All MOSFET. 4410 Datasheet

 

4410 Datasheet and Replacement


   Type Designator: 4410
   Marking Code: 4410
   Type of Transistor: MOSFET
   Type of Control Channel: N -Channel
   Pd ⓘ - Maximum Power Dissipation: 2.5 W
   |Vds|ⓘ - Maximum Drain-Source Voltage: 30 V
   |Vgs|ⓘ - Maximum Gate-Source Voltage: 20 V
   |Vgs(th)|ⓘ - Maximum Gate-Threshold Voltage: 2.5 V
   |Id| ⓘ - Maximum Drain Current: 10 A
   Tj ⓘ - Maximum Junction Temperature: 150 °C
   Qg ⓘ - Total Gate Charge: 8 nC
   Rds ⓘ - Maximum Drain-Source On-State Resistance: 0.014 Ohm
   Package: SOP8
 

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4410 Datasheet (PDF)

 ..1. Size:1064K  shenzhen
4410.pdf pdf_icon

4410

Shenzhen Tuofeng Semiconductor Technology co., LTD4410N-Channel Enhancement-Mode MOSFET (30V, 10A) PRODUCT SUMMARY VDSS ID RDS(on) (m-ohm) Max 13.5 @ VGS = 10V ,ID=10A 30V 10A 20 @ VGS = 4.5V,ID=5A Features Advanced Trench Process Technology High Density Cell Design for Ultra Low On-Resistance Lead free product is acquired Surface mount Package Pin 1 /

 ..2. Size:3593K  cn tuofeng
4410.pdf pdf_icon

4410

SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTDSOP-8 Plastic-Encapsulate MOSFETS 4410N-Channel Enhancement Mode Power MOSFET SO-8LDDDescription DDThe 4410 uses advanced trench technology to provide GGSexcellent RDS(ON) and low gate charge . The complementary S SSSMOSFETs may be used to form a level shifted high side SO-8 SPin 1switch, and for a host o

 0.1. Size:2143K  1
me4410ad.pdf pdf_icon

4410

ME4410ADwww.VBsemi.twN-Channel 20V (D-S) MOSFETFEATURESPRODUCT SUMMARY Halogen-freeVDS (V) RDS(on) ()ID (A)a Qg (Typ.) TrenchFET Power MOSFET0.012 at VGS = 10 V 1220 6.1 nC Optimized for High-Side Synchronous0.015 at VGS = 4.5 V 11Rectifier Operation 100 % Rg Tested 100 % UIS TestedAPPLICATIONS Notebook CPU Core- High-Side SwitchSO

 0.2. Size:667K  1
me4410a.pdf pdf_icon

4410

ME4410A N-Channel 30-V (D-S) MOSFET GENERAL DESCRIPTION FEATURES RDS(ON)18m@VGS=10V The ME4410A is the N-Channel logic enhancement mode power RDS(ON)20m@VGS=4.5V field effect transistors are produced using high cell density, DMOS Super high density cell design for extremely low RDS(ON) trench technology. This high density process is especially tailored

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