AM1011-300 . Datasheet. Equivalente. Reemplazo. Hoja de especificaciones. Principales características

   Número de Parte: AM1011-300
   Material: Si
   Polaridad de transistor: NPN

ESPECIFICACIONES MÁXIMAS

   Disipación total del dispositivo (Pc): 325 W
   Tensión colector-base (Vcb): 65 V
   Tensión colector-emisor (Vce): 65 V
   Tensión emisor-base (Veb): 3 V
   Corriente del colector DC máxima (Ic): 16 A
   Temperatura operativa máxima (Tj): 200 °C

CARACTERÍSTICAS ELÉCTRICAS

   Transición de frecuencia (ft): 1000 MHz
   Ganancia de corriente contínua (hfe): 10
   Paquete / Cubierta: M207

Búsqueda de reemplazo de transistor bipolar AM1011-300

AM1011-300 Datasheet (PDF)

..1. Size:59K st
am1011-300.pdf

AM1011-300RF & MICROWAVE TRANSISTORSAVIONICS APPLICATIONS.REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTING.LOW RF THERMAL RESISTANCE.INPUT/OUTPUT MATCHING.OVERLAY GEOMETRY.METAL/CERAMIC HERMETIC PACKAGE.400 x .600 2LFL (M207).P 325 W MIN. WITH 7.7 dB GAINOUT =hermetically sealed.1030/1090 MHZ OPERATIONBRANDINGORDER CODEAM1011-300AM1011-300PIN CONNECTION

7.1. Size:64K st
am1011-075.pdf

AM1011-075RF & MICROWAVE TRANSISTORSL-BAND AVIONICS APPLICATIONS.REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.10:1 VSWR CAPABILITY.LOW THERMAL RESISTANCE.INPUT/OUTPUT MATCHING.OVERLAY GEOMETRY.METAL/CERAMIC HERMETIC PACKAGE .400 x .400 2LFL (S036)hermetically sealed.P = 75 W MIN. WITH 9.2 dB GAINOUTORDER CODE BRANDINGAM1011-075 1011-75DESCRIPTIONPIN CONNE

7.2. Size:43K st
am1011-070.pdf

AM1011-070RF & MICROWAVE TRANSISTORSL-BAND AVIONICS APPLICATIONS.REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.LOW THERMAL RESISTANCE.INPUT/OUTPUT MATCHING.OVERLAY GEOMETRY.METAL/CERAMIC HERMETIC PACKAGE.P = 70 W MIN. WITH 6.7 dB GAINOUT.400 x .400 2NLFL (S042)hermetically sealedORDER CODE BRANDINGAM1011-70 1011-70DESCRIPTIONPIN CONNECTIONThe AM1011-070

7.3. Size:54K st
am1011-500.pdf

AM1011-500RF & MICROWAVE TRANSISTORSAVIONICS APPLICATIONS.P 500 W MIN. WITH 8.5 dB MIN.OUT =GAIN.10:1 LOAD VSWR CAPABILITY @ 10S.,1% DUTY.SIXPAC HERMETIC METAL/CERAMICPACKAGE.EMITTER SITE BALLASTED OVERLAY.400 x .600 2LFL (M198)GEOMETRYhermetically sealed.REFRACTORY/GOLD METALLIZATION.LOW THERMAL RESISTANCE ORDER CODEBRANDINGAM1011-500.INTERNAL INPUT/OUT

Otros transistores... 2SA1801 , 2SA1802 , 2SA1802A , 2SA1803 , 2SA1803O , 2SA1803R , 2SA1804 , 2SA1804O , TIP35C , 2SA1805 , 2SA1805O , 2SA1805R , 2SA1806 , 2SA181 , 2SA1810 , 2SA1810B , 2SA1810C .

History: 2SD102

Liste

Recientemente añadidas las descripciónes de los transistores:

BJT: SBT42 | 2SA200-Y | 2SA200-O | 2SD882-Q | 2SD882-P | 2SD882-E | 2SC945-L | 2SC945-H | 2SC4226-R23 | 2SC3357-F | 2SC3357-E | 2SC3356-R26 | 2SC3356-R24 | 2SC3356-R23 | 2SB772-Q | 2SB772-P | 2SB772-E | 2SA1015-L | 2SA1015-H | HSS8550 | HSS8050