Advanced Power MOSFETFEATURESBVDSS = 100 V Avalanche Rugged TechnologyRDS(on) = 0.2 Rugged Gate Oxide Technology Lower Input CapacitanceID = 7.2 A Improved Gate Charge Extended Safe Operating Area 175 Operating Temperature Lower Leakage Current : 10 A (Max.) @ VDS = 100V Lower RDS(ON) : 0.155 (Typ.)1231.Gate 2. Drain 3. SourceAbsolute Maximu

PD - 97002AIRFB52N15DPbFIRFS52N15DPbFIRFSL52N15DPbFApplicationsHEXFET Power MOSFETl High frequency DC-DC convertersKey Parametersl Plasma Display PanelVDS 150 VVDS (Avalanche) min. 200 VBenefitsRDS(ON) max @ 10V 32 ml Low Gate-to-Drain Charge toTJ maxReduce\ Switching Losses 175 Cl Fully Characterized Capacitance Including Effective COSS to SimplifyDesign

PD - 94357IRFB52N15D IRFS52N15DSMPS MOSFET IRFSL52N15DHEXFET Power MOSFETApplicationsVDSS RDS(on) max ID High frequency DC-DC converters150V 0.032 60ABenefits Low Gate-to-Drain Charge to ReduceSwitching Losses Fully Characterized Capacitance IncludingEffective COSS to Simplify Design, (SeeApp. Note AN1001) Fully Characterized Avalanche Voltageand Current

PD - 97002AIRFB52N15DPbFIRFS52N15DPbFIRFSL52N15DPbFApplicationsHEXFET Power MOSFETl High frequency DC-DC convertersKey Parametersl Plasma Display PanelVDS 150 VVDS (Avalanche) min. 200 VBenefitsRDS(ON) max @ 10V 32 ml Low Gate-to-Drain Charge toTJ maxReduce\ Switching Losses 175 Cl Fully Characterized Capacitance Including Effective COSS to SimplifyDesign

isc N-Channel MOSFET Transistor IRFS52N15D, IIRFS52N15DFEATURESStatic drain-source on-resistance:RDS(on)32mEnhancement mode:100% avalanche testedMinimum Lot-to-Lot variations for robust deviceperformance and reliable operationDESCRITIONHigh frequency DC-DC convertersABSOLUTE MAXIMUM RATINGS(T =25)aSYMBOL PARAMETER VALUE UNITV Drain-Source Volta