G33. Аналоги и основные параметры
Наименование производителя: G33
Тип транзистора: MOSFET
Полярность: P
Предельные значения
Pd ⓘ
- Максимальная рассеиваемая мощность: 1 W
|Vds|ⓘ - Максимально допустимое напряжение сток-исток: 18 V
|Vgs|ⓘ - Максимально допустимое напряжение затвор-исток: 12 V
|Id| ⓘ - Максимально допустимый постоянный ток стока: 4.8 A
Tj ⓘ - Максимальная температура канала: 150 °C
Электрические характеристики
tr ⓘ -
Время нарастания: 35 ns
Cossⓘ - Выходная емкость: 220 pf
RDSonⓘ - Сопротивление сток-исток открытого транзистора: 0.05 Ohm
Тип корпуса: SOT23
- подборⓘ MOSFET транзистора по параметрам
G33 даташит
..1. Size:1781K goford
g33.pdf 

GOFORD G33 DESCRIPTION D The G33 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram VDSS RDS(ON) RDS(ON) ID (Typ) @-2.5V @-4.5V (Typ) G33 -18V 37m 51m -4.8 A High Po
0.1. Size:566K 1
g33n03d3.pdf 

GOFORD G33N03D3 N-Channel Trench MOSFET Description The G33N03D3 uses advanced trench technology to provide excellent RDS(ON) , low gate charge. It can be used in a wide variety of applications. General Features Schematic Diagram VDS 30V ID (at VGS = 10V) 33A RDS(ON) (at VGS = 10V)
0.2. Size:216K fairchild semi
fdg332pz.pdf 

December 2008 FDG332PZ tm P-Channel PowerTrench MOSFET -20V, -2.6A, 97m Features General Description This P-Channel MOSFET uses Fairchild s advanced low Max rDS(on) = 95m at VGS = -4.5V, ID = -2.6A voltage PowerTrench process. It has been optimized for Max rDS(on) = 115m at VGS = -2.5V, ID = -2.2A battery power management applications. Max rDS(on) = 160m at VG
0.3. Size:150K fairchild semi
fdg330p.pdf 

December 2001 FDG330P P-Channel 1.8V Specified PowerTrench MOSFET General Description Features This P-Channel 1.8V specified MOSFET uses 2 A, 12 V. RDS(ON) = 110 m @ VGS = 4.5 V Fairchild s advanced low voltage PowerTrench process. RDS(ON) = 150 m @ VGS = 2.5 V It has been optimized for battery power management RDS(ON) = 215 m @ VGS
0.4. Size:176K vishay
sihg33n60ef.pdf 

SiHG33N60EF www.vishay.com Vishay Siliconix EF Series Power MOSFET with Fast Body Diode FEATURES PRODUCT SUMMARY Fast body diode MOSFET using E series VDS (V) at TJ max. 650 technology Reduced trr, Qrr, and IRRM RDS(on) max. at 25 C ( ) VGS = 10 V 0.098 Low figure-of-merit (FOM) Ron x Qg Qg (Max.) (nC) 155 Low input capacitance (Ciss) Qgs (nC) 22 Reduced s
0.5. Size:147K vishay
sihg33n60e.pdf 

SiHG33N60E www.vishay.com Vishay Siliconix E Series Power MOSFET FEATURES PRODUCT SUMMARY Low Figure-of-Merit (FOM) Ron x Qg VDS (V) at TJ max. 650 Low Input Capacitance (Ciss) RDS(on) max. at 25 C ( ) VGS = 10 V 0.099 Reducted Switching and Conduction Losses Qg (Max.) (nC) 150 Ultra Low Gate Charge (Qg) Qgs (nC) 24 Qgd (nC) 42 Avalanche Energy Rated (UIS
0.6. Size:566K onsemi
fdg332pz.pdf 

July 2007 FDG332PZ tm P-Channel PowerTrench MOSFET -20V, -2.6A, 97m Features General Description This P-Channel MOSFET uses Fairchild s advanced low Max rDS(on) = 95m at VGS = -4.5V, ID = -2.6A voltage PowerTrench process. It has been optimized for Max rDS(on) = 115m at VGS = -2.5V, ID = -2.2A battery power management applications. Max rDS(on) = 160m at VGS =
0.8. Size:112K jiangsu
3dg3332.pdf 

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD TO-92 Plastic-Encapsulate Transistors 3DG3332 TRANSISTOR (NPN) TO 92 FEATURES 1.EMITTER Low Current High Voltage 2. COLLECTOR 3.BASE APPLICATIONS Video Telephony Professional Communication Equipment MAXIMUM RATINGS (Ta=25 unless otherwise noted) Symbol Parameter Value Unit VCBO Collector-Base Voltage 180
0.9. Size:566K goford
g33n03d3.pdf 

GOFORD G33N03D3 N-Channel Trench MOSFET Description The G33N03D3 uses advanced trench technology to provide excellent RDS(ON) , low gate charge. It can be used in a wide variety of applications. General Features Schematic Diagram VDS 30V ID (at VGS = 10V) 33A RDS(ON) (at VGS = 10V)
0.10. Size:240K china
scg3350.pdf 

SCG3350 PNP PCM Ta=25 300 2 mW ICM 100 mA Tjm 175 Tstg -55 150 V(BR)CBO ICB=0.01mA 60 V V(BR)CEO ICE=0.01mA 45 V V(BR) EBO IEB=0.01mA 6.0 V ICBO VCB=30V 0.01 A ICEO VCE=30V 0.1 A IEBO VEB=3V 0.1 A VBEsat 0.9 IC=10mA
0.11. Size:111K china
3dg3399.pdf 

3DG3399(2SC3399) NPN PCM TA=25 300 mW ICM 100 mA Tjm 150 Tstg -55 150 V(BR)CBO ICB=0.01m 50 V A V(BR)CEO ICE=0.1mA 50 V V(BR)EBO IEB=0.1mA 10 V ICBO VCB=40V 0.1 A ICEO VCB=40V 0.5 A IEBO VEB=5V 80 A IC=5mA VCEsat 0.3 V
0.12. Size:161K china
3dg3356.pdf 

2SC3356(3DG3356) NPN /SILION NPN TRANSISTOR Purpose low noise amplifier at VHF, UHF and CATV band applications. Features Low noise and high power gain. /Absolute maximum ratings(Ta=25 ) Symbol Rating Uni
0.14. Size:314K foshan
3dg3326.pdf 

2SC3326(3DG3326) NPN /SILICON NPN TRANSISTOR /Purpose For muting and switching applications. /Absolute maximum ratings(Ta=25 ) Symbol Rating Unit V 50 V CBO V 20 V CEO V 12 V EBO I 300 mA C I 60 mA B P 150 mW C T 150 j T -55 150 stg /Electrical ch
0.15. Size:174K foshan
3dg3355.pdf 

2SC3355(3DG3355) NPN /SILICON NPN TRANSISTOR Purpose low noise amplifier at VHF, UHF and CATV band applications. Features Low noise and high power gain. /Absolute maximum ratings(Ta=25 ) Symbol Rating U
0.16. Size:303K kia
kng3303a kny3303a.pdf 

90A 30V KNX3303A N-CHANNELMOSFET KIA KIA KIA SEMICONDUCTORS SEMICONDUCTOR SEMICONDUCTOR S S 1.Description This Power MOSFET is produced using KIA s advanced planar stripe DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation m
0.17. Size:291K lzg
3dg3330.pdf 

2SC3330(3DG3330) NPN /SILION NPN TRANSISTOR Purpose Capable of being used in the low frequency to high frequency range. /Features Large current capacity and wide ASO. /Absolute maximum ratings(Ta=25 ) Symbol Rating Unit V
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