All MOSFET. FDZ202P Datasheet

 

FDZ202P Datasheet and Replacement


   Type Designator: FDZ202P
   Type of Transistor: MOSFET
   Type of Control Channel: P -Channel
   Pd ⓘ - Maximum Power Dissipation: 2 W
   |Vds|ⓘ - Maximum Drain-Source Voltage: 20 V
   |Vgs|ⓘ - Maximum Gate-Source Voltage: 12 V
   |Id| ⓘ - Maximum Drain Current: 5.5 A
   Tj ⓘ - Maximum Junction Temperature: 150 °C
   tr ⓘ - Rise Time: 9 nS
   Cossⓘ - Output Capacitance: 258 pF
   Rds ⓘ - Maximum Drain-Source On-State Resistance: 0.045 Ohm
   Package: SSOT-6
 

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FDZ202P Datasheet (PDF)

 ..1. Size:167K  fairchild semi
fdz202p.pdf pdf_icon

FDZ202P

January 2004 FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced 2.5V specified 5.5 A, 20 V. RDS(ON) = 45 m @ VGS = 4.5 V PowerTrench process with state of the art BGA RDS(ON) = 75 m @ VGS = 2.5 V packaging, the FDZ202P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a

 9.1. Size:217K  fairchild semi
fdz206p.pdf pdf_icon

FDZ202P

February 2006 FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced 2.5V specified 13 A, 20 V. rDS(on) = 9.5 m @ VGS = 4.5 V PowerTrench process with state of the art BGA rDS(on) = 14.5 m @ VGS = 2.5 V packaging, the FDZ206P minimizes both PCB space and rDS(on). This BGA M

 9.2. Size:193K  fairchild semi
fdz208p.pdf pdf_icon

FDZ202P

February 2006 FDZ208P P-Channel 30 Volt PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced 30 Volt P-Channel 12.5 A, 30 V. rDS(on) = 10.5 m @ VGS = 10 V Trench II Process with 25 Volts Vgs. Abs. Max Gate rDS(on) = 16.5 m @ VGS = 4.5 V Rating for the ultimate low rDS(on) Battery Protection MOSFET. Th

 9.3. Size:170K  fairchild semi
fdz209n.pdf pdf_icon

FDZ202P

May 2004 FDZ209N 60V N-Channel PowerTrench BGA MOSFET General Description Features Combining Fairchilds advanced PowerTrench process 4 A, 60 V. RDS(ON) = 80 m @ VGS = 5 V with state-of-the-art BGA packaging, the FDZ209N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging Occupies only 5 mm2 of PCB area: only 55% of the

Datasheet: FDW254P , FDW254PZ , FDW256P , FDW258P , FDW262P , FDW264P , FDW6923 , FDZ201N , IRF520 , FDZ204P , FDZ206P , FDZ208P , FDZ209N , FDZ291P , FDZ293P , FDZ294N , FDZ298N .

History: TSM2308CX | APT47N60BCFG | 2SK1954-Z | SSM3K335R | CS50N06P | SQS460EN | NCV8408

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