All IGBT. IGC114T170S8RM Datasheet

 

IGC114T170S8RM IGBT. Datasheet pdf. Equivalent


   Type Designator: IGC114T170S8RM
   Type: IGBT
   Type of IGBT Channel: N
   |Vce|ⓘ - Maximum Collector-Emitter Voltage: 1700 V
   |Vge|ⓘ - Maximum Gate-Emitter Voltage: 20 V
   |Ic|ⓘ - Maximum Collector Current: 100 A @25℃
   |VCEsat|ⓘ - Collector-Emitter saturation Voltage, typ: 1.9 V @25℃
   |VGEth|ⓘ - Maximum G-E Threshold Voltag: 6.4 V
   Tjⓘ - Maximum Junction Temperature: 175 ℃
   Package: CHIP

 IGC114T170S8RM Transistor Equivalent Substitute - IGBT Cross-Reference Search

 

IGC114T170S8RM Datasheet (PDF)

 ..1. Size:247K  infineon
igc114t170s8rm.pdf

IGC114T170S8RM
IGC114T170S8RM

IGC114T170S8RM IGBT3 Power Chip Features: This chip is used for: 1700V Trench + Field stop technology power modules C low switching losses soft turn off Applications: positive temperature coefficient drives easy paralleling G E Chip Type VCE IC Die Size Package IGC114T170S8RM 1700V 100A 9.47 x 12.08 mm2 sawn on foil Mechanical Parameters

 1.1. Size:126K  infineon
igc114t170s8rh.pdf

IGC114T170S8RM
IGC114T170S8RM

IGC114T170S8RH IGBT3 Power Chip Features: This chip is used for: 1700V Trench + Field stop technology power modules C low switching losses and saturation losses soft turn off Applications: positive temperature coefficient drives easy parallelingG E Chip Type VCE IC Die Size PackageIGC114T170S8RH 1700V 100A 9.47 x 12.08 mm2 sawn on foil Mech

 9.1. Size:75K  infineon
sigc11t60snc.pdf

IGC114T170S8RM
IGC114T170S8RM

SIGC11T60SNC IGBT Chip in NPT-technology CFEATURES: This chip is used for: 600V NPT technology 100m chip IGBT Modules positive temperature coefficient easy paralleling Applications: GE drives Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4155-SIGC11T60SNC 600V 10A 3.25 x 3.25 mm2 sawn on foil A001 MECHANICAL PARAMETER: mm2

 9.2. Size:72K  infineon
igc11t120t6l.pdf

IGC114T170S8RM
IGC114T170S8RM

IGC11T120T6L IGBT4 Low Power Chip FEATURES: 1200V Trench + Field Stop technology This chip is used for:C low switching losses low / medium power modules positive temperature coefficient easy paralleling Applications: G low / medium power drives E Chip Type VCE ICn Die Size Package IGC11T120T6L 1200V 8A 3.48 x 3.19 mm2 sawn on foil MECHANICAL P

 9.3. Size:70K  infineon
igc11t120t8l.pdf

IGC114T170S8RM
IGC114T170S8RM

IGC11T120T8LIGBT4 Low Power ChipFeatures: Recommended for: 1200V Trench & Field stop technology low / medium power modules C low switching losses positive temperature coefficientApplications: easy paralleling low / medium power drives Qualified according to JEDEC for targetGapplications EChip Type VCE ICn1 ) Die Size PackageIGC11T120T8L 1200V 8A 3

 9.4. Size:70K  infineon
sigc11t60nc.pdf

IGC114T170S8RM
IGC114T170S8RM

SIGC11T60NC IGBT Chip in NPT-technology CFEATURES: This chip is used for: 600V NPT technology 100m chip IGBT Modules positive temperature coefficient easy paralleling Applications: GE drives Chip Type VCE ICn Die Size Package Ordering Code Q67050-A4158-SIGC11T60NC 600V 10A 3.25 x 3.25 mm2 sawn on foil A001 MECHANICAL PARAMETER: mm2 Ra

Datasheet: IGC100T65T8RM , IGC109T120T6RH , IGC109T120T6RL , IGC109T120T6RM , IGC10R60D , IGC10R60DE , IGC10T65QE , IGC114T170S8RH , IRGP4063 , IGC11T120T6L , APT33GF120LRD , IGC189T120T8RL , IGC189T120T6RL , IGC168T170S8RM , APT50GF120HR , IGC168T170S8RH , APT50GF120LR .

 

 
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