I 5.8ADespecially tailored to minimize on-state resistance,provide superior switching performance, and withstand high energy

www.msksemi.comAO3400MI-MSSemiconductor CompianceSOT-23FEATURE High dense cell design for extremely low RDS(ON) Exceptional on-resistance and maximum DC current capability1. GATE2. SOURCEAPPLICATION3. DRAIN Load/Power Switching Interfacing SwitchingEquivalent CircuitIV(BR)DSS RDS(on)MAX D35m@ 10V40m@4.5V30 V5.8A52m@2.5VMaximum ratin

SOT-23 Plastic-Encapsulate MOSFETSSI3400N-Channel 30-V(D-S) MOSFETSI3400V(BR)DSS RDS(on)MAX IDSOT-23 SOT-23-3L/0.028@ 10V31.GATE30V5.8A0.033@ 4.5V2.SOURCE3.DRAIN10.052@ 2.5V2General FEATUREEquivalent CircuitMARKINGTrenchFET Power MOSFETLead free product is acquiredSurface mount packageA01TF wAPPLICATION*wweek codeLoad Sw

DATA SHEET PS3400N N-CHANNEL HIGH DENSITY TRENCH MOSFET VOLTAGE 30 V CURRENT 5.8 A FEATURES LOW RDS(ON): (28m@VGS= 4.5V , ID= 5A, 38m@VGS= 2.5V, ID= 4.0A) RELIABLE AND RUGGED LEAD FREE AND HALOGEN-FREE 3MECHANICAL DATA 2 CASE: SOT-23-3L PLASTIC CASE TERMINALS: SOLDERABLE PER MIL-STD-202, METHOD208 1 CASESOT-23-3L ABSOLUTE MAXIMUM R

PJM3400NSAN- Enhancement Mode Field Effect TransistorSOT-23 Features VDS = 30V,ID = 5.8ARDS(ON)

PJM3400NSCN- Enhancement Mode Field Effect TransistorSOT-23-3 Features VDS = 30V,ID = 5.8ARDS(ON)

Leading Circuit ProtectionSR3400Products and Solutions30V N-Channel MOSFETProduct SummarySOT-23V R I(BR)DSS DS(on)MAX D35m@10V30V 40m@4.5V 5.8A52m@2.5VFeature TrenchFET Power MOSFETSchematic diagram Excellent RDS(on) and Low Gate ChargeApplication DC/DC Converter Load Switch for Portable Devices Battery SwitchMARKING:ABSOLUTE MAXIMUM

AO3400 30V N-Channel Enhancement Mode MOSFETVDS= 30V RDS(ON), Vgs@10V, Ids@5.8A

N-Channel Enhancement Mode MOSFET Feature SC-59 30V/5.8A, RDS(ON) = 35m(MAX) @VGS = 10V. 3 RDS(ON) =40m(MAX) @VGS = 4.5V. RDS(ON) =55m(MAX) @VGS = 2.5V. Super High dense cell design for extremely low RDS(ON) . 2 Reliable and Rugged. 1 SC-59 for Surface Mount Package. Applications 1Gate 2Source 3Drain Power Management Portable Equipment and

WTM3400N-Channel Enhancement Mode Power MOSFETDescription The WTM3400 uses advanced trench technology to provideexcellent R , low gate charge and operation with gateDS(ON)voltages as low as 2.5V. This device is suitable for use as abattery protection or in other switching application.Features V DS = 30V, lD = 5.8AR

SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTDSOT-23 Plastic-Encapsulate MOSFETS3400TFN-Channel 30-V(D-S) MOSFETTF3400V(BR)DSS RDS(on)MAX IDSOT-23 SOT-23-3L/0.028@ 10V31.GATE30V5.8A0.033@ 4.5V2.SOURCE3.DRAIN10.052@ 2.5V2General FEATUREEquivalent CircuitMARKINGTrenchFET Power MOSFETLead free product is acquiredSurface mount pack

AO3400AO3400AO3400AO3400SI2305SOT-23 Plastic-Encapsulate MOSFETS N-Channel Enhancement Mode Field Effect TransistorN-Channel Enhancement Mode Field Effect TransistorN-Channel Enhancement Mode Field Effect TransistorN-Channel Enhancement Mode Field Effect TransistorAO3400AO3400AO3400AO3400AO3400FEATURE High dense cell design for extremely low RDS(ON) Excepti

WST3400 N-Ch MOSFETGeneral Description Product SummeryThe WST3400 is the highest performance trench BVDSS RDSON ID N-Ch MOSFET with extreme high cell density , which provide excellent RDSON and gate charge 30V 18m 7Afor most of the small power switching and load switch applications. Applications The WST3400 meet the RoHS and Green Product requirement with full functio

WST3400S N-Ch MOSFETGeneral Description Product SummeryThe WST3400S is the highest performance BVDSS RDSON ID trench N-Ch MOSFET with extreme high cell density , which provide excellent RDSON and 30V 27m 5.6Agate charge for most of the small power switching and load switch applications. Applications The WST3400S meet the RoHS and Green Product requirement with full fu

WST3400A N-Ch MOSFETGeneral Description Product SummeryThe WST3400A is the highest performance BVDSS RDSON ID trench N-Ch MOSFET with extreme high cell density , which provide excellent RDSON and 30V 20m 6.4Agate charge for most of the small power switching and load switch applications. Applications The WST3400A meet the RoHS and Green Product requirement with full fu

SM3400N-Channel Enhancement Mode Field Effect TransistorP-Channel Enhancement-Mode MOSFETFeatures 1Advanced Trench Process Technology. 2High Density Cell Design for Ultra Low On-Resistance. 3Improved Shoot-Through FOM 4RoHS Compliant D SOT-23Top ViewGDSG S PRODUCT SUMMARY VDSS ID RDS(on) (m-ohm) Max 28@ VGS = 10V33 @ VGS = 4.5V 30V 5.8A

HM3400PRwww.VBsemi.twN-Channel 30-V (D-S) MOSFETFEATURESPRODUCT SUMMARY Halogen-freeVDS (V) RDS(on) ()ID (A)a Qg (Typ.) TrenchFET Power MOSFET0.022 at VGS = 4.5 V 6.8RoHS30 10 nC COMPLIANTAPPLICATIONS0.027 at VGS = 2.5 V 6.0 Load Switches for Portable DevicesDDGSG D SN-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise n

SPN3400S23RGwww.VBsemi.twN-Channel 30-V (D-S) MOSFETFEATURESPRODUCT SUMMARY Halogen-free According to IEC 61249-2-21VDS (V) RDS(on) ()ID (A)a Qg (Typ.)Definition0.030 at VGS = 10 V TrenchFET Power MOSFET6.530 4.5 nC 100 % Rg Tested0.033 at VGS = 4.5 V 6.0 Compliant to RoHS Directive 2002/95/ECAPPLICATIONS DC/DC ConverterDTO-236(SOT-23

KD3400SRGwww.VBsemi.twN-Channel 30-V (D-S) MOSFETFEATURESPRODUCT SUMMARY Halogen-free According to IEC 61249-2-21VDS (V) RDS(on) ()ID (A)a Qg (Typ.)Definition0.030 at VGS = 10 V TrenchFET Power MOSFET6.530 4.5 nC 100 % Rg Tested0.033 at VGS = 4.5 V 6.0 Compliant to RoHS Directive 2002/95/ECAPPLICATIONS DC/DC ConverterDTO-236(SOT-23)

CJ3400www.VBsemi.twN-Channel 30-V (D-S) MOSFETFEATURESPRODUCT SUMMARY Halogen-free According to IEC 61249-2-21VDS (V) RDS(on) ()ID (A)a Qg (Typ.)Definition0.030 at VGS = 10 V TrenchFET Power MOSFET6.530 4.5 nC 100 % Rg Tested0.033 at VGS = 4.5 V 6.0 Compliant to RoHS Directive 2002/95/ECAPPLICATIONS DC/DC ConverterDTO-236(SOT-23)G 1

NCE3400Awww.VBsemi.twN-Channel 30-V (D-S) MOSFETFEATURESPRODUCT SUMMARY Halogen-free According to IEC 61249-2-21VDS (V) RDS(on) ()ID (A)a Qg (Typ.)Definition0.030 at VGS = 10 V TrenchFET Power MOSFET6.530 4.5 nC 100 % Rg Tested0.033 at VGS = 4.5 V 6.0 Compliant to RoHS Directive 2002/95/ECAPPLICATIONS DC/DC ConverterDTO-236(SOT-23)G

AO3400www.VBsemi.twN-Channel 30-V (D-S) MOSFETFEATURESPRODUCT SUMMARY Halogen-free According to IEC 61249-2-21VDS (V) RDS(on) ()ID (A)a Qg (Typ.)Definition0.030 at VGS = 10 V TrenchFET Power MOSFET6.530 4.5 nC 100 % Rg Tested0.033 at VGS = 4.5 V 6.0 Compliant to RoHS Directive 2002/95/ECAPPLICATIONS DC/DC ConverterDTO-236(SOT-23)G 1

RoHS COMPLIANT YJL3400A N-Channel Enhancement Mode Field Effect Transistor Product Summary V 30V DS I 5.6A D R ( at V =10V) 27 mohm DS(ON) GS R ( at V =4.5V) 33 mohm DS(ON) GS R ( at V =2.5V) 51 mohm DS(ON) GSGeneral Description Trench Power LV MOSFET technology High density cell design for low R DS(ON) High Speed switch

RoHS COMPLIANT YJQ3400A N-Channel Enhancement Mode Field Effect Transistor Product Summary V 30V DS I 7.7A D R ( at V =10V) 23mohm DS(ON) GS R ( at V =4.5V) 29mohm DS(ON) GS R ( at V =2.5V) 43mohm DS(ON) GS 100% V Tested DSGeneral Description Trench Power LV MOSFET technology High density cell design for low R DS(ON

HM3400N-Channel Enhancement Mode Power MOSFET DESCRIPTION The HM3400 uses advanced trench technology to provide Dexcellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a GBattery protection or in other Switching application. SGENERAL FEATURES VDS = 30V,ID = 5.8A Schematic diagram RDS(ON)

N-Channel Enhancement Mode Power MOSFET DDescription The uses advanced trench technology to provide Gexcellent RDS(ON) and low gate charge .This device is suitable for use as a load switch or in PWM applications. SGeneral Features Schematic diagram VDS = 30V,ID = 3.6A RDS(ON)

HM3400DRN-Channel Enhancement Mode Power MOSFET DESCRIPTION The HM3400DR uses advanced trench technology to provide Dexcellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a GBattery protection or in other Switching application. SGENERAL FEATURES VDS = 30V,ID = 8 A Schematic diagram RDS(ON)

HM3400DN-Channel Enhancement Mode Power MOSFET DESCRIPTION The HM3400D uses advanced trench technology to provide Dexcellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a GBattery protection or in other Switching application. SGENERAL FEATURES VDS = 30V,ID = 5.0A Schematic diagram RDS(ON)

3400 N-Channel Enhancement Mode Power MOSFET DESCRIPTION The 3400 uses advanced trench technology to provide Dexcellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a GBattery protection or in other Switching application. SGENERAL FEATURES VDS = 30V,ID = 5.8A Schematic diagram RDS(ON)

PM3400 30V N-Channel MOSFET Description Applications The PM3400 uses advanced Trench technology and DC/DC Converter designs to provide excellent R with low gate charge. Load Switch for Portable Devices DS(ON)This device is suitable for use in PWM, load switching Battery Switch and general purpose applications. Marking Information Features Trench Power MOSFET