CEM3259 MOSFET. Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características

   Número de Parte: CEM3259
   Tipo de FET: MOSFET
   Polaridad de transistor: NP

ESPECIFICACIONES MÁXIMAS

   Pdⓘ - Máxima disipación de potencia: 2 W
   |Vds|ⓘ - Voltaje máximo drenador - fuente: 30 V
   |Vgs|ⓘ - Voltaje máximo fuente - puerta: 20 V
   |Id|ⓘ - Corriente continua de drenaje: 7.6(5.9) A
   Tjⓘ - Temperatura máxima de unión: 150 °C

CARACTERÍSTICAS ELÉCTRICAS

   |Vgs(th)|ⓘ - Tensión umbral entre puerta y fuente: 3 V
   Qgⓘ - Carga de la puerta: 13 nC
   trⓘ - Tiempo de subida: 4(5) nS
   Cossⓘ - Capacitancia de salida: 125(150) pF
   Rds(on)ⓘ - Resistencia estado encendido drenaje a fuente: 0.022 Ohm
   Paquete / Cubierta: SO8

Búsqueda de reemplazo de MOSFET CEM3259

CEM3259 Datasheet (PDF)

..1. Size:610K cet
cem3259.pdf

CEM3259Dual Enhancement Mode Field Effect Transistor (N and P Channel)FEATURES530V, 7.6A, RDS(ON) = 22m @VGS = 10V. RDS(ON) = 33m @VGS = 4.5V.-30V, -5.9A, RDS(ON) = 36m @VGS = -10V. RDS(ON) = 52m @VGS = -4.5V.Super high dense cell design for extremely low RDS(ON). D1 D1 D2 D28 7 6 5High power and current handing capability.Lead free product is acquired.Surfac

8.1. Size:408K cet
cem3254.pdf

CEM3254N-Channel Enhancement Mode Field Effect Transistor PRELIMINARYFEATURES30V ,7.8A, RDS(ON) = 28m @VGS = 10V. RDS(ON) = 40m @VGS = 4.5V.D D D DSuper high dense cell design for extremely low RDS(ON).8 7 6 5High power and current handing capability.Lead-free plating ; RoHS compliant.Surface mount Package.1 2 3 4 S S S GSO-81ABSOLUTE MAXIMUM RATINGS TA = 25

8.2. Size:301K cet
cem3258.pdf

CEM3258Dual N-Channel Enhancement Mode Field Effect TransistorFEATURES530V, 7A, RDS(ON) = 28m @VGS = 10V. RDS(ON) = 40m @VGS = 4.5V.Super high dense cell design for extremely low RDS(ON).High power and current handing capability.Lead free product is acquired. D1 D1 D2 D28 7 6 5Surface mount Package.SO-81 2 3 41S1 G1 S2 G2ABSOLUTE MAXIMUM RATINGS TA = 25 C unl

8.3. Size:390K cet
cem3252.pdf

CEM3252N-Channel Enhancement Mode Field Effect TransistorFEATURES30V, 7.5A, RDS(ON) = 28m @VGS = 10V. RDS(ON) = 40m @VGS = 4.5V.Super high dense cell design for extremely low RDS(ON).High power and current handing capability.D D D DLead free product is acquired.8 7 6 5Surface mount Package.SO-81 2 3 41 S S S GABSOLUTE MAXIMUM RATINGS TA = 25 C unless otherwis

8.4. Size:342K cet
cem3252l.pdf

CEM3252LN-Channel Enhancement Mode Field Effect TransistorFEATURES530V, 8A, RDS(ON) = 29m @VGS = 10V. RDS(ON) = 36m @VGS = 4.5V. RDS(ON) = 55m @VGS = 2.5V.Super high dense cell design for extremely low RDS(ON).D D D DHigh power and current handing capability.8 7 6 5Lead free product is acquired.Surface mount Package.SO-81 2 3 41 S S S GABSOLUTE MAXIMUM

8.5. Size:877K cn vbsemi
cem3252.pdf

CEM3252www.VBsemi.twN-Channel 20V (D-S) MOSFETFEATURESPRODUCT SUMMARY Halogen-freeVDS (V) RDS(on) ()ID (A)a Qg (Typ.) TrenchFET Power MOSFET0.012 at VGS = 10 V 1220 6.1 nC Optimized for High-Side Synchronous0.015 at VGS = 4.5 V 11Rectifier Operation 100 % Rg Tested 100 % UIS TestedAPPLICATIONS Notebook CPU Core- High-Side SwitchSO-

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