630/F630/I630/E630/B630/D6309A 200V N-channel Enhancement Mode Power MOSFET1 DescriptionThese N-channel enhanced vdmosfets, is obtained by the2 DV = 200Vself-aligned planar technology which reduce the conduction DSSloss, improve switching performance and enhance theR = 0.23DS(on) (TYP)Gavalanche energy. Which accords with the RoHS standard.1I = 9A3 S D2 Feature

April 2000TMQFETQFETQFETQFET 200V N-ChanneI MOSFETGeneraI Description FeaturesThese N-Channel enhancement mode power field effect 7A, 200V, RDS(on) = 0.4 @VGS = 10 Vtransistors are produced using Fairchilds proprietary, Low gate charge ( typical 19 nC)planar stripe, DMOS technology. Low Crss ( typical 35 pF)This advanced technology has b

NIMD6302R2HDPlus Dual N-ChannelSelf-protected Field EffectTransistors with 1:200Current Mirror FEThttp://onsemi.comHDPlus devices are an advanced series of power MOSFET whichutilize ON Semiconductors latest MOSFET technology process toachieve the lowest possible on-resistance per silicon area while5.0 AMPERESincorporating smart features. They are capable of withstanding h

CED630N/CEU630NN-Channel Enhancement Mode Field Effect TransistorFEATURES200V, 7.5A, RDS(ON) = 0.36 @VGS = 10V.Super high dense cell design for extremely low RDS(ON).High power and current handing capability.DLead free product is acquired.TO-251 & TO-252 package.D GGSCEU SERIESCED SERIESSTO-252(D-PAK)TO-251(I-PAK)ABSOLUTE MAXIMUM RATINGS Tc = 25 C unless oth

BRD630(BRCS630D) Rev.C Feb.-2015 DATA SHEET / Descriptions TO-252 N MOS N-CHANNEL MOSFET in a TO-252 Plastic Package. / Features ,,Low gate charge, low crss, fast switching. / Applications DC/DC These devices are well suited for high e

SEMICONDUCTORBRD630TECHNICAL DATAN-Channel Power MOSFET AICJGENERAL DESCRIPTION DIM MILLIMETERSThis advanced high voltage MOSFET is designed to stand high A 6 50 0 2B 5 60 0 2C 5 20 0 2energy in the avalanche mode and switch efficiently. D 1 50 0 2E 2 70 0 2F 2 30 0 1This new high energy device also offers a drainHH 1 00 MAXI 2 30

N N-CHANNEL MOSFET FHU630A/FHD630A /FHP630A /FHF630A MAIN CHARACTERISTICS FEATURES ID 9A Low gate charge VDSS 200V Crss ( 24pF) Low Crss (typical 24pF ) Rdson-typ @Vgs=10V 0.3 Fast switching Qg-typ 12nC 100% 100% avalanche tested dv/d

SW630D N-channel Enhanced mode TO-220/TO-252 MOSFET Features TO-220 TO-252 BVDSS : 200V High ruggedness ID : 9A Low RDS(ON) (Typ 0.27)@VGS=10V RDS(ON) : 0.27 Low Gate Charge (Typ 20nC) Improved dv/dt Capability 2 100% Avalanche Tested 1 1 2 2 Application:Synchronous Rectification, 3 3 DC-DC 1 1. Gate 2. Drain 3. Source 3 G

SAMWIN SW630N-channel MOSFETTO-220F TO-220 TO-252FeaturesBVDSS : 200V High ruggednessID : 10A RDS(ON) (Max 0.4 )@VGS=10V Gate Charge (Typ 20nC)RDS(ON) : 0.4ohm1 Improved dv/dt Capability 2 100% Avalanche Tested1 132 23 321. Gate 2. Drain 3. SourceGeneral Description1This power MOSFET is produced with advanced VDMOS technology of SAMW

SW630D N-channel Enhanced mode TO-220/TO-252 MOSFET Features TO-220 TO-252 BVDSS : 200V High ruggedness ID : 9A Low RDS(ON) (Typ 0.27)@VGS=10V RDS(ON) : 0.27 Low Gate Charge (Typ 20nC) Improved dv/dt Capability 2 100% Avalanche Tested 1 1 2 2 Application:Synchronous Rectification, 3 3 DC-DC 1 1. Gate 2. Drain 3. Source 3 G

Dec 2012BVDSS = 200 VRDS(on) typ HFD630 / HFU630ID = 7.2 A200V N-Channel MOSFETD-PAK I-PAK2FEATURES113 23 Originative New DesignHFD630 HFU630 Superior Avalanche Rugged Technology1.Gate 2. Drain 3. Source Robust Gate Oxide Technology Very Low Intrinsic Capacitances Excellent Switching Characteristics Unrivalled Gate Charge : 22 nC (Typ.)

TMD630Z(G)/TMU630Z(G) Features N-channel MOSFET Low gate charge BVDSS ID RDS(on)MAX 100% avalanche tested 200V 9A