All MOSFET. G10N10 Datasheet

 

G10N10 Datasheet and Replacement


   Type Designator: G10N10
   Type of Transistor: MOSFET
   Type of Control Channel: N -Channel
   Pdⓘ - Maximum Power Dissipation: 3.1 W
   |Vds|ⓘ - Maximum Drain-Source Voltage: 100 V
   |Vgs|ⓘ - Maximum Gate-Source Voltage: 20 V
   |Id|ⓘ - Maximum Drain Current: 10 A
   Tjⓘ - Maximum Junction Temperature: 150 °C
   trⓘ - Rise Time: 14 nS
   Cossⓘ - Output Capacitance: 590 pF
   Rdsⓘ - Maximum Drain-Source On-State Resistance: 0.017 Ohm
   Package: SOP8
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G10N10 Datasheet (PDF)

 ..1. Size:2263K  goford
g10n10.pdf pdf_icon

G10N10

GOFORDG10N10.Description The G10N10. uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. It can be used in a wide variety of applications. General Features Schematic diagram RDS(ON) RDS(ON)VDSS @ @ID10V 4.5V (typ) (typ) 100V 14m 15m10AMarking and pin assignment Special process technology for high ESD cap

 0.1. Size:2546K  goford
g10n10a.pdf pdf_icon

G10N10

GOFORDG10N10ADescription The G10N10A uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. It can be used in a wide variety of applications. General Features Schematic diagram RDS(ON) RDS(ON)VDSS @ @ID10V 4.5V (typ) (typ) 100V 16m 18m10AMarking and pin assignment Special process technology for high ESD cap

 9.1. Size:241K  toshiba
tk65g10n1.pdf pdf_icon

G10N10

TK65G10N1MOSFETs Silicon N-channel MOS (U-MOS-H)TK65G10N1TK65G10N1TK65G10N1TK65G10N11. Applications1. Applications1. Applications1. Applications Switching Voltage Regulators2. Features2. Features2. Features2. Features(1) Low drain-source on-resistance: RDS(ON) = 3.8 m (typ.) (VGS = 10 V)(2) Low leakage current: IDSS = 10 A (max) (VDS = 100 V)(3) Enha

 9.2. Size:106K  fairchild semi
hgtg10n120bnd.pdf pdf_icon

G10N10

HGTG10N120BNDData Sheet December 200135A, 1200V, NPT Series N-Channel IGBT Featureswith Anti-Parallel Hyperfast Diode 35A, 1200V, TC = 25oCThe HGTG10N120BND is a Non-Punch Through (NPT) 1200V Switching SOA CapabilityIGBT design. This is a new member of the MOS gated high Typical Fall Time. . . . . . . . . . . . . . . . 140ns at TJ = 150oCvoltage switching IGBT famil

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History: WMM11N80M3 | RFP2N10L | IRFI7536G | AM2314NE | FDMS9620S

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