SE30150 Todos los transistores

 

SE30150 MOSFET. Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características


   Número de Parte: SE30150
   Tipo de FET: MOSFET
   Polaridad de transistor: N

ESPECIFICACIONES MÁXIMAS

   Pdⓘ - Máxima disipación de potencia: 42 W
   |Vds|ⓘ - Voltaje máximo drenador - fuente: 30 V
   |Vgs|ⓘ - Voltaje máximo fuente - puerta: 20 V
   |Id|ⓘ - Corriente continua de drenaje: 90 A
   Tjⓘ - Temperatura máxima de unión: 150 °C

CARACTERÍSTICAS ELÉCTRICAS


   trⓘ - Tiempo de subida: 11.5 nS
   Cossⓘ - Capacitancia de salida: 53 pF
   Rds(on)ⓘ - Resistencia estado encendido drenaje a fuente: 0.0027 Ohm
   Paquete / Cubierta: TO263
 

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SE30150 Datasheet (PDF)

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SE30150

SE30150N-Channel Enhancement-Mode MOSFETRevision: AGeneral Description FeaturesFor a single MOSFETAdvanced trench technology to provideexcellent RDS(ON), low gate charge and V =30VDSlow operation voltage. This device is R =2.3m @V =10VDS(ON) GSsuitable for using as a load switch or inPWM applications. Simple Drive Requirement Small Package Outline

 0.1. Size:371K  cn sino-ic
se30150b.pdf pdf_icon

SE30150

Dec 2014SE30150BN-Channel Enhancement-Mode MOSFETRevision: AGeneral Description FeaturesThigh Density Cell Design For Ultra Low For a single MOSFETOn-Resistance Fully Characterized Avalanche V =30VDSVoltage and Current Improved Shoot-Through R =1.6m @V =10 @I =30ADS(ON) GS DSFOM R =2.1m @V =4.5 @I =25ADS(ON) GS DS Simple Drive Requirement Sma

 0.2. Size:334K  cn sino-ic
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SE30150

Dec 2014SE30150AN-Channel Enhancement-Mode MOSFETRevision: AGeneral Description FeaturesThigh Density Cell Design For Ultra Low For a single MOSFETOn-Resistance Fully Characterized Avalanche V =30VDSVoltage and Current Improved Shoot-Through R =2.1m @V =10VDS(ON) GSFOM Simple Drive Requirement Small Package Outline Surface Mount DevicePin config

 9.1. Size:535K  cn sino-ic
se30100b.pdf pdf_icon

SE30150

Jan 2015SE30100BN-Channel Enhancement-Mode MOSFETRevision: AGeneral Description FeaturesThis type used advanced trench technology and For a single MOSFETdesign to provide excellent R with low gateDS(ON) V =30VDScharge. R =3m @V =10VDS(ON) GS High density cell design for ultra low RDS(ON) Excellent package for good heat dissipationPin configurations

Otros transistores... SE2300 , SE2302U , SE2305A , SE2333 , SE2N60B , SE2N7002 , SE2N7002K , SE30100B , RU7088R , SE30150A , SE30150B , SE3018 , SE30200 , SE3050 , SE472 , SE3060D , SE3080A .

History: VBZE30N06

 

 
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