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G33 MOSFET. Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características


   Número de Parte: G33
   Código: G33
   Tipo de FET: MOSFET
   Polaridad de transistor: P

ESPECIFICACIONES MÁXIMAS

   Pdⓘ - Máxima disipación de potencia: 1 W
   |Vds|ⓘ - Voltaje máximo drenador - fuente: 18 V
   |Vgs|ⓘ - Voltaje máximo fuente - puerta: 12 V
   |Id|ⓘ - Corriente continua de drenaje: 4.8 A
   Tjⓘ - Temperatura máxima de unión: 150 °C

CARACTERÍSTICAS ELÉCTRICAS

   |Vgs(th)|ⓘ - Tensión umbral entre puerta y fuente: 1 V
   Qgⓘ - Carga de la puerta: 12 nC
   trⓘ - Tiempo de subida: 35 nS
   Cossⓘ - Capacitancia de salida: 220 pF
   Rds(on)ⓘ - Resistencia estado encendido drenaje a fuente: 0.05 Ohm
   Paquete / Cubierta: SOT23

 Búsqueda de reemplazo de MOSFET G33

 

G33 Datasheet (PDF)

 ..1. Size:1781K  goford
g33.pdf

G33
G33

GOFORDG33DESCRIPTION DThe G33 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate Gvoltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. SGENERAL FEATURES Schematic diagram VDSS RDS(ON) RDS(ON) ID(Typ) @-2.5V @-4.5V (Typ)G33-18V37m 51m -4.8 A High Po

 0.1. Size:566K  1
g33n03d3.pdf

G33
G33

GOFORDG33N03D3N-Channel Trench MOSFETDescriptionThe G33N03D3 uses advanced trench technology to provideexcellent RDS(ON) , low gate charge. It can be used in a wide variety of applications.General FeaturesSchematic Diagram VDS 30V ID (at VGS = 10V) 33A RDS(ON) (at VGS = 10V)

 0.2. Size:216K  fairchild semi
fdg332pz.pdf

G33
G33

December 2008FDG332PZtmP-Channel PowerTrench MOSFET -20V, -2.6A, 97mFeatures General DescriptionThis P-Channel MOSFET uses Fairchilds advanced low Max rDS(on) = 95m at VGS = -4.5V, ID = -2.6Avoltage PowerTrench process. It has been optimized for Max rDS(on) = 115m at VGS = -2.5V, ID = -2.2Abattery power management applications. Max rDS(on) = 160m at VG

 0.3. Size:150K  fairchild semi
fdg330p.pdf

G33
G33

December 2001 FDG330P P-Channel 1.8V Specified PowerTrench MOSFET General Description Features This P-Channel 1.8V specified MOSFET uses 2 A, 12 V. RDS(ON) = 110 m @ VGS = 4.5 V Fairchilds advanced low voltage PowerTrench process. RDS(ON) = 150 m @ VGS = 2.5 V It has been optimized for battery power management RDS(ON) = 215 m @ VGS

 0.4. Size:176K  vishay
sihg33n60ef.pdf

G33
G33

SiHG33N60EFwww.vishay.comVishay SiliconixEF Series Power MOSFET with Fast Body DiodeFEATURESPRODUCT SUMMARY Fast body diode MOSFET using E series VDS (V) at TJ max. 650 technology Reduced trr, Qrr, and IRRMRDS(on) max. at 25 C () VGS = 10 V 0.098 Low figure-of-merit (FOM): Ron x QgQg (Max.) (nC) 155 Low input capacitance (Ciss)Qgs (nC) 22 Reduced s

 0.5. Size:147K  vishay
sihg33n60e.pdf

G33
G33

SiHG33N60Ewww.vishay.comVishay SiliconixE Series Power MOSFETFEATURESPRODUCT SUMMARY Low Figure-of-Merit (FOM): Ron x QgVDS (V) at TJ max. 650 Low Input Capacitance (Ciss)RDS(on) max. at 25 C () VGS = 10 V 0.099 Reducted Switching and Conduction LossesQg (Max.) (nC) 150 Ultra Low Gate Charge (Qg)Qgs (nC) 24Qgd (nC) 42 Avalanche Energy Rated (UIS

 0.6. Size:566K  onsemi
fdg332pz.pdf

G33
G33

July 2007FDG332PZ tmP-Channel PowerTrench MOSFET -20V, -2.6A, 97mFeatures General DescriptionThis P-Channel MOSFET uses Fairchilds advanced low Max rDS(on) = 95m at VGS = -4.5V, ID = -2.6Avoltage PowerTrench process. It has been optimized for Max rDS(on) = 115m at VGS = -2.5V, ID = -2.2Abattery power management applications. Max rDS(on) = 160m at VGS =

 0.7. Size:148K  no
ecg32x ecg33x ecg34x.pdf

G33

 0.8. Size:112K  jiangsu
3dg3332.pdf

G33

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD TO-92 Plastic-Encapsulate Transistors 3DG3332 TRANSISTOR (NPN) TO 92 FEATURES 1.EMITTER Low Current High Voltage2. COLLECTOR 3.BASE APPLICATIONS Video Telephony Professional Communication Equipment MAXIMUM RATINGS (Ta=25 unless otherwise noted) Symbol Parameter Value UnitVCBO Collector-Base Voltage 180

 0.9. Size:566K  goford
g33n03d3.pdf

G33
G33

GOFORDG33N03D3N-Channel Trench MOSFETDescriptionThe G33N03D3 uses advanced trench technology to provideexcellent RDS(ON) , low gate charge. It can be used in a wide variety of applications.General FeaturesSchematic Diagram VDS 30V ID (at VGS = 10V) 33A RDS(ON) (at VGS = 10V)

 0.10. Size:240K  china
scg3350.pdf

G33

SCG3350 PNP PCM Ta=25 3002 mW ICM 100 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.01mA 60 V V(BR)CEO ICE=0.01mA 45 V V(BR) EBO IEB=0.01mA 6.0 V ICBO VCB=30V 0.01 A ICEO VCE=30V 0.1 A IEBO VEB=3V 0.1 A VBEsat 0.9 IC=10mA

 0.11. Size:111K  china
3dg3399.pdf

G33

3DG3399(2SC3399) NPN PCM TA=25 300 mW ICM 100 mA Tjm 150 Tstg -55~150 V(BR)CBO ICB=0.01m 50 V A V(BR)CEO ICE=0.1mA 50 V V(BR)EBO IEB=0.1mA 10 V ICBO VCB=40V 0.1 A ICEO VCB=40V 0.5 A IEBO VEB=5V 80 A IC=5mA VCEsat 0.3 V

 0.12. Size:161K  china
3dg3356.pdf

G33
G33

2SC3356(3DG3356) NPN /SILION NPN TRANSISTOR : Purpose: low noise amplifier at VHF, UHF and CATV band applications. : Features: Low noise and high power gain. /Absolute maximum ratings(Ta=25) Symbol Rating Uni

 0.13. Size:202K  foshan
3dg3357.pdf

G33
G33

2SC3357(3DG3357) NPN /SILICON NPN TRANSISTOR : Purpose: low noise amplifier at VHF, UHF and CATV band applications. :,, Features: Low noise and high gain, large P in small package. C/Absolute maximum ratings(Ta=25)

 0.14. Size:314K  foshan
3dg3326.pdf

G33
G33

2SC3326(3DG3326) NPN /SILICON NPN TRANSISTOR :/Purpose: For muting and switching applications. /Absolute maximum ratings(Ta=25) Symbol Rating Unit V 50 V CBO V 20 V CEO V 12 V EBO I 300 mA C I 60 mA B P 150 mW C T 150 j T -55150 stg /Electrical ch

 0.15. Size:174K  foshan
3dg3355.pdf

G33
G33

2SC3355(3DG3355) NPN /SILICON NPN TRANSISTOR : Purpose: low noise amplifier at VHF, UHF and CATV band applications. : Features: Low noise and high power gain. /Absolute maximum ratings(Ta=25) Symbol Rating U

 0.16. Size:303K  kia
kng3303a kny3303a.pdf

G33
G33

90A30VKNX3303AN-CHANNELMOSFETKIAKIAKIASEMICONDUCTORSSEMICONDUCTORSEMICONDUCTORSS1.DescriptionThis Power MOSFET is produced using KIA`s advanced planar stripe DMOS technology. Thisadvanced technology has been especially tailored to minimize on-state resistance, provide superiorswitching performance, and withstand high energy pulse in the avalanche and commutation m

 0.17. Size:291K  lzg
3dg3330.pdf

G33
G33

2SC3330(3DG3330) NPN /SILION NPN TRANSISTOR : Purpose: Capable of being used in the low frequency to high frequency range. :/Features: Large current capacity and wide ASO. /Absolute maximum ratings(Ta=25) Symbol Rating Unit V

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