IXFR38N80Q2 Todos los transistores

 

IXFR38N80Q2 MOSFET. Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características


   Número de Parte: IXFR38N80Q2
   Tipo de FET: MOSFET
   Polaridad de transistor: N

ESPECIFICACIONES MÁXIMAS

   Pdⓘ - Máxima disipación de potencia: 500 W
   |Vds|ⓘ - Voltaje máximo drenador - fuente: 800 V
   |Vgs|ⓘ - Voltaje máximo fuente - puerta: 30 V
   |Id|ⓘ - Corriente continua de drenaje: 28 A
   Tjⓘ - Temperatura máxima de unión: 150 °C

CARACTERÍSTICAS ELÉCTRICAS

   |Vgs(th)|ⓘ - Tensión umbral entre puerta y fuente: 4.5 V
   Qgⓘ - Carga de la puerta: 190 nC
   trⓘ - Tiempo de subida: 250 nS
   Rds(on)ⓘ - Resistencia estado encendido drenaje a fuente: 0.24 Ohm
   Paquete / Cubierta: ISOPLUS247

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IXFR38N80Q2 Datasheet (PDF)

 9.1. Size:59K  ixys
ixfr34n80.pdf

IXFR38N80Q2
IXFR38N80Q2

IXFR 34N80 VDSS = 800 VHiPerFETTM Power MOSFETsISOPLUS247TM ID25 = 28 A(Electrically Isolated Backside)RDS(on) = 0.24 trr 250 ns Single MOSFET DieAvalanche RatedPreliminary Data SheetSymbol Test Conditions Maximum Ratings ISOPLUS 247TM E153432VDSS TJ = 25C to 150C 800 VVDGR TJ = 25C to 150C; RGS = 1 M 800 VVGS

 9.2. Size:248K  ixys
ixfc36n50p ixfr36n50p.pdf

IXFR38N80Q2
IXFR38N80Q2

IXFC 36N50P VDSS = 500 VPolarHVTM HiPerFETIXFR 36N50P ID25 = 19 APower MOSFET RDS(on) 190 m (Electrically Isolated Back Surface)trr 200 nsN-Channel Enhancement ModeAvalanche RatedFast Intrinsic DiodeSymbol Test Conditions Maximum RatingsISOPLUS220TM (IXFC)E153432VDSS TJ = 25 C to 150 C 500 VVDGR TJ

 9.3. Size:144K  ixys
ixfr36n60p.pdf

IXFR38N80Q2
IXFR38N80Q2

IXFR 36N60P VDSS = 600 VPolarHVTM HiPerFETID25 = 20 APower MOSFET RDS(on) 200 m (Electrically Isolated Back Surface)trr 200 nsN-Channel Enhancement ModeAvalanche RatedFast Intrinsic DiodeSymbol Test Conditions Maximum RatingsISOPLUS247 (IXFR)E153432VDSS TJ = 25 C to 150 C 600 VVDGR TJ = 25 C to 15

 9.4. Size:135K  ixys
ixfc30n60p ixfr30n60p.pdf

IXFR38N80Q2
IXFR38N80Q2

IXFC 30N60P VDSS = 600 VPolarHVTM HiPerFETIXFR 30N60P ID25 = 15 APower MOSFET RDS(on) 250 m Electrically Isolated Back Surfacetrr 250 nsN-Channel Enhancement ModeFast Recovery DiodeAvalanche RatedSymbol Test Conditions Maximum RatingsISOPLUS220TM (IXFC)VDSS TJ = 25C to 150C 600 VE153432VDGR TJ = 25C to

 9.5. Size:149K  ixys
ixfr32n80p.pdf

IXFR38N80Q2
IXFR38N80Q2

PolarHVTM HiPerFET VDSS = 800 V IXFR 32N80PID25 = 20 APower MOSFET RDS(on) 290 m ISOPLUS247TMtrr 250 ns(Electrically Isolated Back Surface)N-Channel Enhancement ModeAvalanche RatedFast Intrinsic DiodeSymbol Test Conditions Maximum RatingsISOPLUS247 (IXFR) E153432VDSS TJ = 25 C to 150 C 800 VVDGR T

 9.6. Size:91K  ixys
ixfr30n50q ixfr32n50q.pdf

IXFR38N80Q2
IXFR38N80Q2

VDSS ID25 RDS(on)HiPerFETTM Power MOSFETsISOPLUS247TM IXFR 30N50Q 500 V 29 A 0.16 WIXFR 32N50Q 500 V 30 A 0.15 W(Electrically Isolated Back Surface)trr 250 nsN-Channel Enhancement ModeHigh dV/dt, Low trr, HDMOSTM FamilyPreliminary dataISOPLUS 247TMSymbol Test Conditions Maximum RatingsE 153432VDSS TJ = 25C to 150C 500 VVDGR TJ = 25C to 150C; RGS = 1 MW 500 V

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