VN2406D
MOSFET. Datasheet pdf. Equivalent
Type Designator: VN2406D
Type of Transistor: MOSFET
Type of Control Channel: N
-Channel
Pdⓘ
- Maximum Power Dissipation: 20
W
|Vds|ⓘ - Maximum Drain-Source Voltage: 240
V
|Vgs|ⓘ - Maximum Gate-Source Voltage: 20
V
|Vgs(th)|ⓘ - Maximum Gate-Threshold Voltage: 2
V
|Id|ⓘ - Maximum Drain Current: 1.12
A
Tjⓘ - Maximum Junction Temperature: 150
°C
trⓘ - Rise Time: 8
nS
Cossⓘ -
Output Capacitance: 50
pF
Rdsⓘ - Maximum Drain-Source On-State Resistance: 6
Ohm
Package:
TO-220AB
VN2406D
Datasheet (PDF)
..1. Size:54K vishay
tn2410l vn2406d vn2406l vn2410ls.pdf
TN2410L, VN2406D/L, VN2410L/LSVishay SiliconixN-Channel 240-V (D-S) MOSFETsPRODUCT SUMMARYPart Number V(BR)DSS Min (V) rDS(on) Max (W) VGS(th) (V) ID (A)TN2410L 10 @ VGS = 4.5 V 0.5 to 1.8 0.18VN2406D 6 @ VGS = 10 V 0.8 to 2 1.12VN2406L 240 6 @ VGS = 10 V 0.8 to 2 0.18VN2410L 10 @ VGS = 10 V 0.8 to 2 0.18VN2410LS 10 @ VGS = 10 V 0.8 to 2 0.19FEATURES BENEFITS APPLICATIONSD
0.1. Size:64K vishay
tn2410l vn2406d-l vn2410l-ls.pdf
TN2410L, VN2406D/L, VN2410L/LSVishay SiliconixN-Channel 240-V (D-S) MOSFETsPRODUCT SUMMARYPart Number V(BR)DSS Min (V) rDS(on) Max (W) VGS(th) (V) ID (A)TN2410L 10 @ VGS = 4.5 V 0.5 to 1.8 0.18VN2406D 6 @ VGS = 10 V 0.8 to 2 1.12VN2406L 240 6 @ VGS = 10 V 0.8 to 2 0.18VN2410L 10 @ VGS = 10 V 0.8 to 2 0.18VN2410LS 10 @ VGS = 10 V 0.8 to 2 0.19FEATURES BENEFITS APPLICATIONSD
8.1. Size:56K motorola
vn2406l.rev1.pdf
MOTOROLAOrder this documentSEMICONDUCTOR TECHNICAL DATAby VN2406L/DTMOS FET TransistorVN2406L3 DRAINNChannel EnhancementMotorola Preferred Device2GATE1 SOURCEMAXIMUM RATINGSRating Symbol Value UnitDrainSource Voltage VDSS 240 Vdc 123DrainGate Voltage VDGR 60 VdcGateSource VoltageCASE 2904, STYLE 22 Continuous VGS 20 VdcTO92 (
8.2. Size:546K supertex
vn2406.pdf
Supertex inc. VN2406N-Channel Enhancement-ModeVertical DMOS FETFeatures General Description Free from secondary breakdown This enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and Supertexs well-proven, Low power drive requirementsilicon-gate manufacturing process. This combination Ease of parallelingproduces a device with the power h
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