AGM315MBP - описание и поиск аналогов

 ..1. Size:807K  cn agmsemi
 agm315mbp.pdf 

AGM315MBP Table 3. Electrical Characteristics (TJ=25 unless otherwise noted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BVDSS Drain-Source Breakdown Voltage V =0V I =250 A 30 -- -- V GS D Zero Gate Voltage Drain Current V =30V,V =0V -- -- 1 A DS GS I DSS V = 20V,V =0V -- -- nA GS DS IGSS Gate-Body Leakage Current 100 VGS(th) Gate Threshold Voltage V =V

 7.1. Size:754K  cn agmsemi
 agm315mn.pdf 

AGM315MN General Description Product Summary The AGM315MN combines advanced trench MOSFET technology with a low resistance package to provide extremely low R . DS(ON) This device is ideal for load switch and battery BVDSS RDSON ID protection applications. Features 30V 12m 12A Advance high cell density Trench technology SOP8 Pin Configuration Low R to minimize c

 9.1. Size:865K  cn agmsemi
 agm310as.pdf 

AGM310AS General Description Product Summary The AGM310AS combines advanced trench MOSFET to provide technology with a low resistance package extremely low R . DS(ON) BVDSS RDSON ID This device is ideal for load switch and battery protection applications. 30V 6.7m 22A Features Advance high cell density Trench technology DFN2*2 Pin Configuration Low R to minimi

 9.2. Size:1921K  cn agmsemi
 agm314ma.pdf 

AGM314MA Table 3. N- Channel Electrical Characteristics (TJ=25 unless otherwisenoted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BV Drain-Source Breakdown Voltage V =0V I =250 A 30 -- -- V GS D DSS Zero Gate Voltage Drain Current V =30V,V =0V -- -- 1 A DS GS I DSS Gate-Body Leakage Current V = 20V,V =0V -- -- nA GS DS 100 I GSS VGS(th) Gate Threshold Vo

 9.3. Size:1137K  cn agmsemi
 agm318map.pdf 

AGM318MAP Table 3. N- Channel Electrical Characteristics (TJ=25 unless otherwisenoted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BV Drain-Source Breakdown Voltage V =0V I =250 A 30 -- -- V GS D DSS Zero Gate Voltage Drain Current V =30V,V =0V -- -- 1 A DS GS I DSS Gate-Body Leakage Current V = 20V,V =0V -- -- nA GS DS 100 I GSS VGS(th) Gate Threshold V

 9.4. Size:1449K  cn agmsemi
 agm312map.pdf 

AGM312MAP Table 3. P-Channel Electrical Characteristics (TJ=25 unless otherwisenoted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BVDSS Drain-Source Breakdown Voltage VGS=0V ID=-250 A -30 -- -- V Zero Gate Voltage Drain Current V =-24V,V =0V -1 DS GS I -- -- A DSS Gate-Body Leakage Current V = 20V,V =0V 100 GS DS I -- -- nA GSS V Gate Threshold Voltage V =

 9.5. Size:1388K  cn agmsemi
 agm310map.pdf 

AGM310MAP Table 3. N- Channel Electrical Characteristics (TJ=25 unless otherwisenoted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BV Drain-Source Breakdown Voltage V =0V I =250 A 30 -- -- V GS D DSS Zero Gate Voltage Drain Current V =30V,V =0V -- -- 1 A DS GS I DSS Gate-Body Leakage Current V = 20V,V =0V -- -- nA GS DS 100 I GSS VGS(th) Gate Threshold V

 9.6. Size:1521K  cn agmsemi
 agm310ma.pdf 

AGM310MA N Channel characteristics curve Fig.1 Power Dissipation Derating Curve Fig.2 Typical output Characteristics 1.2 50 1 V =10V GS 0.8 V =4.5V GS 25 0.6 0.4 0.2 0 0 0.5 1 1.5 2 0 Drain-Source voltage (V) 0 50 100 150 200 Temperature ( C) Fig.3 Threshold Voltage V.S Junction Temperature Fig.4 Resistance V.S Drain Current 2.5 20 2 1.5 10 1 0.5 0 0 -5

 9.7. Size:615K  cn agmsemi
 agm310a.pdf 

AGM310A General Description Product Summary The AGM310A combines advanced trenchMOSFET to provide technology with a low resistance package extremely low R . DS(ON) This device is ideal BVDSS RDSON ID for load switch and battery protection applications. 30V 9.7m 28A Features Advance high cell density Trench technology PDFN5*6 Pin Configuration Low R to minimize

 9.8. Size:902K  cn agmsemi
 agm310d.pdf 

AGM310D Table 3. Electrical Characteristics (Tj=25 unless otherwise noted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BV Drain-Source Breakdown Voltage V =0V I =250 A 30 -- -- V GS D DSS Zero Gate Voltage Drain Current V =30V,V =0V -- -- 1.0 A DS GS I DSS Gate-Body Leakage Current V = 20V,V =0V -- -- nA GS DS I GSS 100 V Gate Threshold Voltage V =V ,I

 9.9. Size:1429K  cn agmsemi
 agm310m.pdf 

AGM310M General Description Product Summary The AGM310M combines advanced trench MOSFET technology with a low resistance to provide extremely low R . BVDSS RDSON ID package DS(ON) This device is ideal for load switch and battery 30V 12m 12A protection applications. -30V 16m -12A Features SOP8 Pin Configuration Advance high cell density Trench technology R to minimi

 9.10. Size:1450K  cn agmsemi
 agm310mar.pdf 

AGM310MAR Table 3. N- Channel Electrical Characteristics (TJ=25 unless otherwisenoted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BV Drain-Source Breakdown Voltage V =0V I =250 A 30 -- -- V GS D DSS Zero Gate Voltage Drain Current V =30V,V =0V -- -- 1 A DS GS I DSS Gate-Body Leakage Current V = 20V,V =0V -- -- nA GS DS 100 I GSS VGS(th) Gate Threshold V

 9.11. Size:1636K  cn agmsemi
 agm314md.pdf 

AGM314MD Table 3. P-Channel Electrical Characteristics (TJ=25 unless otherwisenoted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BVDSS Drain-Source Breakdown Voltage VGS=0V ID=-250 A -30 -- -- V Zero Gate Voltage Drain Current V =-30V,V =0V -1 DS GS I -- -- A DSS Gate-Body Leakage Current V = 20V,V =0V 100 GS DS I -- -- nA GSS V Gate Threshold Voltage V =V

 9.12. Size:802K  cn agmsemi
 agm318d.pdf 

AGM318D 25 20 VGS= 5 10V 20 16 VGS 4V 15 12 10 8 5 4 VGS 3V 0 0 0 1 2 3 4 5 6 0 1 2 3 4 5 6 VDS , Drain-to-Source Voltage (V) VGS , Gate-to-Source Voltage (V) Figure 1. Output Characteristics Figure 2. Transfer Characteristics 1.1 2 VG = 10V ID= 250uA 1.075 1.75 ID= 6.9A 1.05 1.5 1.025 1.25 1 1 0.975 0.75 0.95 0.5 0.925 0.25 -50 -25 0 25 50 75 100 12

 9.13. Size:1295K  cn agmsemi
 agm310md.pdf 

AGM310MD Table 3. N- Channel Electrical Characteristics (Tj=25 unless otherwisenoted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BV Drain-Source Breakdown Voltage V =0V I =250 A 30 -- -- V GS D DSS Zero Gate Voltage Drain Current V =30V,V =0V -- -- 1 A DS GS I DSS Gate-Body Leakage Current V = 20V,V =0V -- -- nA GS DS 100 I GSS VGS(th) Gate Threshold Vo

 9.14. Size:914K  cn agmsemi
 agm311map.pdf 

AGM311MAP General Description The AGM311MAP combines advanced trench Product Summary MOSFET technology with a low resistance package to provide extremely low R . DS(ON) This device is ideal for load switch and battery BVDSS RDSON ID protection applications. Features 30V 10.5m 25A Advance high cell density Trench technology Low R to minimize conductive loss PDFN3

 9.15. Size:788K  cn agmsemi
 agm318mn.pdf 

AGM318MN General Description Product Summary The AGM318MN combines advanced trenchMOSFET technology with a low resistance to provide extremely low R . package DS(ON) BVDSS RDSON ID This device is ideal for load switch and battery 30V 16m 8A protection applications. Features SOP8 Pin Configuration Advance high cell density Trench technology R to minimize conductive lo

 9.16. Size:1622K  cn agmsemi
 agm314map.pdf 

AGM314MAP Table 3. P-Channel Electrical Characteristics (TJ=25 unless otherwisenoted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BVDSS Drain-Source Breakdown Voltage VGS=0V ID=-250 A -30 -- -- V Zero Gate Voltage Drain Current V =-30V,V =0V -1 DS GS I -- -- A DSS Gate-Body Leakage Current V = 20V,V =0V 100 GS DS I -- -- nA GSS V Gate Threshold Voltage V =

 9.17. Size:1126K  cn agmsemi
 agm312m2.pdf 

AGM312M2 General Description Product Summary The AGM312M2 combines advanced trench MOSFET technology with a low resistance to provide extremely low R . package DS(ON) BVDSS RDSON ID This device is ideal for load switch and battery 30V 18m 9A protection applications. -30V 37m -6.8A Features Advance high cell density Trench technology SOP8 Pin Configuration Low R t

 9.18. Size:932K  cn agmsemi
 agm312d.pdf 

AGM312D General Description The AGM312D combines advanced trench MOSFET Product Summary to provide technology with a low resistance package extremely low R . DS(ON) This device is ideal for load switch and battery BVDSS RDSON ID protection applications. Features 30V 14m 20A Advance high cell density Trench technology TO-252 Pin Configuration Low R to minimize

 9.19. Size:1006K  cn agmsemi
 agm312m1.pdf 

AGM312M1 General Description Product Summary The AGM312M1 combines advanced trench MOSFET technology with a low resistance BVDSS RDSON ID to provide extremely low R . package DS(ON) 30V 12m 9.0A This device is ideal for load switch and battery -30V 30m -7.2A protection applications. Features SOP-8 Pin Configuration Advance high cell density Trench technology Low

 9.20. Size:905K  cn agmsemi
 agm310ap1.pdf 

AGM310AP1 Fig.1 Power Dissipation Derating Curve Fig.2 Typical output Characteristics 1.2 50 1 V =10V GS 0.8 V =4.5V GS 25 0.6 0.4 0.2 0 0 0.5 1 1.5 2 0 Drain-Source voltage (V) 0 50 100 150 200 Temperature ( C) Fig.3 Threshold Voltage V.S Junction Temperature Fig.4 Resistance V.S Drain Current 2.5 20 2 1.5 10 1 0.5 0 0 -50 50 150 0 10 20 30 Junction Tempe

 9.21. Size:2273K  cn agmsemi
 agm312me.pdf 

AGM312ME Table 3. N- Channel Electrical Characteristics (TJ=25 unless otherwise noted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BV Drain-Source Breakdown Voltage V =0V I =250 A 30 -- -- V GS D DSS Zero Gate Voltage Drain Current V =30V,V =0V -- -- 1 A DS GS I DSS Gate-Body Leakage Current -- -- nA I V = 12V,V =0V GSS GS DS 100 V Gate Threshold Voltage

 9.22. Size:887K  cn agmsemi
 agm312ap.pdf 

AGM312AP CHARACTERISTICS CURVES (TC = 25 C unless otherwise noted) Continuous Drain Current vs. TC Normalized RDS(ON) vs. TJ TJ, Junction Temperature ( C) TC, Case Temperature ( C) Normalized Vth vs. TJ Gate Charge Qg, Gate Charge (nC) TJ, Junction Temperature ( C) Normalized Transient Impedance Maximum Safe Operation Area VDS, Drain to Source Voltage (V) Square Wa

 9.23. Size:1148K  cn agmsemi
 agm311mn.pdf 

AGM311MN General Description Product Summary The AGM311MN combines advanced trench MOSFET technology with a low resistance to provide extremely low R . BVDSS RDSON ID package DS(ON) This device is ideal for load switch and battery 30V 10.5m 11A protection applications. SOP8 Pin Configuration Features Advance high cell density Trench technology R to minimize conductive

 9.24. Size:854K  cn agmsemi
 agm318mbp.pdf 

AGM318MBP General Description The AGM318MBP combines advanced trench Product Summary MOSFET technology with a low resistance package to provide extremely low R . DS(ON) This device is ideal for load switch and battery BVDSS RDSON ID protection applications. 30V 16m 8A Features Advance high cell density Trench technology PDFN3.3*3.3 Pin Configuration Low R to mi