NTHD4N02FPower MOSFET andSchottky Diode20 V, 3.9 A, N-Channel, with 3.7 ASchottky Barrier Diode, ChipFETthttp://onsemi.comFeatures Leadless SMD Package Featuring a MOSFET and Schottky DiodeMOSFET 40% Smaller than TSOP-6 Package with Better ThermalsV(BR)DSS RDS(on) TYP ID MAX Super Low Gate Charge MOSFET60 mW @ 4.5 V Ultra Low VF Schottky 20 V 3.9 A80 mW @

NTHD4P02FPower MOSFET andSchottky Diode-20 V, -3.0 A, Single P-Channel with3.0 A Schottky Barrier Diode, ChipFETtFeatureshttp://onsemi.com Leadless SMD Package Featuring a MOSFET and Schottky DiodeMOSFET 40% Smaller than TSOP-6 Package with Similar ThermalV(BR)DSS RDS(on) TYP ID MAXCharacteristics-130 mW @ -4.5 V Independent Pinout to each Device to Ease Circu

NTHD4401PPower MOSFET-20 V, -3.0 A, Dual P-Channel, ChipFETtFeatures Low RDS(on) and Fast Switching Speed in a ChipFET Packagehttp://onsemi.com Leadless ChipFET Package 40% Smaller Footprint than TSOP-6 ChipFET Package with Excellent Thermal Capabilities where HeatTransfer is RequiredV(BR)DSS RDS(on) TYP ID MAX Pb-Free Package is Available130 mW @ -4.5 V-20 V

NTHD4502NPower MOSFET30 V, 3.9 A, Dual N-Channel ChipFETtFeatures Planar Technology Device Offers Low RDS(on) and Fast Switching Speed Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6.http://onsemi.comIdeal Device for Applications Where Board Space is at a Premium. ChipFET Package Exhibits Excellent Thermal Capabilities. Ideal forV(BR)DSS RDS(on) TYP ID

NTHD4502NPower MOSFET30 V, 3.9 A, Dual N-Channel ChipFETtFeatures Planar Technology Device Offers Low RDS(on) and Fast Switching Speed Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6.http://onsemi.comIdeal Device for Applications Where Board Space is at a Premium. ChipFET Package Exhibits Excellent Thermal Capabilities. Ideal forV(BR)DSS RDS(on) TYP ID

NTHD4508NMOSFET Power, Dual,N-Channel, ChipFET20 V, 4.1 AFeatureshttp://onsemi.com Low RDS(on) and Fast Switching Speed Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6V(BR)DSS RDS(on) TYP ID MAX Excellent Thermal Capabilities Where Heat Transfer is Required Pb-Free Package is Available 60 mW @ 4.5 V20 V 4.1 A80 mW @ 2.5 VApplications

NTHD4P02FPower MOSFET andSchottky Diode-20 V, -3.0 A, Single P-Channel with3.0 A Schottky Barrier Diode, ChipFETtFeatureshttp://onsemi.com Leadless SMD Package Featuring a MOSFET and Schottky DiodeMOSFET 40% Smaller than TSOP-6 Package with Similar ThermalV(BR)DSS RDS(on) TYP ID MAXCharacteristics-130 mW @ -4.5 V Independent Pinout to each Device to Ease Circu

NTHD4508NPower MOSFET20 V, 4.1 A, Dual N-Channel ChipFETtFeatures Low RDS(on) and Fast Switching Speed Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6http://onsemi.com Excellent Thermal Capabilities Where Heat Transfer is Required Pb-Free Package is AvailableV(BR)DSS RDS(on) TYP ID MAXApplications60 mW @ 4.5 V20 V 4.1 A DC-DC Buck/Boost Co

NTHD4102PPower MOSFET-20 V, -4.1 A, Dual P-Channel ChipFETtFeatures Offers an Ultra Low RDS(ON) Solution in the ChipFET Package http://onsemi.com Miniature ChipFET Package 40% Smaller Footprint than TSOP-6V(BR)DSS RDS(ON) TYP ID MAX Low Profile (