NTHD4508N
MOSFET. Datasheet pdf. Equivalent
Type Designator: NTHD4508N
Marking Code: C8*
Type of Transistor: MOSFET
Type of Control Channel: N
-Channel
Pdⓘ
- Maximum Power Dissipation: 1.13
W
|Vds|ⓘ - Maximum Drain-Source Voltage: 20
V
|Vgs|ⓘ - Maximum Gate-Source Voltage: 12
V
|Vgs(th)|ⓘ - Maximum Gate-Threshold Voltage: 1.2
V
|Id|ⓘ - Maximum Drain Current: 3
A
Tjⓘ - Maximum Junction Temperature: 150
°C
Qgⓘ - Total Gate Charge: 2.6
nC
trⓘ - Rise Time: 15
nS
Cossⓘ -
Output Capacitance: 80
pF
Rdsⓘ - Maximum Drain-Source On-State Resistance: 0.075
Ohm
Package: CHIPFET8
NTHD4508N
Transistor Equivalent Substitute - MOSFET Cross-Reference Search
NTHD4508N
Datasheet (PDF)
..1. Size:120K onsemi
nthd4508n.pdf
NTHD4508NMOSFET Power, Dual,N-Channel, ChipFET20 V, 4.1 AFeatureshttp://onsemi.com Low RDS(on) and Fast Switching Speed Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6V(BR)DSS RDS(on) TYP ID MAX Excellent Thermal Capabilities Where Heat Transfer is Required Pb-Free Package is Available 60 mW @ 4.5 V20 V 4.1 A80 mW @ 2.5 VApplications
0.1. Size:55K onsemi
nthd4508n-d.pdf
NTHD4508NPower MOSFET20 V, 4.1 A, Dual N-Channel ChipFETtFeatures Low RDS(on) and Fast Switching Speed Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6http://onsemi.com Excellent Thermal Capabilities Where Heat Transfer is Required Pb-Free Package is AvailableV(BR)DSS RDS(on) TYP ID MAXApplications60 mW @ 4.5 V20 V 4.1 A DC-DC Buck/Boost Co
7.1. Size:67K onsemi
nthd4502n-d.pdf
NTHD4502NPower MOSFET30 V, 3.9 A, Dual N-Channel ChipFETtFeatures Planar Technology Device Offers Low RDS(on) and Fast Switching Speed Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6.http://onsemi.comIdeal Device for Applications Where Board Space is at a Premium. ChipFET Package Exhibits Excellent Thermal Capabilities. Ideal forV(BR)DSS RDS(on) TYP ID
7.2. Size:105K onsemi
nthd4502n.pdf
NTHD4502NPower MOSFET30 V, 3.9 A, Dual N-Channel ChipFETtFeatures Planar Technology Device Offers Low RDS(on) and Fast Switching Speed Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6.http://onsemi.comIdeal Device for Applications Where Board Space is at a Premium. ChipFET Package Exhibits Excellent Thermal Capabilities. Ideal forV(BR)DSS RDS(on) TYP ID
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