30N20A Datasheet and Replacement
Type Designator: 30N20A
Type of Transistor: MOSFET
Type of Control Channel: N
-Channel
Pd ⓘ
- Maximum Power Dissipation: 300
W
|Vds|ⓘ - Maximum Drain-Source Voltage: 200
V
|Vgs|ⓘ - Maximum Gate-Source Voltage: 20
V
|Id| ⓘ - Maximum Drain Current: 30
A
Tj ⓘ - Maximum Junction Temperature: 150
°C
tr ⓘ - Rise Time: 190
nS
Cossⓘ -
Output Capacitance: 700
pF
Rds ⓘ - Maximum Drain-Source On-State Resistance: 0.085
Ohm
Package: LCC
-
MOSFET ⓘ Cross-Reference Search
30N20A Datasheet (PDF)
..1. Size:34K microsemi
30n20a.pdf 
2830 S. Fairview St.Santa Ana, CA 92704PH: (714) 979-8220 MSAER30N20AFAX: (714) 966-5256MSAFR30N20AFeatures200 Volts Ultrafast rectifier in parallel with the body diode (MSAE type only)30 Amps Rugged polysilicon gate cell structure Increased Unclamped Inductive Switching (UIS) capability85 m Hermetically sealed, surface mount power package Low pa
0.1. Size:42K microsemi
msaer30n20a msafr30n20a.pdf 
2830 S. Fairview St.Santa Ana, CA 92704PH: (714) 979-8220 MSAER30N20AFAX: (714) 966-5256MSAFR30N20AFeatures200 Volts Ultrafast rectifier in parallel with the body diode (MSAE type only)30 Amps Rugged polysilicon gate cell structure Increased Unclamped Inductive Switching (UIS) capability85 m Hermetically sealed, surface mount power package Low pa
9.1. Size:138K international rectifier
irfs30n20d.pdf 
PD- 93832IRFB30N20D IRFS30N20DSMPS MOSFETIRFL30N20DHEXFET Power MOSFETApplicationsVDSS RDS(on) max ID High frequency DC-DC converters200V 0.082 30ABenefits Low Gate-to-Drain Charge to ReduceSwitching Losses Fully Characterized Capacitance IncludingEffective COSS to Simplify Design, (SeeApp. Note AN1001)TO-220AB D2Pak TO-262 Fully Characterized Avalanche Vo
9.2. Size:311K st
stw30n20.pdf 
STP30NF20STW30NF20N-channel 200V - 0.065 - 30A - TO-220/TO-247Low gate charge STripFET Power MOSFETGeneral featuresType VDSS RDS(on) ID PTOTSTP30NF20 200V 0.075 30A 125WSTW30NF20 200V 0.075 30A 125W Gate charge minimized 3 32 21 1 100% avalanche testedTO-220TO-247 Excellent figure of merit (RDS*Qg) Very good manufactuing repeability Ver
9.3. Size:285K rohm
rnd030n20.pdf 
RND030N20Nch 200V 3.0A Power MOSFET DatasheetOutlineVDSS200VCPT3(SC-63)RDS(on) (Max.)870m(3)ID3.0A(2)(1)PD20WFeatures Inner circuit(3) 1) Low on-resistance.1*(1) Gate2) Fast switching speed.(2) Drain(1) 3) Drive circuits can be simple.(3) Source2*4) Parallel use is easy.1 ESD PROTECTION DIODE2 BODY DIODE
9.4. Size:139K ixys
ixfk230n20t ixfx230n20t.pdf 
Advance Technical InformationGigaMOSTM VDSS = 200VIXFK230N20TID25 = 230APower MOSFETIXFX230N20T RDS(on) 7.5m trr 200nsN-Channel Enhancement ModeAvalanche RatedFast Intrinsic DiodeTO-264 (IXFK)Symbol Test Conditions Maximum RatingsVDSS TJ = 25C to 175C 200 VGDVDGR TJ = 25C to 175C, RGS = 1M
9.5. Size:126K ixys
ixth130n20t.pdf 
Preliminary Technical InformationIXTH130N20T VDSS = 200VTrenchHVTMID25 = 130APower MOSFET RDS(on) 16m N-Channel Enhancement ModeAvalanche RatedSymbol Test Conditions Maximum RatingsTO-247VDSS TJ = 25C to 175C 200 VVDGR TJ = 25C to 175C; RGS = 1M 200 VVGSM Transient 30 VID25 TC = 25C 130 AILRMS Lead Current Limit, RMS
9.6. Size:170K ixys
ixtq130n20t.pdf 
TrenchTM VDSS = 200VIXTQ130N20TID25 = 130APower MOSFETIXTH130N20T RDS(on) 16m N-Channel Enhancement Mode TO-3P (IXTQ)Avalanche RatedFast Intrinsic RectifierGDSTabSymbol Test Conditions Maximum RatingsTO-247 ( IXTH)VDSS TJ = 25C to 175C 200 VVDGR TJ = 25C to 175C, RGS = 1M 200 VVGSS Continuous 20 VVGS
9.7. Size:180K ixys
mmix1f230n20t.pdf 
Advance Technical InformationGigaMOSTM TrenchTMVDSS = 200VMMIX1F230N20THiperFETTMID25 = 168A Power MOSFET RDS(on) 8.3m trr 200ns(Electrically Isolated Tab)DN-Channel Enhancement ModeGAvalanche RatedFast Intrinsic DiodeSSymbol Test Conditions Maximum Ratings Isolated TabVDSS TJ = 25C to 175C 200 V
9.8. Size:143K ixys
ixfn230n20t.pdf 
Advance Technical InformationGigaMOSTM VDSS = 200VIXFN230N20TID25 = 230APower MOSFET RDS(on) 7.5m trr 200nsN-Channel Enhancement ModeAvalanche RatedminiBLOC, SOT-227Fast Intrinsic DiodeE153432SSymbol Test Conditions Maximum RatingsGVDSS TJ = 25C to 175C 200 VVDGR TJ = 25C to 175C, RGS = 1M
9.9. Size:78K onsemi
ntb30n20.pdf 
NTB30N20Power MOSFET30 Amps, 200 VoltsN-Channel Enhancement-Mode D2PAKhttp://onsemi.comFeatures Source-to-Drain Diode Recovery Time Comparable to a DiscreteVDSS RDS(ON) TYP ID MAXFast Recovery Diode Avalanche Energy Specified200 V 68 mW @ VGS = 10 V 30 A IDSS and RDS(on) Specified at Elevated Temperature Mounting Information Provided for the D2PAK PackageN-
9.10. Size:158K onsemi
ntp30n20 ntp30n20g.pdf 
NTP30N20Preferred DevicePower MOSFET30 Amps, 200 VoltsN-Channel Enhancement-Mode TO-220http://onsemi.comFeatures Source-to-Drain Diode Recovery Time Comparable to a Discrete30 AMPERESFast Recovery Diode200 VOLTS Avalanche Energy Specified68 mW @ VGS = 10 V (Typ) IDSS and RDS(on) Specified at Elevated Temperature Pb-Free Package is Available*N-ChannelD
9.11. Size:138K secos
ssrf30n20-400.pdf 
SSRF30N20-400 23A, 200V, RDS(ON) 400m N-Ch Enhancement Mode Power MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen free DESCRIPTION These miniature surface mount MOSFETs utilize a high cell density trench ITO-220process to provide Low RDS(on) and to ensure minimal power loss and heat B Ndissipation. Typical applications are DC-
9.12. Size:307K analog power
am30n20-400pcfm.pdf 
Analog Power AM30N20-400PCFMN-Channel 200-V (D-S) MOSFET PRODUCT SUMMARYKey Features: rDS(on) (m)VDS (V) ID(A) Low r trench technology DS(on)400 @ VGS = 10V9 Low thermal impedance 200450 @ VGS = 5.5V8.5 Fast switching speed Typical Applications: PoE Power Sourcing Equipment PoE Powered Devices Telecom DC/DC converters White LED bo
9.13. Size:85K analog power
am30n20-78d.pdf 
Analog Power AM30N20-78DN-Channel 200-V (D-S) MOSFETThese miniature surface mount MOSFETs utilize a PRODUCT SUMMARYhigh cell density trench process to provide low VDS (V) rDS(on) m() ID (A)rDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC 78 @ VGS = 10V 21converters and power management in portable and 20092 @ VGS = 5.5V 20bat
9.14. Size:341K cystek
mte130n20fp.pdf 
Spec. No. : C966FP Issued Date : 2014.05.13 CYStech Electronics Corp.Revised Date : 2014.05.15 Page No. : 1/ 8 N-Channel Enhancement Mode Power MOSFETMTE130N20FP BVDSS 200VID @ VGS=10V 17ARDS(ON)@VGS=10V, ID=9A 150 m(typ) Features Simple Drive Requirement Low Gate Charge Fast Switching Characteristic Insulating package, front/back side insulating v
9.15. Size:394K cystek
mte130n20kj3.pdf 
Spec. No. : C952J3 Issued Date : 2014.02.27 CYStech Electronics Corp.Revised Date : 2014.03.05 Page No. : 1/9 N-Channel Enhancement Mode Power MOSFET MTE130N20KJ3 BVDSS 200VID 18A142m RDSON(TYP) @ VGS=10V, ID=9A Features Low Gate Charge Simple Drive Requirement ESD Diode Protected Gate Fast Switching Characteristic Pb-free lead plating and
9.16. Size:296K cystek
mte130n20kfp.pdf 
Spec. No. : C952FP Issued Date : 2013.12.24 CYStech Electronics Corp.Revised Date : Page No. : 1/ 8 N-Channel Enhancement Mode Power MOSFETMTE130N20KFP BVDSS 200VID @ VGS=10V 17ARDS(ON)@VGS=10V, ID=9A 134 m(typ) Features ESD protected Simple Drive Requirement Low Gate Charge Fast Switching Characteristic Insulating package, front/back side in
9.17. Size:369K cystek
mte130n20j3.pdf 
Spec. No. : C966J3 Issued Date : 2014.12.23 CYStech Electronics Corp.Revised Date : Page No. : 1/9 N-Channel Enhancement Mode Power MOSFET BVDSS 200VMTE130N20J3 ID@VGS=10V, TC=25C 18A ID@VGS=10V, TA=25C 1.9A 156m RDSON(TYP) @ VGS=10V, ID=9A Features Low Gate Charge Simple Drive Requirement Fast Switching Characteristic Pb-free lead pla
9.18. Size:337K cystek
mte130n20kf3.pdf 
Spec. No. : C952F3 Issued Date : 2014.06.03 CYStech Electronics Corp.Revised Date : Page No. : 1/9 N-Channel Enhancement Mode Power MOSFET MTE130N20KF3 BVDSS 200VID 18A143m RDSON(TYP) @ VGS=10V, ID=9A Features Low Gate Charge Simple Drive Requirement ESD Diode Protected Gate Fast Switching Characteristic Pb-free lead plating and RoHS compli
9.19. Size:355K cystek
mte130n20ke3.pdf 
Spec. No. : C952E3 Issued Date : 2013.12.27 CYStech Electronics Corp.Revised Date : 2014.03.05 Page No. : 1/8 N-Channel Enhancement Mode Power MOSFET MTE130N20KE3 BVDSS 200VID 18A143m RDSON(TYP) @ VGS=10V, ID=9A Features Low Gate Charge Simple Drive Requirement ESD Diode Protected Gate Fast Switching Characteristic RoHS compliant package
9.20. Size:4018K goford
g30n20k g30n20t g30n20f.pdf 
GOFORDG30N20Description The G30N20 uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. It can be used in a wide variety of applications. General Features VDSS RDS(ON) ID @10V (Typ)200V 62m 30A Schematic diagram High density cell design for ultra low Rdson Fully characterized avalanche voltage and current
9.21. Size:22K shaanxi
wvm30n20.pdf 
Shaanxi Qunli Electric Co., Ltd Add.:No. 1 Qunli Road,Baoji City,Shaanxi,China WVM30N20Power MOSFET(N-channel) TransistorFeatures: 1. Its voltage control component with good input impedance, small starting power dissipation, wide area of safe operation, good temperature stability. 2. Implementation of standards: GJB33A-97, QZJ840611 3. Use for high speed switch, circuit of powe
9.22. Size:1479K cn vbsemi
30n20.pdf 
30N20www.VBsemi.twN-Channel 200 V (D-S) MOSFETFEATURESPRODUCT SUMMARY TrenchFET Power MOSFETSVDS (V) RDS(on) () ID (A) Qg (Typ) 175 C Junction TemperatureRoHS0.060 at VGS = 10 V COMPLIANT 40 New Low Thermal Resistance Package200 950.070 at VGS = 6 V38.7 Compliant to RoHS Directive 2002/95/ECAPPLICATIONSTO-220AB IndustrialDGG D S
9.23. Size:5229K cn apm
ap130n20mp.pdf 
AP130N20MP 200V N-Channel Enhancement Mode MOSFET Description The AP130N20P is silicon N-channel Enhanced VDMOSFETs, is obtained by the self-aligned planar Technology which reduce the conduction loss, improve switching performance and enhance the avalanche energy. The transistor can be used in various power switching circuit for system miniaturization and higher efficiency. G
9.24. Size:1255K cn apm
ap30n20p.pdf 
AP30N20P 200V N-Channel Enhancement Mode MOSFET Description The AP30N20P is silicon N-channel Enhanced VDMOSFETs, is obtained by the self-aligned planar Technology which reduce the conduction loss, improve switching performance and enhance the avalanche energy. The transistor can be used in various power switching circuit for system miniaturization and higher efficiency. Gener
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History: SE1003
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