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IXGH30N60B VCES = 600 V HiPerFASTTM IGBT IXGT30N60B IC25 = 60 A VCE(sat) = 1.8 V tfi = 100 ns Symbol Test Conditions Maximum Ratings TO-247 AD (IXGH) VCES TJ = 25 C to 150 C 600 V VCGR TJ = 25 C to 150 C; RGE = 1 MW 600 V VGES Continuous 20 V C (TAB) G C VGEM Transient 30 V E IC25 TC = 25 C60 A IC110 TC = 110 C30 A TO-268 (D3) ICM TC = 25 C, 1 ms 120 A (IXGT) SSOA VGE= 15 V, TVJ = 125 C, RG = 33 W ICM = 60 A G (RBSOA) Clamped inductive load, L = 100 mH @ 0.8 VCES (TAB) E PC TC = 25 C 200 W TJ -55 ... +150 C TJM 150 C G = Gate, C = Collector, E = Emitter, TAB = Collector Tstg -55 ... +150 C Maximum lead temperature for soldering 300 C Features 1.6 mm (0.062 in.) from case for 10 s International standard packages Md Mounting torque (M3) 1.13/10 Nm/lb.in. JEDEC TO-268 surface mountable and JEDEC TO-247 AD Weight 6 g High c