All MOSFET. SMG2340NE Datasheet

 

SMG2340NE Datasheet and Replacement


   Type Designator: SMG2340NE
   Type of Transistor: MOSFET
   Type of Control Channel: N -Channel
   Pd ⓘ - Maximum Power Dissipation: 1.3 W
   |Vds|ⓘ - Maximum Drain-Source Voltage: 40 V
   |Vgs|ⓘ - Maximum Gate-Source Voltage: 20 V
   |Id| ⓘ - Maximum Drain Current: 5.2 A
   Tj ⓘ - Maximum Junction Temperature: 150 °C
   tr ⓘ - Rise Time: 5 nS
   Rds ⓘ - Maximum Drain-Source On-State Resistance: 0.043 Ohm
   Package: SC59
 

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SMG2340NE Datasheet (PDF)

 ..1. Size:116K  secos
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SMG2340NE

SMG2340NE 5.2 A, 40 V, RDS(ON) 43 m N-Channel Enhancement MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen & lead-free SC-59 DESCRIPTION These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure Aminimal power loss and heat dissipation. Typical applications L3ar

 6.1. Size:136K  secos
smg2340n.pdf pdf_icon

SMG2340NE

SMG2340N 5.2 A, 40 V, RDS(ON) 43 m N-Channel Enhancement Mode Mos.FET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen and lead-free DESCRIPTION SC-59 These miniature surface mount MOSFETs utilize a High Cell Density trench process to provide Low RDS(on) and ensure ALminimal power loss and heat dissipation. Typical applications

 8.1. Size:355K  secos
smg2343pe.pdf pdf_icon

SMG2340NE

SMG2343PE -3.6 A, -30 V, RDS(ON) 57 m P-Channel Enhancement MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen & lead-free SC-59 DESCRIPTION These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC

 8.2. Size:359K  secos
smg2343p.pdf pdf_icon

SMG2340NE

SMG2343P -3.6 A, -30 V, RDS(ON) 0.057 P-Channel Enhancement MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen & lead-free SC-59 DESCRIPTION The miniature surface mount MOSFETs utilize a high cell density trench process To provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC

Datasheet: SMG2328S , SMG2329P , SMG2330N , SMG2334N , SMG2334NE , SMG2336N , SMG2339P , SMG2340N , SPP20N60C3 , SMG2342N , SMG2342NE , SMG2343 , SMG2343P , SMG2343PE , SMG2358N , SMG2359P , SMG2370N .

History: TMPF8N60AZ

Keywords - SMG2340NE MOSFET datasheet

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